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Multiscale carbon material/silicone rubber thermal interface material and preparation method

A technology of interface heat-conducting materials and carbon materials, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of reduced mechanical properties such as compression deformation capacity of composite materials, increased difficulty of mixing and vulcanization processes, and increased viscosity of the system. , to achieve the effects of improved dispersion, good compatibility and simple production process

Inactive Publication Date: 2017-08-08
SHANXI INST OF COAL CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, from the perspective of actual processing, a larger filling amount will increase the viscosity of the system, increasing the difficulty of mixing and vulcanization processes, and a higher filling amount will reduce the mechanical properties of the composite material such as compressive deformation ability.
In addition, higher loadings lead to increased material costs

Method used

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  • Multiscale carbon material/silicone rubber thermal interface material and preparation method
  • Multiscale carbon material/silicone rubber thermal interface material and preparation method
  • Multiscale carbon material/silicone rubber thermal interface material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] 1) Mix the dimethylsiloxane prepolymerization solution of the two-component methyl silicone resin and the crosslinking agent at a ratio of 10:1 to obtain a silicone rubber solution, and expand the expanded graphite with an expansion ratio of 250ml / g, 2.3 Graphene with a diameter of μm and the silicone rubber solution are weighed with a mass ratio of 4.8%: 0.17%: 95% for later use;

[0045] 2) The graphene and the silicone rubber solution are premixed and kneaded for 15 minutes in a vacuum kneader under vacuum conditions.

[0046] 3) Gradually add expanded graphite into the mixture obtained in step 2), and continue kneading for 30 minutes under vacuum condition.

[0047] 4) The mixture obtained in step 3) is degassed and kept at -0.085MPa pressure for 60min.

[0048] 5) Prepare the degassed composite into a thin sheet with a thickness of 1.0 mm by using a coater.

[0049] 6) The molded composite was cured at 110° C. for 45 minutes to obtain an interfacial thermally con...

Embodiment 2

[0051] 1) Mix the methyl vinyl siloxane prepolymerization solution of the two-component methyl vinyl silicone resin and the crosslinking agent at a ratio of 8:1 to obtain a silicone rubber solution, and prepare the silicone rubber solution with an expansion ratio of 250ml / g Expanded graphite, graphene with a sheet diameter of 3.5 μm and silicone rubber solution are taken by weighing with a mass ratio of 6.2%: 0.5%: 93.3% for subsequent use;

[0052] 2) The graphene and the silicone rubber solution are premixed and then placed in a vacuum pressurized stirring tank and stirred for 10 min.

[0053] 3) Add expanded graphite gradually to the mixture obtained in step 2), continue to stir for 30 minutes, and stir for 15 minutes under vacuum (-0.085 MPa) and under pressure (0.8 MPa).

[0054] 4) After the mixture obtained in step 3) is taken out of the kettle, degassing treatment is carried out, and the pressure is maintained at -0.07MPa for 120min.

[0055] 5) The degassed composite...

Embodiment 3

[0058] 1) Mix the dimethylsiloxane prepolymerization solution of the two-component dimethyl silicone resin and the crosslinking agent at a ratio of 10:1 to obtain a silicone rubber solution. Expanded graphite with expansion multiple of 300ml / g, graphene with 3.5 μm sheet diameter, and silicone rubber solution are weighed with a mass ratio of 11.6%: 1.15%: 87.2% for later use;

[0059] 2) The graphene and the silicone rubber solution are premixed and kneaded in a vacuum kneader for 30 minutes under vacuum conditions.

[0060] 3) Gradually add expanded graphite into the mixture obtained in step 2), and continue kneading for 60 min under vacuum condition.

[0061] 4) After discharging the mixture obtained in step 3), carry out degassing treatment, and keep it under the pressure of -0.09MPa for 60min.

[0062] 5) Prepare the degassed compound into a thin sheet with a thickness of 2.0 mm by using a molding die.

[0063] 6) Curing the mold at 100° C. for 60 minutes to obtain an in...

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Abstract

The invention discloses a preparation method of a multiscale carbon material / silicone rubber composite material. The method takes expanded graphite as a heat-conducting main body, graphene as a heat-conducting reinforcement and organic silicon rubber as a flexible substrate, and a thermal interface material with better performance can be obtained through performing mixing kneading, degassing, molding and curing on the materials. The heat conductivity of the composite material is 0.68 to 2.98W / m.K, and the modulus of compression of the composite material is less than 1.2MPa (specified compression set Epsilon is equal to 30 percent). The preparation method of the multiscale carbon material / silicone rubber composite material has the advantages that the raw materials are cheap and easy to obtain, the process is simple and the performance is stable, so that the method is adapted to large-scale production.

Description

technical field [0001] The invention relates to an interface heat-conducting material, in particular to a multi-scale carbon material / silicone rubber interface heat-conducting material and a preparation method. Background technique [0002] Power devices (processors, chips, etc.) in electronic equipment are often accompanied by heat generation during normal operation. The heat needs to be transferred from the power device to the outside through heat conduction, convection, radiation, etc., otherwise the accumulated heat will lead to a series of problems such as slower operation speed, poor reliability, and shortened service life of electronic equipment. And the higher integration of electronic equipment makes the role of thermal management and thermal design more and more important in the design process. Heat transfer from the power device to the heat sink traverses a series of solid / solid contact interfaces. From a microscopic point of view, the contact interface between ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08K7/24C08K3/04C09K5/14
CPCC08K3/04C08K7/24C08K2201/003C08K2201/006C08K2201/011C09K5/14C08L83/04
Inventor 王宏宝陶则超刘占军郭全贵
Owner SHANXI INST OF COAL CHEM CHINESE ACAD OF SCI
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