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Preparing method for double-whisker compound modified shrinkage-resisting aluminum nitride substrate

A composite modification and shrinkage-resistant technology, applied in the direction of manufacturing tools, ceramic molding machines, etc., can solve the problems of high content of organic glue, low relative density and easy warping of the green body, and achieve compact structure and reduced shrinkage force. , the effect of enhancing strength

Active Publication Date: 2017-10-20
江苏德纳化学股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention: in the process of preparing aluminum nitride ceramic substrates by casting method at present, the cast green body has a large content of organic glue, the relative density of the green body is low, and the shrinkage is relatively large during the sintering process. Defects that are easy to warp, providing a method for preparing a double-whisker composite modified shrinkage-resistant aluminum nitride substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0020] Take kaolin and crush it to obtain kaolin fragments, collect the kaolin fragments and place them in a ball mill jar, ball mill them at 450r / min for 3h, and pass through 200 meshes to obtain kaolin powder. Weigh 45 parts of kaolin powder, Put 10 parts of aluminum sulfate and 15 parts of sodium sulfate in a ball mill tank, ball mill and pass through a 300-mesh sieve to obtain a mixed ball mill powder, put the mixed ball mill powder in a graphite crucible, pre-fire at 250°C for 25min, and then press 15°C / Min to raise the temperature to 1250°C, heat preservation and sintering for 25 minutes, let stand and cool to room temperature, rinse with deionized water for 3 times, and dry to constant weight in an oven at 100°C to obtain a calcined billet. Mix with hydrofluoric acid solution with a mass fraction of 25%, soak for 3 hours and filter to obtain a filter cake, wash with deionized water until the washing liquid is neutral, and then dry at 100°C to constant weight to obtain m...

example 2

[0022]Take kaolin and crush it to obtain kaolin fragments, collect the kaolin fragments and place them in a ball mill jar, ball mill them at 475r / min for 4h, and pass through 200 meshes to obtain kaolin powder. In parts by weight, weigh 50 parts of kaolin powder, Put 13 parts of aluminum sulfate and 18 parts of sodium sulfate in a ball mill tank, ball mill and pass through a 300-mesh sieve to obtain a mixed ball mill powder, put the mixed ball mill powder in a graphite crucible, pre-fire at 275°C for 28min, and then press 15°C / min to 1275°C, heat preservation and sintering for 28 minutes, let stand and cool to room temperature, rinse with deionized water for 4 times, and dry in an oven at 105°C to constant weight to obtain a calcined billet. Mix with hydrofluoric acid solution with a mass fraction of 25%, soak for 4 hours and filter to obtain a filter cake, wash with deionized water until the washing liquid is neutral, and then dry at 105°C to constant weight to obtain modifie...

example 3

[0024] Take kaolin and crush it to obtain kaolin fragments, collect the kaolin fragments and place them in a ball mill jar, ball mill them at 500r / min for 5 hours, and obtain kaolin powder after passing through 200 meshes, weigh 55 parts of kaolin powder, Put 15 parts of aluminum sulfate and 20 parts of sodium sulfate in a ball mill tank, ball mill and pass through a 300-mesh sieve to obtain a mixed ball mill powder, put the mixed ball mill powder in a graphite crucible, pre-fire at 300°C for 30min, then min to 1300°C, heat preservation and sintering for 30 minutes, let stand and cool to room temperature, rinse with deionized water for 5 times, and dry in an oven at 110°C to constant weight to obtain a calcined billet. Mix with hydrofluoric acid solution with a mass fraction of 25%, soak for 5 hours and filter to obtain a filter cake, wash with deionized water until the washing liquid is neutral, and then dry at 110°C to constant weight to obtain modified whiskers. The ratio i...

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Abstract

The invention discloses a preparing method for a double-whisker compound modified shrinkage-resisting aluminum nitride substrate and belongs to the technical field of electronic packaging material preparing. By means of the preparing method, kaolin and sodium sulfate are taken to be subjected to mixing grinding, screening and sintering, a hydrofluoric acid solution is used for soaking and filtering after washing drying, washing drying is conducted after a filtering cake is obtained, and modified whiskers are obtained; then magnesium chloride, sodium borate and a potassium chloride solution are used for mixing calcination, deionized water is used for soaking filtering after a sintered material is obtained, filter residues are mixed with the modified whiskers and are mixed with polyvinyl butyral and the like to prepare a modified blank; the obtained mixture is subjected to ball grinding and screening and then is subjected to mixing grinding and defoaming with AlN powder and yttrium oxide, then tape casing is conducted, and a tape casting base is obtained; and the tape casting base is subjected to glue discharging treatment, then sintering forming is conducted, and the double-whisker compound modified shrinkage-resisting aluminum nitride substrate is obtained. The aluminum nitride substrate has the beneficial effects of being large in density, resistant to shrinkage and small in warping degree; and meanwhile the substrate has good heat conductivity and is an ideal electronic packaging material.

Description

technical field [0001] The invention discloses a method for preparing a double-whisker composite modified shrinkage-resistant aluminum nitride substrate, which belongs to the technical field of electronic packaging material preparation. Background technique [0002] Electronic packaging materials mainly include substrates, wiring, frames, interlayer dielectrics and sealing materials. Among them, the electronic packaging substrate material is a base electronic component, which mainly provides mechanical support for electronic components and their interconnections, airtight protection and promotes heat dissipation of electrical equipment. There are many types of electronic packaging substrate materials, and commonly used substrates are mainly divided into three categories: plastic packaging substrates, metal packaging substrates and ceramic packaging substrates. Among them, the ceramic packaging substrate material, as a kind of airtight packaging, has high thermal conductivit...

Claims

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Application Information

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IPC IPC(8): B28B1/29B28B11/24C04B35/80C04B35/581C04B35/622C04B35/638
CPCB28B1/29B28B11/243C04B35/581C04B35/622C04B35/638C04B35/806C04B2235/3225C04B2235/349C04B2235/44C04B2235/444C04B2235/448C04B2235/6567C04B2235/658
Inventor 吴义峰季美潘宏梅
Owner 江苏德纳化学股份有限公司
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