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Heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition, composite comprising same and composite patch repair method

A technology of curing resin and composite materials, which is applied in the direction of surface pretreatment bonding method, epoxy resin glue, adhesive type, etc., which can solve the problems of unpredictable, difficult durability of composite material bonding and repair, and performance degradation of repaired components And other problems, to achieve the effect of fast curing speed, improved heat and humidity resistance, and large curing thickness

Inactive Publication Date: 2017-02-01
QINGDAO CAMPUS AVIATION ENG COLLEGE OF THE PEOPLES LIBERATION ARMY NAVY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The durability of composite material bonding repair has always been a relatively difficult issue. During the use of repair components, they not only have to bear the effects of external loads, but also withstand the test of temperature, humidity, chemical media and other operating environments. Repair components in these The performance will gradually degrade over time under the influence of factors, and it is difficult to predict

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Weigh 80g of E44 epoxy resin, 2g of polyalkylaryl silicone resin, 3g of polyalkylaryl silicone resin, 1g of 4,4-dimethyl-diphenyliodonium hexafluorophosphate, benzoyl peroxide 1 g, added to the reaction vessel and mixed, stirred evenly to obtain a heat-and-humidity resistant organosilicon-modified ultraviolet resin composition.

[0037] The heat-and-moisture-resistant organosilicon-modified ultraviolet resin cured product of this embodiment can be obtained by irradiating the above-mentioned heat-and-humidity-resistant organosilicon-modified ultraviolet resin composition with ultraviolet light for 9-10 minutes.

[0038]The preparation method of the composite material comprising the heat-and-moisture resistant organosilicon-modified UV-curable resin composition of this example comprises the following steps:

[0039] Mix and react the components of the above-mentioned heat and humidity resistant silicone modified UV-curable resin composition evenly, and then apply it on an...

Embodiment 2

[0043] Weigh 40g of E51 epoxy resin, 50g of bis((3,4-epoxycyclohexyl)methyl)adipate, 15g of polyaryl silicone resin, 10g of epoxy modified silicone resin, diphenyl iodine Onium salt hexafluorophosphate 3g, azobisisobutyronitrile 2g, azobisisovaleronitrile 2g, benzophenone 0.5g, nano-TiO 2 Add 0.25 g of the filler into the reaction vessel for mixing, and stir evenly to obtain a heat-and-humidity resistant organosilicon-modified ultraviolet resin composition.

[0044] In this example, the preparation method of the composite material containing the heat-and-moisture-resistant silicone-modified UV-curable resin composition is the same as in Example 1, and every 100 g of the composite material contains 50 g of the heat-and-moisture-resistant silicone-modified UV-curable resin composition.

Embodiment 3

[0046] Weigh 30g of E44 epoxy resin, 70g of ERL4211 epoxy resin, 12g of polyalkyl silicone resin, 8g of polyaryl silicone resin, 10g of acrylic modified silicone resin, 2.5g of triphenylsulfonium salt, and 2.5g of triarylsulfide Onium salt 2.5g, benzoin isopropyl ether 0.5g, Michler's ketone 0.5g, nano-SiO 2 Filler 0.25g, nano CaCO 3 Add 0.25 g of the filler into the reaction vessel for mixing, and stir evenly to obtain a heat-and-humidity resistant organosilicon-modified ultraviolet resin composition.

[0047] In this example, the preparation method of the composite material containing the heat-and-moisture-resistant organosilicon-modified UV-curable resin composition is the same as in Example 1, and every 100 g of the composite material contains 65 g of the heat-and-moisture-resistant silicone-modified UV-curable resin composition.

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Abstract

The invention provides a heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition, a composite comprising the same and a composite patch repair method, and belongs to the field of photocuring technology and resin matrix composites. The heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition is prepared from, by weight, 80-100 parts of epoxy resin, 5-30 parts of organosilicone resin, 1-5 parts of cationic initiator, 1-5 parts of thermal initiator, 0-1 part of photosensitizer and 0-0.5 part of filler. According to the heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition, cationic polymerization is initiated under ultraviolet irradiation; decomposition of the thermal initiator can be promoted by heat release in polymerization, self-propagating curing from top to bottom under ultraviolet irradiation is achieved, the curing speed is high, the curing thickness is large, tests show that curing can be completed within 15 min when 5 layers of glass fiber cloth or 3 layers of carbon fiber cloth is laid, and the heat and moisture resistance of the composite and repair components thereof can be significantly improved.

Description

technical field [0001] The invention relates to the field of photocuring technology and resin-based composite materials, in particular to a moisture-heat-resistant organosilicon-modified ultraviolet-light-curable resin composition, a composite material containing it, and a repair method for a patch of the composite material. Background technique [0002] Compared with traditional repair methods, Fiber Reinforced Polymer (FRP) bonded and repaired damaged metal has obvious advantages such as small structural weight gain, slow stress concentration, good fatigue and corrosion resistance, and strong designability. Extensive research has been carried out in repairing defects in aluminum alloy sheets of aircraft and aircraft components and a series of applications have been obtained. At present, most composite materials are repaired by thermal curing. Due to the large difference in thermal expansion coefficient between composite materials and metal structures, residual thermal stre...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J183/04C09J11/04C09J5/02
CPCC09J163/00C08K3/22C08K2003/2241C08K2201/011C08L2201/08C08L2205/025C08L2205/03C08L2205/035C09J5/02C09J11/04C09J183/04C08L83/04C08L63/00C08K3/36C08K2003/265C08K2003/2227
Inventor 赵培仲余周辉戴京涛魏华凯胡芳友
Owner QINGDAO CAMPUS AVIATION ENG COLLEGE OF THE PEOPLES LIBERATION ARMY NAVY
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