Preparation method and usage method of low-viscosity flame-retardant heat-conducting solvent-free polyurethane electronic-pouring sealant

A technology of solvent-free polyurethane and potting glue, which is applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., and can solve the problems of product potting quality decline, material settlement resistance decline, product stability decline, etc. problem, to achieve the effect of reducing application, improving production efficiency, and small viscosity change

Active Publication Date: 2017-09-29
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The increase of material viscosity will cause the following problems: first, the addition of a large amount of fillers and flame retardants will cause the material viscosity to increase sharply, the fluidity will decrease, and it will be difficult to penetrate into small gaps and components, resulting in a decline in potting quality; second , the high-viscosity material makes it difficult to discharge the generated air bubbles, resulting in a decline in the quality of the product's potting; third, the addition of a large number of fillers reduces the anti-sedimentation of the material, decreases the stability of the product, and causes the problem of delamination

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A method for preparing a low-viscosity flame-retardant and heat-conducting solvent-free polyurethane electronic potting adhesive, the electronic potting adhesive includes component A and component B, and the component A is prepared through the following process: in parts by mass, Add 100 parts of castor oil, 5 parts of flame retardant, 3 parts of high thermal conductivity insulating composite powder and 0.1 part of defoamer into the reactor, mix well, heat up to 110°C, carry out vacuum dehydration for 2 hours, then cool down to 30°C, add 0.05 part of the catalyst, mixed uniformly to obtain component A; component B is liquefied diphenylmethylene diisocyanate (liquefied MDI for short).

[0041] Wherein, the flame retardant is a mixture of dibromoneopentyl glycol (abbreviated as DBNPG) and resorcinol bis(diphenyl phosphate) (abbreviated as RDP) in a mass ratio of 1:3.

[0042] The high thermal conductivity insulating composite powder is a mixture of nano-silicon carbide, n...

Embodiment 2

[0050] A method for preparing a low-viscosity flame-retardant and heat-conducting solvent-free polyurethane electronic potting adhesive, the electronic potting adhesive includes component A and component B, and the component A is prepared through the following process: in parts by mass, Add 100 parts of castor oil, 10 parts of flame retardant, 2 parts of high thermal conductivity insulating composite powder and 0.05 part of defoamer into the reaction kettle, mix well, heat up to 115°C, carry out vacuum dehydration for 2 hours, then cool down to 35°C, add 0.1 part of catalyst, mixed uniformly to obtain component A; component B is liquefied diphenylmethylene diisocyanate (liquefied MDI for short).

[0051] Wherein, the flame retardant is a mixture of dibromoneopentyl glycol (DBNPG for short) and resorcinol bis(diphenyl phosphate) (RDP for short) in a mass ratio of 1:4.

[0052] The high thermal conductivity insulating composite powder is a mixture of nano-silicon carbide, nano-a...

Embodiment 3

[0060] A method for preparing a low-viscosity flame-retardant and heat-conducting solvent-free polyurethane electronic potting adhesive, the electronic potting adhesive includes component A and component B, and the component A is prepared through the following process: in parts by mass, Add 100 parts of castor oil, 15 parts of flame retardant, 1 part of high thermal conductivity insulating composite powder and 0.2 parts of defoamer into the reactor, mix well, heat up to 120°C, carry out vacuum dehydration for 2 hours, then cool down to 40°C, add 0.08 parts of catalyst, mixed uniformly to obtain component A; component B is liquefied diphenylmethylene diisocyanate (liquefied MDI for short).

[0061] Wherein, the flame retardant is a mixture of dibromoneopentyl glycol (DBNPG for short) and resorcinol bis(diphenyl phosphate) (RDP for short) in a mass ratio of 1:5.

[0062] The high thermal conductivity insulating composite powder is a mixture of nano-silicon carbide, nano-aluminum...

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Abstract

The invention discloses a preparation method and a usage method of a low-viscosity flame-retardant heat-conducting solvent-free polyurethane electronic-pouring sealant. The electronic-pouring sealant comprises a component A and a component B, wherein the component A is prepared by means of the following process: adding 100 parts of castor oil, 5 to 15 parts of flame retardant, 1 to 5 parts of high heat conductive insulation composite powder and 0.05 to 3 parts of an anti-foaming agent into a reaction kettle in parts by mass, performing uniform mixing and vacuum dehydration, then adding 0.05 to 0.3 part of a catalyst, and performing uniform mixing to obtain the component A; and the component B is liquefied diphenylmethylene diisocyanate. In the invention, a high heat conductive insulation composite powder heat conduction technology, a polyurethane in-situ polymerization self-flame-retardant technology and a thermal sensitive catalyst asynchronous catalysis technology are adopted, the product viscosity is smaller than 6000mPa.s, the heat conduction coefficient is greater than 1.85W/MK, the volume resistivity is greater than 4.2*10<12>omega.m, and the flame retardant property can be up to the American FMVSS302 standard.

Description

technical field [0001] The invention relates to the technical field of polyurethane potting glue, in particular to a method for preparing and using a low-viscosity flame-retardant and heat-conducting solvent-free polyurethane electronic potting glue. Background technique [0002] Electronic potting adhesives are mainly used for potting electronic components. Before use, electronic potting adhesives are not cured and are liquid and have fluidity. The viscosity of the glue varies according to the material, performance, and production process of the product. . After the electronic components are potted, the potting glue is completely cured, which can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance, and shock resistance. [0003] There are many types of electronic potting adhesives. According to the type of resin raw materials, they are mainly divided into epoxy resin potting adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/04C09J11/06C08G18/67C08G18/32C08G18/20H01L23/29
CPCC08G18/2063C08G18/36C08G18/381C08K3/16C08K3/34C08K3/38C08K5/523C08K2003/2227C08K2003/2296C08K2201/011C09J11/04C09J11/06C09J175/14H01L23/293
Inventor 马兴元刘帅段月丁博张铭芮赵昭
Owner SHAANXI UNIV OF SCI & TECH
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