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Preparation method of high performance and low thermal expansion coefficient polyimide film

A technology of polyimide film and low thermal expansion coefficient is applied in the field of preparation of high-performance low thermal expansion coefficient polyimide film, which can solve problems such as unfavorable size and stability, and achieve reduced thermal expansion coefficient, good mechanical properties, and no warping. the effect of the song

Inactive Publication Date: 2017-10-24
ANHUI GUOFENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many kinds of dibasic anhydrides and diamines, and polyimides with different properties can be obtained by different combinations. The thermal expansion coefficient of ordinary polyimide films prepared by existing methods is generally between 45-60ppm / ℃. Relative to the thermal expansion coefficient of copper foil, 16-17ppm / ℃ is too high, which is not conducive to the stability of the size of the thin film copper foil after lamination

Method used

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  • Preparation method of high performance and low thermal expansion coefficient polyimide film

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Embodiment 1

[0023] A preparation method of a polyimide film with high performance and low coefficient of thermal expansion, comprising the following steps:

[0024] (1) In a dissolving kettle at 60°C and normal pressure, the nano-SiO which will account for 5wt% of the final product is 2 and 1wt% silane coupling agent were added to the dimethylformamide solution, and ultrasonically mixed for 30 minutes to prepare solution A;

[0025] (2) Put biphenyltetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether in solution A for in-situ polymerization at 20°C in an atmospheric pressure reactor filled with nitrogen, and biphenyltetracarboxylic The molar ratio of anhydride and 4,4'-diaminodiphenyl ether is 0.992:1. During the polymerization reaction, first dissolve 4,4'-diaminodiphenyl ether in solution A, and then add biphenyl in four times Tetracarboxylic dianhydride, in the process of adding biphenyl tetracarboxylic dianhydride, the time interval between two adjacent additions is 30 minutes,...

Embodiment 2

[0031] A preparation method of a polyimide film with high performance and low coefficient of thermal expansion, comprising the following steps:

[0032] (1) In a dissolution kettle at 75°C and normal pressure, nano-SiO, which accounts for 10% of the final product, will be 2 and 3% silane coupling agent were added to the dimethylformamide solution, and ultrasonically mixed for 60 minutes to prepare solution A;

[0033] (2) Put biphenyltetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether in solution A for in-situ polymerization at 35°C in an atmospheric pressure reactor filled with nitrogen, and biphenyltetracarboxylic dianhydride The molar ratio of 4,4'-diaminodiphenyl ether to 4,4'-diaminodiphenyl ether is 0.995:1. During the polymerization reaction, first dissolve 4,4'-diaminodiphenyl ether in solution A, and then add biphenyl four times Formic dianhydride, in the process of adding biphenyltetracarboxylic dianhydride, the time interval between two adjacent additions is...

Embodiment 3

[0039] A preparation method of a polyimide film with high performance and low coefficient of thermal expansion, comprising the following steps:

[0040] (1) In a dissolution kettle at 80°C and normal pressure, nano-SiO, which accounts for 15% of the final product, will be 2 and 5% silane coupling agent were added to the dimethylformamide solution, and ultrasonically mixed for 90 minutes to prepare solution A;

[0041] (2) Put biphenyltetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether in solution A for in-situ polymerization at 40°C in an atmospheric pressure reactor filled with nitrogen, and biphenyltetracarboxylic dianhydride The molar ratio of 4,4'-diaminodiphenyl ether to 4,4'-diaminodiphenyl ether is 0.998:1. During the polymerization reaction, first dissolve 4,4'-diaminodiphenyl ether in solution A, and then add biphenyl four times Formic dianhydride, in the process of adding biphenyltetracarboxylic dianhydride, the time interval between two adjacent additions is...

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Abstract

The invention discloses a preparation method of a high performance and low thermal expansion coefficient polyimide film. The preparation method comprises: 1) adding nanometer SiO2 and a silane coupling agent into a dimethylacetamide solvent, and carrying out ultrasound mixing-uniform dispersing to obtain a solution A; 2) adding biphenyl tetracarboxylic diandhydride and 4,4'-diaminodiphenyl ether to the solution A, and carrying out an in situ polymerization reaction to obtain a polyamic acid solution B; 3) adding pyromellitic dianhydride and p-phenylenediamine to the solution A, and carrying out an in situ polymerization reaction to obtain a polyamic acid solution C; 4) carrying out high speed stirring on the polyamic acid solution B and the polyamic acid solution C to achieve a uniform mixing state so as to obtain a polyamic acid solution D; and 5) casting the polyamic acid solution D onto a supporting body, drying to obtain a polyamic acid gel film, and carrying out imidization treatment to obtain the high performance and low thermal expansion coefficient polyimide film. The high performance and low thermal expansion coefficient polyimide film prepared through the method of the present invention has advantages of high mechanical property, high electrical property and low thermal expansion coefficient, wherein the thermal expansion coefficient can achieve 14-18 ppm / DEG C.

Description

technical field [0001] The invention relates to the field of film preparation, in particular to a preparation method of a polyimide film with high performance and low thermal expansion coefficient. Background technique [0002] Polyimide is a class of highly regular polymers with imide rings (-CO-NH-CO) on the main chain of the polymer. Its special imide ring structure makes it have excellent mechanical, thermal, dielectric, mechanical, radiation resistance and solvent resistance properties, and is widely used in aviation, aerospace, microelectronics, automobile industry and other fields. With the rapid development of electronic products towards thinner and miniaturized, when used as a base film on a flexible circuit board, the requirements for the mechanical properties and dimensional stability of the film are getting higher and higher. [0003] Ordinary polyimide films are required to be synthesized from dibasic anhydrides and diamines, and the raw materials are abundant ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K9/06C08K3/36C08J5/18C08G73/10
CPCC08J5/18C08G73/1007C08G73/1042C08G73/1067C08G73/1071C08J2379/08C08K3/36C08K9/06C08K2201/003C08K2201/011C08L2201/08C08L2203/16C08L79/08
Inventor 吴天华孙善卫史恩台
Owner ANHUI GUOFENG PLASTIC
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