Cyanide-free copper-plated electroplating solution suitable for wide pH range and wide current density range and preparation method for cyanide-free copper-plated electroplating solution

A technology of current density and cyanide-free copper plating, which is applied in the field of cyanide-free copper plating solution and its preparation, and the field of cyanide-free copper plating solution, which can solve the problems of poor bonding between the coating and the substrate, environmental pollution, and narrow pH range of the solution, etc. question

Active Publication Date: 2017-03-22
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a cyanide-free copper electroplating solution suitable for wide pH and wide current density range, which solves the serious environmental pollution caused by the existing cyanide-containing plating solution, and the cyanide-free plating so

Method used

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  • Cyanide-free copper-plated electroplating solution suitable for wide pH range and wide current density range and preparation method for cyanide-free copper-plated electroplating solution

Examples

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Effect test

Embodiment 1

[0021] Example 1:

[0022] A cyanide-free copper plating solution with wide pH and wide current density applicable range is prepared according to the following ratio.

[0023] Aminomethylene diphosphonic acid (AMDP) 70 g / L

[0024] Phytate (PA) 40 g / L

[0025] Potassium pyrophosphate 3 g / L

[0026] Copper sulfate pentahydrate 30 g / L

[0027] Potassium hydroxide 45 g / L

[0028] pH 6.5

[0029] Dissolve and mix the weighed methylene diphosphonic acid and copper sulfate pentahydrate with deionized water respectively, add potassium hydroxide solution while stirring and stir thoroughly, if the pH is too high due to the addition of potassium hydroxide, it can be adjusted to specified pH.

[0030] In the obtained solution, adjust the temperature of the solution to 30°C, and take the cathode current density as 1A / dm 2 Copper plating of about 5 microns is plated on a steel wire substrate with a diameter of Ф2 mm, and the electroplating time is 15 minutes. According to ASTM B452-...

Embodiment 2

[0032] A cyanide-free copper plating solution with wide pH and wide current density applicable range is prepared according to the following ratio.

[0033] Aminomethylene diphosphonic acid (AMDP) 50 g / L

[0034] Phytate (PA) 30 g / L

[0035] Potassium pyrophosphate 10 g / L

[0036] Copper sulfate pentahydrate 20 g / L

[0037] Potassium hydroxide 75 g / L

[0038] pH 9

[0039] Dissolve and mix the weighed methylene diphosphonic acid and copper chloride dihydrate with deionized water respectively, add sodium hydroxide solution during stirring and stir thoroughly, if the pH is too high due to the addition of potassium hydroxide, it can be adjusted with sulfuric acid to the specified pH.

[0040] In the obtained solution, adjust the temperature of the solution to 50°C, and take the cathode current density as 0.5A / dm 2 Copper plating of about 5 microns is plated on a steel wire substrate with a diameter of Ф2 mm, and the electroplating time is 30 minutes. According to ASTM B452-200...

Embodiment 3

[0042] Prepare a cyanide-free copper plating electroplating solution with a wide pH range according to the following ratio

[0043] Aminomethylene diphosphonic acid (AMDP) 80 g / L

[0044] Sodium Phytate 35 g / L

[0045] Potassium pyrophosphate 1 g / L

[0046] Copper sulfate pentahydrate 35 g / L

[0047] Potassium hydroxide 110 g / L

[0048] pH 11

[0049] Dissolve and mix the weighed methylene diphosphonic acid and copper chloride dihydrate with deionized water respectively, add sodium hydroxide solution during stirring and stir thoroughly, if the pH is too high due to the addition of potassium hydroxide, it can be adjusted with sulfuric acid to the specified pH.

[0050] In the resulting solution, adjust the temperature of the solution to 55°C, and the cathode current density is 2A / dm 2 Copper plating of about 5 microns is plated on a steel wire substrate with a diameter of Ф2 mm. The electroplating time is 7 minutes. The bonding force is tested by the winding method accord...

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Abstract

The invention provides a cyanide-free copper-plated electroplating solution suitable for a wide pH range and a wide current density range. The cyanide-free copper-plated electroplating solution comprises amino methylene diphosphonic acid (AMDP) with concentration being 20-90g/L, inositol hexaphosphoric acid (PA) or phytic acid sodium salt hydrate with concentration being 10-70g/L, pyrophosphate with concentration being 0.5-15g/L, and copper salt with concentration being 3-25g/L. The cyanide-free copper-plated electroplating solution provided by the invention has an applicable pH range of 6-13.5, an applicable current density range of 0.2-4 amperes/ square decimeter, is simple in formula, is non-toxic, is free of cyanide pollution; and copper is directly plated on iron substrate, a magnesium alloy, zinc or zinc alloy matrix and zinc-immersed aluminum, so that the obtained copper plating is excellent in binding force with the matrix.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a cyanide-free copper-plating electroplating solution, in particular to a cyanide-free copper-plating electroplating solution suitable for wide pH and wide current density ranges and a preparation method thereof. Background technique [0002] Acidic copper sulfate electroplating solution will undergo displacement reaction when direct copper plating on metal substrates such as iron, zinc or zinc alloy, magnesium alloy, aluminum, etc., resulting in poor bonding between the substrate and the copper coating. In order to obtain high binding force, alkaline cyanide plating solution is widely used in industry now. However, because cyanide has very high biological toxicity, it will cause major environmental and social safety hazards. The country has repeatedly issued industrial policies to eliminate cyanide-containing electroplating. Therefore, the development of ...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 郑精武陈海波乔梁蔡伟姜力强车声雷应耀李旺昌余靓
Owner ZHEJIANG UNIV OF TECH
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