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Preparation method of metal layer for electromagnetic shielding film

An electromagnetic shielding film and metal layer technology, which is applied in metal material coating process, coating, liquid chemical plating and other directions, can solve the problems of low preparation cost and inability to obtain a uniform and dense metal layer, and achieves low preparation cost, The effect of low production input cost and strong controllability

Active Publication Date: 2017-01-25
遂宁迪印科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Based on the foregoing, the present invention provides a method for preparing a metal layer for an electromagnetic shielding film. This preparation method can solve the problem of the inability to form a catalytically active layer in a good adhesion state due to the lack of pretreatment on the surface of the electromagnetic shielding substrate in the electroless plating process. , and then the problem that a uniform and dense metal layer cannot be obtained; it can realize a good combination with non-metallic electromagnetic shielding substrates and other difficult-to-plate substrates, and is especially suitable for solving the plating problem on the surface of complex cavities; the preparation cost of the present invention is low and controllable Strong, can be used in large-scale industrial production

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  • Preparation method of metal layer for electromagnetic shielding film
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  • Preparation method of metal layer for electromagnetic shielding film

Examples

Experimental program
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Effect test

Embodiment 1

[0034]Step A: Prepare a permanganate solution with a concentration of 0.1mol / L and a pH value of 13, heat it and keep it at 40°C, and immerse the electromagnetic shielding film substrate in the permanganate solution for 5 minutes;

[0035] Step B: prepare 400ml of sodium thiosulfate solution with a concentration of 0.05mol / L as the acceptor center solution, heat the solution and keep the temperature at 60°C, immerse the roughened electromagnetic shielding film substrate in this solution for self-assembly treatment for 10 Minutes; the self-assembled substrate has a strong ion adsorption effect;

[0036] Step C: Using a mixture of deionized water, ethanol and ethylene glycol as a solvent, prepare a silver nitrate solution with a concentration of 0.03 mol / L, keep the temperature of the solution at 25°C, and self-assemble the base with the acceptor center The material is immersed in this solution to absorb chemical deposition activated ions, and the treatment time is 10 minutes. ...

Embodiment 2

[0040] Step A: Prepare a permanganate solution with a concentration of 0.1mol / L and a pH value of 13, heat it and keep it at 40°C, and immerse the electromagnetic shielding film substrate in the permanganate solution for 5 minutes;

[0041] Step B: Prepare 400ml of thiourea solution with a concentration of 0.05mol / L as the acceptor center solution, heat the solution and keep the temperature at 60°C, immerse the roughened electromagnetic shielding film substrate in this solution for self-assembly treatment for 10 minutes; The substrate after self-assembly has a strong ion adsorption effect;

[0042] Step C: Using a mixture of deionized water and ethanol as a solvent, prepare a silver nitrate solution with a concentration of 0.02mol / L, keep the solution at a constant temperature of 40°C, and immerse the self-assembled substrate with acceptor centers in this solution The treatment is to adsorb chemical deposition to activate ions, and the treatment time is 10 minutes.

[0043] S...

Embodiment 3

[0045] Step A: Prepare a permanganate solution with a concentration of 0.08mol / L and a pH value of 13, heat it and keep it at 40°C, and immerse the electromagnetic shielding film substrate in the permanganate solution for 5 minutes;

[0046] Step B: Using a mixture of deionized water, ethanol and ethylene glycol as a solvent, prepare a silver nitrate solution with a concentration of 0.03mol / L, keep the solution at a constant temperature of 25°C, and immerse the substrate treated in step A This solution is treated to adsorb chemical deposition activated ions, and the treatment time is 10 minutes.

[0047] Step C: preparing a chemical copper precipitation solution, the concentration of each component of the chemical copper precipitation solution is as follows: copper sulfate 0.04mol / L, nickel sulfate 0.008mol / L, formaldehyde 0.16mol / L, potassium sodium tartrate 0.08mol / L, B Disodium diamine tetraacetate 0.006mol / L, potassium ferrocyanide 20mg / L, bipyridine 10mg / L; heat and keep ...

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Abstract

The invention discloses a preparation method of a metal layer for an electromagnetic shielding film and belongs to the technical field of electronic materials. The preparation method includes: soaking an electromagnetic shielding film substrate with the surface roughened in a receptor center solution to enable a receptor center to be closely assembled on the surface of the substrate; soaking adsorption activation ions, and putting the substrate based on the above treatment in chemical deposition liquid to grow the metal layer to finally obtain the metal layer for the electromagnetic shielding film. The metal layer which is uniform and compact can be prepared without using expensive equipment, and strong bonding between the metal layer and difficult-to-electroplate substrates like a nonmetallic electromagnetic shielding substrate can be realized. The preparation method is simple in process and low in production cost and can be used for large-scale industrial production of the electromagnetic shielding film.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a method for preparing a metal layer for an electromagnetic shielding film. Background technique [0002] With the rapid development of electronics and informatization, the volume of electronic products is getting smaller and smaller, the operating frequency is getting higher and higher, and the accompanying electromagnetic radiation is getting stronger and stronger; electromagnetic waves are irreplaceable as information transmission in current electronic information technology. Carriers intertwined with the electromagnetic radiation generated in the work of electronic or electrical equipment, leading to the deterioration of the electromagnetic environment of human living space, has become the fifth largest pollution source in nature after water pollution, air pollution, noise pollution and solid waste pollution , which seriously threatens human health an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/22C23C18/20C23C18/40
CPCC23C18/1641C23C18/165C23C18/2086C23C18/22C23C18/405
Inventor 冯哲圣张景万亚东陈金菊王焱
Owner 遂宁迪印科技有限公司
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