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A kind of flexible transparent conductive electrode based on polyimide substrate and preparation method thereof

A transparent conductive electrode, polyimide technology, applied to the conductive layer on the insulating carrier, cable/conductor manufacturing, circuits, etc., can solve the problem of poor adhesion between the metal grid and the substrate, difficult to control the height of the metal grid, High haze and other problems, to achieve the effect of high visible light transmittance, increased light transmittance, and low sheet resistance

Active Publication Date: 2019-05-21
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For the above defects or improvement needs of the prior art, the present invention provides a flexible transparent conductive electrode based on polyimide (PI) substrate, the purpose of which is to provide a wetting layer between the PI substrate and the ultra-thin metal stack , enhance the adhesion between the PI substrate and the ultra-thin metal stack, and at the same time use the combination of the ultra-thin metal stack transparent conductive layer and the metal grid to prepare a polyimide-based substrate with high visible light transmittance, low Sheet resistance, flexible transparent conductive electrodes with high mechanical properties, thus solving the problem of large electrode haze, poor adhesion between the metal grid and the substrate, difficulty in controlling the height of the metal grid, and disconnection that are not suitable for large-scale production or network The technical problem that the grid line is too high leads to a short circuit of the device

Method used

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  • A kind of flexible transparent conductive electrode based on polyimide substrate and preparation method thereof
  • A kind of flexible transparent conductive electrode based on polyimide substrate and preparation method thereof
  • A kind of flexible transparent conductive electrode based on polyimide substrate and preparation method thereof

Examples

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Embodiment 1

[0036] like figure 1 As shown, it is a schematic structural diagram of a flexible transparent conductive electrode based on a polyimide substrate in the present invention. The polyimide-based flexible transparent conductive electrode in this embodiment includes a polyimide substrate 1 from bottom to top, a wetting layer 2 (also called adhesion layer), metal seed layer 3, second metal layer 4, metal grid layer 5 and zinc oxide anti-reflection layer 6, wetting layer 2 is molybdenum trioxide, metal seed layer 2 is gold, the second The second metal layer is silver, and the metal seed layer 3 and the second metal layer 4 constitute the metal layer. The following are the specific production steps:

[0037] The first step is to successively evaporate MoO on PI by thermal evaporation method. 3 , Au, Ag, thicknesses are 3nm, 2nm, 4nm respectively. In this embodiment, the degree of vacuum during the evaporation process is ≤1.5×10 -4 The thickness of the Pa steamed metal is monitored...

Embodiment 2

[0044] The flexible transparent conductive electrode based on the polyimide substrate of the present invention is manufactured according to the following steps:

[0045] The first step is to successively evaporate MoO on PI by thermal evaporation method. 3 , Au, Ag, thicknesses are 3nm, 2nm, 4nm respectively. In this embodiment, the degree of vacuum during the evaporation process is ≤1.5×10 -4 The thickness of the Pa steamed metal is monitored by a frequency meter.

[0046] In the second step, the metal grid is fabricated by photolithography, evaporation, and lift-off methods. In this example, AZ5214 photoresist is first coated on the PI prepared in the first step, the spin coating is 1000rpm / 3s+3000rpm / 35s, the glue is baked at 112°C / 50s, the MJB4 photolithography machine is exposed for 20s, and the developer Developed to obtain a sample with a photoresist mask pattern, the pattern is a regular hexagon, the side length of the hexagon is 200nm, and the line width of the gri...

Embodiment 3

[0050] The flexible transparent conductive electrode based on the polyimide substrate of the present invention is manufactured according to the following steps:

[0051] In the first step, TiO was deposited on PI by magnetron sputtering by thermal evaporation. 2 , Cu, Ag, thicknesses are 2nm, 1nm, 20nm respectively. In this example sputtered TiO 2 Utilizes 99.999% pure TiO 2 The target material, Cu and Ag, respectively utilize 99.99% pure Cu and Ag targets. The vacuum degree in the process is ≤1.0×10 -6 Torr.

[0052] In the second step, the metal grid is fabricated by photolithography, evaporation, and lift-off methods. In this example, AZ5214 photoresist is first coated on the PI prepared in the first step, the spin coating is 1000rpm / 3s+3000rpm / 35s, the glue is baked at 112°C / 50s, the MJB4 photolithography machine is exposed for 20s, and the developer Developed to obtain a sample with a photoresist mask pattern, the pattern is a regular hexagon, the side length of the...

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Abstract

The invention discloses a flexible transparent conductive electrode based on a polyimide substrate. The flexible transparent conductive electrode based on the polyimide substrate comprises the polyimide substrate, an infiltrating layer, a metal layer, a metal mesh layer and an antireflection layer. The adhesion between the metal stack layer and the metal mesh on the substrate is ensured by setting the infiltrating layer between the PI substrate and the metal stack layer, therefore, the adhesion of the metal mesh is good, and the low square resistance of the electrode is ensured; so that the metal stack layer can be made into ultra-thin thickness, and then the good light transmittance is achieved. The layers of the electrode structure disclosed by the invention are coordinated with one another to form a complete technical scheme; therefore, the electrode light transmittance of the PI substrate disclosed by the invention is high, and the square resistance is low; and when the flexible transparent conductive electrode based on the polyimide substrate is connected with a device, the light transmittance is improved and the short circuit of the device is avoided because of the setting of the antireflection layer.

Description

technical field [0001] The invention belongs to the technical field of optoelectronic materials, and more specifically relates to a flexible transparent conductive electrode based on a polyimide (PI) substrate and a preparation method thereof. Background technique [0002] Polyimide has the highest glass transition temperature in flexible plastics. At the same time, polyimide also has excellent thermal stability and good mechanical properties. These excellent properties of polyimide make it a flexible electronics field as a substrate material priority option. Transparent conductive electrodes based on polyimide substrates can be widely used in optoelectronic displays and organic solar energy. [0003] At present, more research is done on coating the metal nanowires on the substrate, and then coating the PI film on the substrate. Although the flexible transparent conductive film produced by this method has high transmittance and low square resistance, However, its haze is r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B13/00
CPCH01B5/14H01B13/00
Inventor 屠国力曹中欢姜鹏飞李夫申九林
Owner HUAZHONG UNIV OF SCI & TECH
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