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Liquid composition for etching multilayer thin film containing copper and molybdenum, etching method using same, and method for manufacturing display device

A technology of liquid composition and multilayer thin film, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuit, etc., can solve the problems of insufficient adhesion, not mentioned multilayer thin film etching, silicon semiconductor film diffusion, etc., to achieve The effect of reducing residue

Active Publication Date: 2017-08-29
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although copper-based substances have the advantage of low electrical resistance, on the other hand, there is a problem that, when used for gate wiring, base layers such as glass, silicon dioxide, and silicon nitride, etc. The adhesiveness of the main component is not sufficient, and when used in source and drain wiring, problems such as diffusion into the silicon semiconductor film as the underlying layer occur.
However, Patent Documents 2 and 3 do not mention etching of a multilayer thin film including a copper layer formed of a substance mainly composed of copper and a molybdenum layer formed of a substance mainly composed of molybdenum.
[0011] In addition, in order to increase the dissolution rate of molybdenum, when a fluorine compound is added like the liquid composition described in Patent Document 2, as described above, the fluorine compound will corrode glass, silicon dioxide or silicon nitride, which are often used as a base layer. , As a result, disadvantages such as changes in optical characteristics occur, so liquid compositions with little damage to glass and the like are strongly desired

Method used

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  • Liquid composition for etching multilayer thin film containing copper and molybdenum, etching method using same, and method for manufacturing display device
  • Liquid composition for etching multilayer thin film containing copper and molybdenum, etching method using same, and method for manufacturing display device
  • Liquid composition for etching multilayer thin film containing copper and molybdenum, etching method using same, and method for manufacturing display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0131] 5.0% by mass of hydrogen peroxide as component (A), 1.5% by mass of nitric acid as component (B), 1.8% by mass of glycolic acid, 7.0% by mass of lactic acid, 0.8% by mass of malonic acid, and 2.8% by mass of succinic acid and 0.3% by mass of malic acid (the total acid concentration of nitric acid, glycolic acid, lactic acid, malonic acid, succinic acid, and malic acid is 14.2% by mass), N,N-diethyl-1 10,000 ppm of copper powder and 500 ppm of molybdenum powder were dissolved in a liquid composition of 5.5 mass % of 3-propylenediamine, 1.0 mass % of caffeine as a component (D), and water. The above-mentioned evaluation was performed using the obtained liquid composition. The obtained results are shown in Table 1 below.

Embodiment 2～9

[0133] In Example 1, except having made each component density|concentration and pH into the value shown in following Table 1, it carried out similarly to Example 1, and prepared and evaluated the liquid composition. The obtained results are shown in Table 1 below.

Embodiment 10 and 11

[0135] In Example 1, liquid compositions were prepared and evaluated in the same manner as in Example 1, except that the alkali compound and its concentration as the component (C) were the compounds and values ​​shown in Table 2 below. The obtained results are shown in Table 2 below.

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Abstract

The invention provides a liquid composition for etching a multilayer thin film containing copper and molybdenum, an etching method using the same, and a method for manufacturing a display device. The invention provides a liquid composition used for etching a multilayer thin film containing a copper layer consisting of a material mainly containing copper and a molybdenum layer consisting of a material mainly containing molybdenum. The liquid composition contains (A) hydrogen peroxide of 3 to 9 mass%, (B) acid of 6 to 20 mass%, (C) an alkali compound (excluding caffeine) of 1 to 10 mass%, and (D) caffeine of 0.1 to 4 mass% and having a pH value of 2.5 to 5.0.

Description

technical field [0001] The present invention relates to the use in the etching of a multilayer thin film including a copper layer formed of a substance containing copper as a main component and a molybdenum layer formed of a substance containing molybdenum as a main component, and has stable properties even at high copper concentrations. Liquid composition with etching performance, etching method using same, and manufacturing method of display device. Background technique [0002] Conventionally, aluminum or aluminum alloys have generally been used as wiring materials for display devices such as flat panel displays. However, with the increase in size and resolution of displays, such aluminum-based wiring materials have a problem of signal delay due to characteristics such as wiring resistance, and it tends to be difficult to realize uniform screen display. [0003] For this reason, there are more and more cases where wirings formed of substances mainly composed of copper, s...

Claims

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Application Information

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IPC IPC(8): C23F1/44
CPCC23F1/44C23F1/18C23F1/26H05K1/092H05K3/067
Inventor 松原将英夕部邦夫茂田麻里浅井智子原田奈津美
Owner MITSUBISHI GAS CHEM CO INC