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A kind of graphene-filled anisotropic high thermal conductivity preformed adhesive tape and its preparation method

An anisotropic and graphene technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of weakening the effect of isotropic heat-conducting materials, discounting the heat-conducting effect of graphene, and having no requirements for thickness and size , to achieve the effect of facilitating large-scale application, controlling costs and ensuring profit margins

Active Publication Date: 2020-10-16
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

(201110277180.4) provided a thermally conductive adhesive with graphene added, with an average thermal conductivity of only 35W·m -1 ·K -1 , the patent uses bisphenol F-type epoxy resin as the matrix, natural graphite and graphite oxide as raw materials and self-made graphene as the filler to improve the thermal conductivity of the adhesive, but there is no requirement for the thickness and size of the graphene, but the size is large and the thickness is thick The thermal conductivity of graphene will be greatly reduced
[0006] Graphene is a two-dimensional planar material with high thermal conductivity in the parallel direction but low thermal conductivity in the vertical direction, which reduces its effectiveness as an isotropic thermal conductivity material.

Method used

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  • A kind of graphene-filled anisotropic high thermal conductivity preformed adhesive tape and its preparation method
  • A kind of graphene-filled anisotropic high thermal conductivity preformed adhesive tape and its preparation method
  • A kind of graphene-filled anisotropic high thermal conductivity preformed adhesive tape and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A graphene thermally conductive double-sided adhesive tape, mainly composed of graphene thermally conductive adhesive film and release paper, and release paper is applied on both sides of the adhesive film, and the thermally conductive adhesive film is mixed with the following components by weight and then baked Roast to get:

[0042]

[0043] 1. The synthesis method of modified silicone epoxy resin is:

[0044] Mix 30 parts of bisphenol A type epoxy resin with 30 parts of diluent xylene, then mix with 5 parts of γ-aminopropyltriethoxysilane, 0.2 parts of dibutyltin dilaurate and 30 parts of 955# silicone resin , reacted at 90 ° C for 1 h, distilled off xylene under reduced pressure, and obtained a uniform modified silicone epoxy resin under vacuum conditions.

[0045] 2. Graphene dispersion:

[0046] The graphene powder weighed according to the mass given in Table 1 is mixed with a silane coupling agent and a solvent, then emulsified using an emulsifier (speed 500...

Embodiment 2

[0054] A graphene thermally conductive double-sided adhesive tape, mainly composed of graphene thermally conductive adhesive film and release paper, and release paper is applied on both sides of the adhesive film, and the thermally conductive adhesive film is mixed with the following components by weight and then baked Roast to get:

[0055]

[0056] 1. The synthesis method of modified silicone epoxy resin is:

[0057] Mix 30 parts of bisphenol A type epoxy resin with 30 parts of diluent xylene, then mix with 3 parts of γ-aminopropyltriethoxysilane, 0.2 parts of dibutyltin dilaurate and 30 parts of 955# silicone resin , reacted at 90 ° C for 1 h, distilled off xylene under reduced pressure, and obtained a uniform modified silicone epoxy resin under vacuum conditions.

[0058] 2. Graphene dispersion:

[0059] The graphene powder weighed according to the mass given in Table 1 is mixed with a silane coupling agent and a solvent, then emulsified using an emulsifier (speed 500...

Embodiment 3

[0067] A graphene thermally conductive double-sided adhesive tape, mainly composed of graphene thermally conductive adhesive film and release paper, and release paper is applied on both sides of the adhesive film, and the thermally conductive adhesive film is mixed with the following components by weight and then baked Roast to get:

[0068]

[0069] 1. The synthesis method of modified silicone epoxy resin is:

[0070] Mix 30 parts of bisphenol A type epoxy resin with 30 parts of diluent xylene, then mix with 3 parts of γ-aminopropyltriethoxysilane, 0.3 parts of dibutyltin dilaurate and 30 parts of 955# silicone resin , reacted at 90 ° C for 1 h, distilled off xylene under reduced pressure, and obtained a uniform modified silicone epoxy resin under vacuum conditions.

[0071] 2. Graphene dispersion:

[0072] Graphene powder is mixed with silane coupling agent and solvent according to the mass weighing given in table 1, then use emulsifier emulsification (speed 5000 revs / m...

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Abstract

The invention especially relates to an anisotropic preformed adhesive tape filled with graphene and having high thermal conductivity and high electric conductivity, belonging to the technical field of preparation of heat-conducting adhesive tapes. The anisotropic preformed adhesive tape is composed of a gluing film and release paper on both the upper and lower surfaces of the gluing film. The gluing film comprises, by weight, 100 parts of organosilicon epoxy resin, 0.01 to 0.05 part of graphene, 40 to 80 parts of a solvent, 1 to 4 parts of a coupling agent and 0.8 to 1.5 parts of a curing agent. The preparation method comprises the following steps: synthesis of the organosilicon epoxy resin; dispersion of the graphene; preparation of a glue solution; preparation of a semi- solid gluing film; preparation of the preformed adhesive tape; etc. The anisotropic preformed adhesive tape provided by the invention has a high heat conduction coefficient and high electric conductivity in a longitudinal direction, and is low in the addition amount of graphene, low in cost, simple to prepare, convenient to use, easy for large-scale batch application, and applicable to fields related to heat radiation and electric conduction, such as microprocessors, flexible circuit boards, LEDs, automobile electronics, aviation and spaceflight, and nuclear energy.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting adhesive tapes, in particular to a graphene-filled anisotropic high-thermal-conductivity and electrically-conductive preformed adhesive tape. Background technique [0002] With the advancement of technology and the rapid development of consumer electronics products, the volume of electronic equipment is getting smaller and smaller, but the functions are getting more powerful. The power of the matching functional component chips is getting bigger and bigger, so the heat generation is getting bigger and bigger. Heat directly affects the stability and safety of electronic equipment. Most chip manufacturers have to sacrifice the main frequency in order to control the heating problem. How to conduct heat quickly and efficiently has become a key technology for the development of advanced electronic equipment in the future. The LED industry is developing in the direction of ultra-high brightness...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/30C09J7/10C09J9/02C09J163/00C09J11/06
CPCC08K3/04C08K5/5425C08K5/5435C09J7/00C09J9/02C09J11/06C09J163/00C09J2203/318C09J2203/326C09J2301/314C09J2301/408C09J2463/00
Inventor 贺会军张江松赵朝辉朱捷王志刚张焕鹍刘希学安宁祝志华朱学新刘英杰刘建徐蕾金帅王丽荣
Owner BEIJING COMPO ADVANCED TECH
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