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High temperature-resistant printing tag based on polyimide and preparation method thereof

A polyimide, high temperature resistant technology, applied in the field of polyimide-based high temperature resistant printing labels and their preparation, can solve the problems of low temperature resistance, easy peeling off of the adhesive layer, adhesion, etc., and achieve thermal stability The effect of good performance, excellent printability and strong support

Inactive Publication Date: 2017-02-01
NANTONG KAIYING FILM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The application of traditional printing labels in some fields is not perfect, for example, it is used in the initial products that need to be processed by high temperature, such as metal processing, ceramics, etc., and its temperature resistance level is not high. After high temperature, the label is seriously deformed or adhered On the surface of the product, causing the product to turn black
In addition, the adhesive layer of ordinary label products is easy to fall off after transportation or long-term storage, which greatly restricts the application of printed labels

Method used

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  • High temperature-resistant printing tag based on polyimide and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0026] (1) Mix talcum powder, aluminum phosphate, polyvinyl alcohol and polyurea formaldehyde with a mass ratio of 1:4:1:0.5, then heat treat at 130°C for 5 minutes; heat treat at 255°C for 16 minutes after natural cooling; naturally cool Then heat treatment at 360°C for 15 minutes; then heat treatment at 605°C for 5 minutes; finally heat treatment at 775°C for 20 minutes; after natural cooling, ball mill to obtain porous inorganic particles; the size of porous inorganic particles is 320-380 nanometers, and the pore size is 180-220 Nano;

[0027] (2) Polyimide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, m-aminoacetanilide, The porous inorganic particles and 6-isopropyl-4-oxo-4H-1-benzopyran-3-carbaldehyde are sequentially added into the extruder, and the polyimide material layer is obtained through casting;

[0028] (3) Add bis(2,3-epoxycyclopentyl)ether, triethyl phosphite, bisphenol A cyanate monomer, octamethylsilsesquioxane into acetone, and stir under reflux for 22 m...

Embodiment 2

[0032] (1) Mix talcum powder, aluminum phosphate, polyvinyl alcohol and polyurea formaldehyde with a mass ratio of 1:4:1:0.5, then heat treat at 130°C for 8 minutes; heat treat at 255°C for 16 minutes after natural cooling; naturally cool Heat treatment at 360°C for 20 minutes; then heat treatment at 590°C for 5 minutes; finally heat treatment at 775°C for 20 minutes; after natural cooling, ball mill to obtain porous inorganic particles; the size of porous inorganic particles is 320-380 nanometers, and the pore size is 180-220 Nano;

[0033] (2) Polyimide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, m-aminoacetanilide, Porous inorganic particles and 6-isopropyl-4-oxo-4H-1-benzopyran-3-carbaldehyde are sequentially added to the extruder, and the polyimide material layer is obtained by casting; the porous inorganic particles are immersed in In the mixture of diglycidyl phthalate, pentaerythritol tetraacrylate and benzothiazole with a mass ratio of 1:3:0.1, take it out after 5...

Embodiment 3

[0038] (1) Mix talcum powder, aluminum phosphate, polyvinyl alcohol and polyurea formaldehyde with a mass ratio of 1:4:1:0.5, then heat treat at 135°C for 8 minutes; heat treat at 255°C for 15 minutes after natural cooling; naturally cool Then heat treatment at 375°C for 15 minutes; then heat treatment at 605°C for 8 minutes; finally heat treatment at 775°C for 28 minutes; after natural cooling, ball mill to obtain porous inorganic particles; the size of porous inorganic particles is 320-380 nanometers, and the pore size is 180-220 Nano;

[0039] (2) Polyimide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, m-aminoacetanilide, Porous inorganic particles and 6-isopropyl-4-oxo-4H-1-benzopyran-3-carbaldehyde are sequentially added to the extruder, and the polyimide material layer is obtained by casting; the porous inorganic particles are immersed in In the mixture of diglycidyl phthalate, pentaerythritol tetraacrylate and benzothiazole with a mass ratio of 1:3:0.1, take it out af...

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Abstract

The invention discloses a high temperature-resistant printing tag based on polyimide and a preparation method thereof. The high temperature-resistant printing tag comprises a substrate layer, a porous adhering layer and a function layer, wherein the substrate layer comprises a polyimide material layer and porous inorganic particles in polyimide material; the size of each porous inorganic particle is 320 to 380 nanometers, and the size of each pore is 180 to 220 nanometers; the porosity of the porous adhering layer is 38 to 45%; the porous adhering layer is positioned between the substrate layer and the function layer; the polyimide material is prepared from a polyimide composition; the polyimide composition is prepared by granulating polyimide, 2,5-dimethyl-2,5-bi(tert-butylperoxy) hexane, m-aminoacetanilide, 6-isopropyl-4-oxo-4H-1-chromene-3-formaldehyde, and porous inorganic particles. The high temperature-resistant printing tag has the advantages that the mechanical property is good, the heat stability is excellent, and the industrial application prospect is broad.

Description

technical field [0001] The invention belongs to the field of polyimide materials, and in particular relates to a polyimide-based high-temperature-resistant printing label and a preparation method thereof. Background technique [0002] With the development of science and technology, the amount of printable polyimide composite materials is increasing, and the use environment is becoming more and more harsh. The application of traditional printing labels in some fields is not perfect, for example, it is used in the initial products that need to be processed by high temperature, such as metal processing, ceramics, etc., the temperature resistance level is not high, after high temperature, the label is seriously deformed or adhered On the surface of the product, it causes the product to darken. In addition, the adhesive layer of ordinary label products is easy to fall off after being transported or stored for a long time, which greatly restricts the application of printed labels...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J4/06C09J4/02C09J11/06C09D183/08C08L79/08C08K13/04C08K5/14C08K5/20C08K7/26C08K5/1545C08K5/524C08K5/1515G09F3/02
CPCC09J4/06C08K5/14C08K5/1515C08K5/1545C08K5/20C08K5/524C08K7/26C08K13/04C08L2201/08C09D183/08C09J11/06G09F3/02C08F261/04C08L79/08
Inventor 陈亮赵广昊钟华春唐柏青程爱民赵继辉许建军刘晓恒赵继英
Owner NANTONG KAIYING FILM TECH