MEMS micro-heating chip of composite structure and manufacturing method and application of chip

Abstract

The invention discloses an MEMS micro-heating chip of a composite structure and a manufacturing method of the chip. The MEMS micro-heating chip comprises a supporting frame and a composite film arranged in the supporting frame in a suspended mode. The composite film comprises a lower insulating layer, a heat insulation layer, a heating electrode layer, a middle insulating layer, a heat conductive layer, a testing electrode layer and an upper insulating layer in sequence in a set direction. The lower insulating layer is used for electrically isolating the heating electrode layer from the supporting frame, the heat insulation layer is used for thermally isolating the heating electrode layer from the supporting frame, the middle insulating layer is used for optically isolating the heating electrode layer from the testing electrode layer, and the upper insulating layer is used for electrically isolating the testing electrode layer from the supporting frame. The micro-heating chip has good thermal stability, and a polymer serves as the heat insulation layer and can improve thermal sensitivity. Meanwhile, the process of bonding the heating electrode layer with the testing electrode layer is utilized, device failure caused by film stress in the single-side preparing technical process can be effectively avoided, and the device yield is increased.

Description

technical field [0001] The invention relates to a MEMS micro-heating chip and a manufacturing method thereof, in particular to a multilayer film micro-heating chip of a composite structure, a manufacturing method and an application thereof, belonging to the technical field of semiconductor micro-nano processing. Background technique [0002] The micro-heating chip has the advantages of small size, low heating power, fast response time, small heat loss, compatibility with semiconductor technology, and easy integration, so it has become an important part of the micro-heating sensor, causing extensive research at home and abroad, especially Miniaturized micro-heating chips are currently widely used in the fields of gas sensors, gas flow meters, micro-calorimeters, infrared light sources, etc., and have great potential for development. [0003] The traditional heating chip preparation method is mainly to directly print the resistance paste on the ceramic blank, bake it at a cert...

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Problems solved by technology

[0006] Although the above two main types of micro-heating chips based on MEMS processing technology have solved the defects of large volume and high power consumption of traditional micro-heating devices to a certain extent, due to the fact that single-sided film composites are mainly used in the processing process The preparation of heat insulation layer, insulating layer, heating electrode layer, and test electrode layer can be realized by means of different methods. Therefore, due to too many film layers, it is easy to generate stress and cause device failure; and especially the above two types of micro-heating chips are still based on planar film For the support structure, due to the limitation of the single-sided film preparation process itself, the thickness of the film can only be within a certain range, so its support strength and impact resistance are also subject to certain constraints, especially for low-power micro-heating chips, it is difficult to realize the application of film support

Although the literature titled "Design and Fabrication of Micro-heating Plate Based on MEMS Technology" also reported a micro-heating chip based on a support beam, it also has the defects of large film stress and insufficient thickness, and it is difficult to achieve low power consumption at the same time. High energy consumption, high mechanical strength, good product yield and other advantages

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