A flexible phase change material for thermal control of electronic devices

Abstract

The invention relates to a flexible phase-change material for electronic device thermal control. The flexible phase-change material comprises a phase-change substrate and a support carrier. The support carrier is an elastic polymer. The flexible phase-change material is prepared by the following steps: heating the phase-change substrate and the support carrier in the certain temperature, and placing in the environment of which the temperature is higher than the phase-change temperature after completely fusing and mixing, cooling and rolling. The flexible phase-change material can produce the deformation, such as elastic stretching, bending and torsion, while the temperature is higher than the phase transformation point. The flexible phase-change material is adhered to the surface of the heat production part or filled in clearances between a hot plate and a packaging component while used for the electronic device thermal control. The phase-change material has the good flexibility, so the phase-change material has the performance of a thermal interface material, and is capable of reducing the contract thermal resistance. The flexible phase-change material is capable of solving the problems that the installation is difficult and the contract thermal resistance is larger because the common phase-change material is excessive hard in the thermal control process of the electronic device, and greatly improving the thermal control performance.

Description

Technical field [0001] The invention relates to the technical field of phase change materials, in particular to a preparation technology and phase change thermal control technology of a composite phase change material. Background technique [0002] With the development of aerospace and electronic technology, electronic equipment tends to be highly integrated and high-power, and the heat generated by the device has increased sharply, which has brought great challenges to the heat dissipation of electronic equipment, especially the increasingly compact structure of electronic equipment The conventional cooling method puts forward space restrictions, making the cooling of electronic equipment more difficult. One way to solve this problem currently is to use high thermal conductivity interface materials, such as thermally conductive adhesives, thermally conductive pastes, and phase change thermally conductive adhesives. Most of the chip heat dissipation is mainly transmitted through...

AI Technical Summary

Problems solved by technology

However, in the existing preparation technology, the polyolefins used are mostly conventional polymers, such as high-density polyethylene, low-density polyethylene, polypropylene, etc., and the fiber orientation degree of such polymers is low (< 95%), and the molecular chain The arrangement is mostly linear, there is no physical cross-linking form, and the crystal phase cannot be separated, so it has no elasticity and high mechanical strength. The composite phase change material prepared by melting and mixing with the phase change material has a large macroscopic hardness. The tensile mechanical properties are poor, and the tensile failure is directly broken without passing through the yield stage.

[0006] It can be seen from the above that for the existing composite PCM, the greater strength and hardness lead to poor ductility and deformation resistance of PCM, and poor processability

It is prone to damage when it is installed with special structural devices, and it is prone to brittle fracture when it is cut, stretched and compressed. It cannot be processed into a film, and it is often processed into a block or strip.

Therefore, the contact with the controlled component is a solid-solid contact, and there is a problem of high surface contact thermal resistance, especially for devices with irregular structures, the contact thermal resistance is a problem that seriously affects the heat dissipation of the device

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