A nano-tio-based 2 Low-power micro-nano gas sensor and preparation method thereof
A gas sensor and low power consumption technology, which is applied in the structure and preparation of low power consumption micro-nano gas sensors, can solve the problems of complex process, easy cracking of film stress, and reduced device yield, so as to increase the specific surface area and improve the quality of the device. Effect of gas response characteristics and optimization of mechanical properties
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Embodiment 1
[0055] (1) if Figure 4 As shown in (a), on the front and back of the Si substrate, SiO was prepared by thermal oxidation and low-pressure chemical vapor deposition, respectively. 2 -Si 3 N 4 Double-layer composite film; silicon wafer double-sided thermal oxidation 500nm SiO 2 layer, double-sided LPCVD (low pressure chemical vapor deposition) deposited 150nm Si 3 N 4 .
[0056] (2) if Figure 4 As shown in (b), on the front side SiO 2 -Si 3 N 4 On the double-layer composite film, 500nm SiO is sequentially deposited on the front side by PECVD 2 , 150nm Si 3 N 4 , Annealed at 500°C for 7h.
[0057] (3) if Figure 4 As shown in (c), on the front insulating layer, the patterns of sensitive electrodes and lead pads, heating electrodes and lead pads, temperature measuring electrodes and lead pads are obtained through a uniform photolithography process. The photoresist is positive resist EPG535.
[0058] (4) if Figure 4 As shown in (d), sputter the Cr bonding layer on...
Embodiment 2
[0069] (1) On the front and back of the Si substrate, SiO was prepared by thermal oxidation and low-pressure chemical vapor deposition, respectively. 2 -Si 3 N 4 Double-layer composite film; silicon wafer double-sided thermal oxidation 500nm SiO 2 layer, double-sided LPCVD (low pressure chemical vapor deposition) deposited 150nm Si 3 N 4 .
[0070] (2) On the front side SiO 2 -Si 3 N 4 On the double-layer composite film, 500nm SiO is sequentially deposited on the front side by PECVD 2 , 150nm Si 3 N 4 , Annealed at 600°C for 5h.
[0071] (3) On the front insulating layer, the patterns of the sensitive electrode and the lead plate, the heating electrode and the lead plate, the temperature measuring electrode and the lead plate are obtained through the uniform photolithography process, and the photoresist is positive resist EPG535.
[0072] (4) Sputter a Cr adhesive layer on the heating electrode, lead pad, sensitive electrode, and lead pad pattern, and then sputter a...
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