Phenolic foam and preparation method of same

Abstract

The invention relates to phenolic foam and a preparation method of same. The phenolic foam includes, by weight, 80-100 parts of phenolic foam, 35-42 parts of floating beads, 3-8 parts of magnesium hydroxide, 4-6 parts of ammonium polyphosphate, 2-6 parts of aluminum tripolyphosphate, 6-12 parts of a smoke inhibitor, 3-5 parts of zinc borate, 2-4 parts of decabromodiphenyl ethane, 3-6 parts of aluminum hydroxide, 3-5 parts of polyvinyl chloride, 3-8 parts of a polyurethane foamer, 3-6 parts of polyoxyethylene ether, 2-5 parts of EDTA, 3-7 parts of lauryl sodium sulfate, 6-10 parts of TBHQ, 2-8 parts of triethylene tetraamine, and 25-40 parts of ethanol. The preparation method employs easy-to-obtained raw materials and is simple, is low in cost and is green and environment-friendly. The phenolic foam has good and uniform foaming effect and is quick to foam, has enclosed pores in interior, is low in density and light in weight, is convenient to transport, is high-temperature resistant, has good fire-proofing effect, high tensile strength and good stability, is free of cracking and warping, is anti-aging, has good oxidization resistance and good insulation performance, and is prolonged in service life.

Description

technical field [0001] The invention relates to a phenolic foam and a preparation method thereof. Background technique [0002] Known as the "King of Thermal Insulation Materials", phenolic foam is a new generation of thermal insulation, fireproof and sound insulation materials. Phenolic foam material is a polymer organic rigid aluminum foil foam product, which is foamed by thermosetting phenolic resin. It has the characteristics of light weight, fireproof, non-combustible in case of open flame, smokeless, non-toxic, non-drip, wide temperature range (-196 ~ +200°C), non-shrinkage and non-brittle under low temperature environment. [0003] However, the traditional phenolic foam board has poor dimensional stability and strength, and the board surface is prone to warping when heated. To solve this problem, there are mainly two kinds of reinforcing materials currently used in the world: one is glass fiber or glass fiber braid, the addition of this material can obviously improv...

AI Technical Summary

Problems solved by technology

[0003] However, the traditional phenolic foam board has poor dimensional stability and poor strength, and the board surface is prone to warping when heated

To solve this problem, there are mainly two kinds of reinforcing materials currently used in the world: one is glass fiber or glass fiber braid, the addition of this material can obviously improve the strength index of polyurethane foam, but with the increase of fiber amount increase, the density of the foam also increases significantly, and, using this reinforcement method, the process is more complicated, and it is difficult to obtain products with good repeatability; the other is hollow glass microspheres, which use hollow glass microspheres as reinforcing materials. It can effectively increase the compressive strength and dimensional stability of the product without significantly increasing the density of the foam

However, the availability and price of glass beads limit the practicality of this method