Low specific gravity composite thermally-conductive insulating glue and preparation method thereof

A heat-conducting, insulating, and low-specific-gravity technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems such as high density of epoxy resin, adverse environmental effects, and affecting the bonding performance of epoxy resin

Inactive Publication Date: 2017-08-01
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary epoxy resin insulating glue has the following deficiencies in application: first, the thermal conductivity is low, only about 0.2W / (m K); Accompanied by a large amount of black smoke, causing adverse effects on the environment
However, the above-mentioned inorganic fillers generally require a large amount of addition (generally about 50%) to achieve a high thermal conductivity, and an excessive amount of addition will affect the bonding performance of the epoxy resin, and the workability will be greatly reduced.
At the same time, the inorganic fillers added in a large amount are relatively denser than epoxy resins, and they are easy to settle after adding. At the same time, the increased specific gravity of cured epoxy resins limits its application.

Method used

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  • Low specific gravity composite thermally-conductive insulating glue and preparation method thereof
  • Low specific gravity composite thermally-conductive insulating glue and preparation method thereof
  • Low specific gravity composite thermally-conductive insulating glue and preparation method thereof

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preparation example Construction

[0031] The application also provides a preparation method of the composite thermally conductive insulating adhesive, including:

[0032] The filler, the coupling agent and the epoxy resin are mixed, and then a curing agent is added for curing to obtain a composite thermally conductive insulating adhesive.

[0033] In order to make the raw materials mix more fully and effectively realize the full modification of the filler, the preparation process of the composite heat-conducting insulating adhesive is specifically as follows:

[0034] Mix the filler with a solvent, then add a coupling agent for ultrasonication, seal and dry to obtain a modified filler;

[0035] The modified filler is ultrasonically mixed with the epoxy resin, and after three-roll grinding, mixed with a curing agent, heated and cured to obtain a low specific gravity composite thermally conductive insulating adhesive.

[0036] In the above process, the filler is graphite-like carbon nitride, which may also incl...

Embodiment 1

[0044] Weigh 5g of melamine, put it in a corundum crucible and cover it, raise the temperature to 550°C in a tube furnace under a nitrogen atmosphere, and the heating rate is 3°C min -1 , and calcined at 550°C for 4h, cooled naturally to room temperature to obtain a light yellow solid, which was ground to obtain graphite-like carbon nitride (g-C 3 N 4 ). figure 2 For the XRD spectrum of the graphite-like carbon nitride prepared in this example, Table 1 is the element content analysis table of the graphite-like carbon nitride prepared in this example.

[0045] Table 1 The elemental content analysis table of the graphite-like carbon nitride prepared in this embodiment

[0046] element C H N content(%) 33.75 1.34 60.38

[0047] The graphitic carbon nitrides in the following examples were all prepared according to the method in Example 1.

Embodiment 2

[0049] 1) Weigh 3g to prepare g-C 3 N 4 , added to 50mL of ethanol and distilled water mixed solution with a volume ratio of 3:1, ultrasonicated for 25min, added 0.3g of silane coupling agent KH570, sealed with plastic wrap at 65°C, mechanically stirred for 4h, poured into a glass dish under natural conditions The solvent was evaporated for 12 hours, dried in an oven to obtain surface-modified g-C 3 N 4 Modified filler;

[0050] 2) Weigh 20 parts of the modified filler prepared in step 1, add it to 80 parts of epoxy resin E51, heat and stir at 65°C for 5 hours, add 0.5 parts of curing agent ethylenediamine after three-roll grinding, and mix well , remove air bubbles in a vacuum oven at 45°C for 15 minutes, remove air bubbles in the epoxy resin mixture, pour it into a prepared mold, remove air bubbles in a vacuum oven at 45°C, and cure for 24 hours to obtain a composite glue.

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Abstract

The invention provides low specific gravity composite thermally-conductive insulating glue, which is prepared from filler, a coupling agent, epoxy resin and a curing agent, wherein the filler is prepared from graphite-like carbon nitride. The composite thermally-conductive insulating glue, which is high in heat conductivity coefficient, excellent in mechanical property, good in insulating property and low in specific gravity, is prepared by taking the graphite-like carbon nitride as main heat conduction filler, taking the coupling agent as a surface modifying agent and taking the epoxy resin as matrix.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a low-specific-gravity composite heat-conducting insulating adhesive and a preparation method thereof. Background technique [0002] Epoxy resin insulating glue has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good electrical insulation performance, small deformation shrinkage rate, good dimensional stability of products, high hardness and flexibility. It is better and stable to most solvents, so it is widely used in the fields of PCB circuit boards, aerospace, automobile production and processing, and new energy battery potting. With the rapid development of the electronics industry, electronic components and electronic equipment are becoming more and more light, thin, and small. This will inevitably cause the heat generated by the internal device structure to not be easily dissipated in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/50
CPCC08G59/5006C08K3/28C08K9/04C08K9/06C08K2003/2227C08K2003/385C09J11/04C09J163/00
Inventor 郝志峰樊义翰黄月否王成勇易国斌余林陈世荣郑李娟
Owner GUANGDONG UNIV OF TECH
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