UV-resistant ink photosensitive adhesive composition and its application in baking-free ctp plate

A composition and photosensitive adhesive technology, applied in optics, printing plate preparation, opto-mechanical equipment, etc., can solve the problems of difficulty in printing high-quality packaging boxes, high power consumption for oven heating, waste of time and manpower, etc. Achieve the effect of increasing developer solubility, good clarity, saving time and labor

Active Publication Date: 2021-01-22
广东潮新科数字科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve this problem, the user has to bake the common printing plate to enhance its printing adaptability, but the baking process wastes time and manpower, and increases the cost of use (the heating power consumption of the oven is huge), Moreover, the printing effect after baking is still difficult to meet the requirements of high-quality packaging boxes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Prepare photosensitive glue composition, its each component and mass parts thereof are as follows:

[0039] 15 parts of phenolic resin;

[0040] 20 parts of epoxy modified phenolic resin;

[0041] 10 parts of acrylamide modified phenolic resin;

[0042] 5 parts polyurethane acrylate;

[0043] 15 parts of esterified products of alkylphenol-formaldehyde resin and 2-diazo-1-naphthoquinone-4-sulfonyl chloride;

[0044] 10 parts of pyrogallol-acetone resin and 2-diazo-1-naphthoquinone-5-sulfonyl chloride ester compound;

[0045] 1 part dye;

[0046] 5 parts of solubilizer;

[0047] 1 part of nucleophilic catalyst;

[0048] Wherein, the epoxy equivalent of the epoxy-modified phenolic resin is 10.

[0049] In this implementation, the above-mentioned photosensitive adhesive composition was used to prepare the positive-working thermal CTP plate, and the preparation method of the positive-working thermal CTP plate comprises the following steps:

[0050] S1. Sheet material...

Embodiment 2

[0056] Prepare photosensitive glue composition, its each component and mass parts thereof are as follows:

[0057] 10 parts of phenolic resin;

[0058] 30 parts of epoxy modified phenolic resins;

[0059] 5 parts of acrylamide modified phenolic resin;

[0060] 3 parts polyurethane acrylate;

[0061] 20 parts of esterified products of alkylphenol-formaldehyde resin and 2-diazo-1-naphthoquinone-4-sulfonyl chloride;

[0062] 2 parts of pyrogallol-acetone resin and 2-diazo-1-naphthoquinone-5-sulfonyl chloride ester;

[0063] 3 parts dye;

[0064] 8 parts of solubilizer;

[0065] 1 part of nucleophilic catalyst;

[0066] Wherein, the epoxy equivalent of the epoxy-modified phenolic resin is 5.

[0067] In this implementation, the above-mentioned photosensitive adhesive composition was used to prepare the positive-working thermal CTP plate, and the preparation method of the positive-working thermal CTP plate comprises the following steps:

[0068] S1. Sheet material treatment...

Embodiment 3

[0074] Prepare the photosensitive adhesive composition, including the following components calculated in parts by mass:

[0075] 20 parts of phenolic resin;

[0076] 5 parts of epoxy modified phenolic resin;

[0077] 20 parts of acrylamide modified phenolic resin;

[0078] 3 parts polyurethane acrylate;

[0079] 10 parts of esterified products of alkylphenol-formaldehyde resin and 2-diazo-1-naphthoquinone-4-sulfonyl chloride;

[0080] 20 parts of pyrogallol-acetone resin and 2-diazo-1-naphthoquinone-5-sulfonyl chloride ester;

[0081] 0.5 parts of dye;

[0082] 3 parts of solubilizer;

[0083] 0.5 part of nucleophilic catalyst;

[0084] Wherein, the epoxy equivalent of the epoxy-modified phenolic resin is 20.

[0085] In this implementation, the above-mentioned photosensitive adhesive composition was used to prepare the positive-working thermal CTP plate, and the preparation method of the positive-working thermal CTP plate comprises the following steps:

[0086] S1. Sh...

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PUM

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Abstract

The invention discloses an UV-resistant ink photoresist composition and application thereof in a baking-free computer to plate (CTP). The UV-resistant ink photoresist composition comprises 10-20 parts of phenolic resin, 5-30 parts of epoxy modified phenolic resin, 5-20 parts of acrylamide modified phenolic resin, 3-5 parts of urethane acrylate, 10-20 parts of ester of alkylphenol-formaldehyde resin and 2-heavy nitrogen-1-naphthoquinone-4-sulfuryl chloride, 2-20 parts of ester of pyrogallol-acetone resin and 2-heavy nitrogen-1-naphthoquinone-5-sulfuryl chloride, 0.5-3 parts of dye, 3-8 parts of dissolution promotion agent and 0.5-1.5 parts of nucleophilicity catalyst, and the epoxy equivalent of the epoxy modified phenolic resin is 5-20. In the CTP prepared by utilizing the UV-resistant ink photoresist composition, a next UV ink printing process can be entered without baking processing, time and labor are saved, cost is reduced, and high printing resistance, high resolution and excellent definition are achieved.

Description

technical field [0001] The invention relates to the technical field of CTP plate making, in particular to a UV-resistant ink photosensitive glue composition and its application in baking-free CTP plates. Background technique [0002] CTP (Computer to Plate) technology is a digital direct-to-plate technology that emerged in the 1990s. It is a technology that uses a computer to copy graphic information to a plate through a laser plate maker. CTP plates are mainly divided into heat-sensitive type, silver salt type, photopolymerization type, and treatment-free type. Etched thermal CTP version. Among them, the positive thermal CTP plate is formed by coating a layer of thermal imaging composition on an aluminum substrate. The imaging principle is based on the physical changes of the thermal imaging composition before and after infrared laser exposure. Before exposure, the composition The carbonyl group or ether group of the solvent-inhibiting and solubilizing compound in the fil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039B41C1/055
CPCB41C1/055G03F7/039
Inventor 蔡大年蔡信豪蔡晓青
Owner 广东潮新科数字科技有限公司
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