UV-resistant ink photosensitive adhesive composition and its application in baking-free ctp plate
A composition and photosensitive adhesive technology, applied in optics, printing plate preparation, opto-mechanical equipment, etc., can solve the problems of difficulty in printing high-quality packaging boxes, high power consumption for oven heating, waste of time and manpower, etc. Achieve the effect of increasing developer solubility, good clarity, saving time and labor
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Embodiment 1
[0038] Prepare photosensitive glue composition, its each component and mass parts thereof are as follows:
[0039] 15 parts of phenolic resin;
[0040] 20 parts of epoxy modified phenolic resin;
[0041] 10 parts of acrylamide modified phenolic resin;
[0042] 5 parts polyurethane acrylate;
[0043] 15 parts of esterified products of alkylphenol-formaldehyde resin and 2-diazo-1-naphthoquinone-4-sulfonyl chloride;
[0044] 10 parts of pyrogallol-acetone resin and 2-diazo-1-naphthoquinone-5-sulfonyl chloride ester compound;
[0045] 1 part dye;
[0046] 5 parts of solubilizer;
[0047] 1 part of nucleophilic catalyst;
[0048] Wherein, the epoxy equivalent of the epoxy-modified phenolic resin is 10.
[0049] In this implementation, the above-mentioned photosensitive adhesive composition was used to prepare the positive-working thermal CTP plate, and the preparation method of the positive-working thermal CTP plate comprises the following steps:
[0050] S1. Sheet material...
Embodiment 2
[0056] Prepare photosensitive glue composition, its each component and mass parts thereof are as follows:
[0057] 10 parts of phenolic resin;
[0058] 30 parts of epoxy modified phenolic resins;
[0059] 5 parts of acrylamide modified phenolic resin;
[0060] 3 parts polyurethane acrylate;
[0061] 20 parts of esterified products of alkylphenol-formaldehyde resin and 2-diazo-1-naphthoquinone-4-sulfonyl chloride;
[0062] 2 parts of pyrogallol-acetone resin and 2-diazo-1-naphthoquinone-5-sulfonyl chloride ester;
[0063] 3 parts dye;
[0064] 8 parts of solubilizer;
[0065] 1 part of nucleophilic catalyst;
[0066] Wherein, the epoxy equivalent of the epoxy-modified phenolic resin is 5.
[0067] In this implementation, the above-mentioned photosensitive adhesive composition was used to prepare the positive-working thermal CTP plate, and the preparation method of the positive-working thermal CTP plate comprises the following steps:
[0068] S1. Sheet material treatment...
Embodiment 3
[0074] Prepare the photosensitive adhesive composition, including the following components calculated in parts by mass:
[0075] 20 parts of phenolic resin;
[0076] 5 parts of epoxy modified phenolic resin;
[0077] 20 parts of acrylamide modified phenolic resin;
[0078] 3 parts polyurethane acrylate;
[0079] 10 parts of esterified products of alkylphenol-formaldehyde resin and 2-diazo-1-naphthoquinone-4-sulfonyl chloride;
[0080] 20 parts of pyrogallol-acetone resin and 2-diazo-1-naphthoquinone-5-sulfonyl chloride ester;
[0081] 0.5 parts of dye;
[0082] 3 parts of solubilizer;
[0083] 0.5 part of nucleophilic catalyst;
[0084] Wherein, the epoxy equivalent of the epoxy-modified phenolic resin is 20.
[0085] In this implementation, the above-mentioned photosensitive adhesive composition was used to prepare the positive-working thermal CTP plate, and the preparation method of the positive-working thermal CTP plate comprises the following steps:
[0086] S1. Sh...
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