Patterning method of nitride ceramic copper-clad plate and nitride ceramic copper-clad plate

A technology of nitride ceramics and copper clad laminates, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of poor state of the metal plate surface, reduced etching ability, slow etching rate, etc., and achieve the state of the plate surface Good, uniform etching, shortened etching time
CN106328544AInactive Publication Date: 2017-01-11ZHEJIANG TC CERAMIC ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG TC CERAMIC ELECTRONICS
Publication Date
2017-01-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a patterning method of a nitride ceramic copper-clad plate and a nitride ceramic copper-clad plate. The patterning method comprises the following steps: arranging a patterned anti-corrosion layer on the surface of the nitride ceramic copper-clad plate, wherein the nitride ceramic copper-clad plate is formed by an active brazing method; performing first etching treatment on the nitride ceramic copper-clad plate by using a first etching solution, wherein the first etching solution comprises a CuCl<2> solution or a FeCl<3> solution; performing second etching treatment on the nitride ceramic copper-clad plate being subjected to the first etching treatment by using a second etching solution; and performing third etching treatment on the nitride ceramic copper-clad plate being subjected to the second etching treatment by using a third etching solution. The patterning method has the advantages of high etching efficiency, uniform etching and freeness from residues; the etching quality is improved; and a metal layer has a good plate surface state.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor substrate preparation, in particular to a patterning method of a nitride ceramic copper clad laminate and a nitride ceramic copper clad laminate. Background technique

[0002] High-power modules are widely used in electric locomotives, electric vehicles, photovoltaic solar energy and other fields. As power modules become more integrated and more powerful, the heat generated by semiconductor devices is on the rise. At present, the practice of forming a ceramic circuit board by joining a metal plate with good electrical and thermal conductivity to a ceramic sintered body substrate with good insulation and heat dissipation such as aluminum nitride has been widely popularized. Due to its good thermal conductivity, ceramic circuit boards are widely used as lining boards of power modules to solve the heat dissipation problem of semiconductor devices.

[0003] So far, there are two main methods o...

Claims

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