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Copper-based amorphous solder ball for area array packaging and preparation method and packaging method of copper-based amorphous solder ball

A packaging method and surface array technology, applied in welding equipment, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., can solve the problems of complex preparation method, high equipment requirements, low efficiency, etc., and achieve stable chemical composition and equipment requirements. High and efficient effect

Active Publication Date: 2017-10-27
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the techniques for preparing BGA solder balls can be divided into the following principles: 1) direct pouring method, but the pouring process is difficult to guarantee the sphericity; 2) wire cutting and remelting method, but it requires high equipment; Paste printing reflow method, relying on reflow melting to form solder balls on the pad, the process is complicated, the equipment is expensive, and the efficiency is low; 4) The slice remelting method is similar to the wire cutting remelting method; 5) The piezoelectric vibration method is prepared by this method Solder balls still need precise screening and shape selection, which is difficult
[0004] At present, many area array packaging structures are electroplated with a UBM layer, that is, a Cr layer, a Cu layer, a Ni layer, and an Au layer are sequentially plated on a silicon wafer to improve wettability and reliability of solder joints, but the preparation method is complicated and costly. high

Method used

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  • Copper-based amorphous solder ball for area array packaging and preparation method and packaging method of copper-based amorphous solder ball
  • Copper-based amorphous solder ball for area array packaging and preparation method and packaging method of copper-based amorphous solder ball
  • Copper-based amorphous solder ball for area array packaging and preparation method and packaging method of copper-based amorphous solder ball

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Experimental program
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Effect test

Embodiment 1

[0041] Use a balance to weigh 39.1g of Cu with a purity of 99.99%, 53.6g of Zr with a purity of 99.9%, 1.6g of Al with a purity of 99.99%, and 5.8g of Y with a purity of 99.9%, and slightly polish the surface with water sandpaper to remove part of the oxide film , put it in the melting crucible after drying with cold air, and the flow rate into the melting crucible is 0.1m 3 / h Ar gas or nitrogen, under the action of induction coil, copper and tin are melted into an alloy, and the alloy is smelted repeatedly for 3 times. After cooling to room temperature, stop the ventilation, take out the alloy, and cut it into small pieces of alloy within 10*10*20mm , placed in a vertical gas atomization nozzle, induction heated to a molten state under the protection of nitrogen or argon, nitrogen or argon impacts the molten alloy ejected from the nozzle under the pressure of nitrogen or argon, to achieve gas atomization powder making , to obtain the powder mixture that has been preliminaril...

Embodiment 2

[0045] Use a balance to weigh 39.1g of Cu with a purity of 99.99%, 53.6g of Zr with a purity of 99.9%, 1.6g of Al with a purity of 99.99%, and 5.8g of Y with a purity of 99.9%, and slightly polish the surface with water sandpaper to remove part of the oxide film , put it in the melting crucible after drying with cold air, and the flow rate into the melting crucible is 0.1m 3 / h Ar gas or nitrogen, under the action of induction coil, copper and tin are melted into an alloy, and the alloy is smelted repeatedly for 3 times. After cooling to room temperature, stop the ventilation, take out the alloy, and cut it into small pieces of alloy within 10*10*20mm , placed in a vertical gas atomization nozzle, induction heated to a molten state under the protection of nitrogen or argon, nitrogen or argon impacts the molten alloy ejected from the nozzle under the pressure of nitrogen or argon, to achieve gas atomization powder making , to obtain the powder mixture that has been preliminaril...

Embodiment 3

[0048] Use a balance to weigh 33.6g of Cu with a purity of 99.99%, 58g of Zr with a purity of 99.9%, 2.5g of Al with a purity of 99.99%, and 5.9g of Y with a purity of 99.9%. The surface is lightly polished with water sandpaper to remove part of the oxide film, and cool air After drying, put it in the melting crucible, and the flow rate into the melting crucible is 0.1m 3 / h Ar gas or nitrogen, under the action of induction coil, copper and tin are melted into an alloy, and the alloy is smelted repeatedly for 3 times. After cooling to room temperature, stop the ventilation, take out the alloy, and cut it into small pieces of alloy within 10*10*20mm , placed in a vertical gas atomization nozzle, induction heated to a molten state under the protection of nitrogen or argon, nitrogen or argon impacts the molten alloy ejected from the nozzle under the pressure of nitrogen or argon, to achieve gas atomization powder making , to obtain the powder mixture that has been preliminarily si...

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Abstract

The invention provides a copper-based amorphous solder ball for area array packaging and a preparation method and packaging method of the copper-based amorphous solder ball. The copper-based amorphous solder ball for area array packaging adopts amorphous spherical Cu46Zr42Al7Y5 powder, wherein in an packaging process, the amorphous spherical Cu46Zr42Al7Y5 powder is bonded to a bonding pad by molten Sn through a diffusion reaction. According to the technical scheme of the invention, area array packaging and interconnection are realized by adopting the copper-based Cu46Zr42Al7Y5 amorphous solder ball, the copper-based Cu46Zr42Al7Y5 amorphous solder ball does not melt in the interconnection process, and can achieve bonding only through the diffusion reaction in the interconnection process, the height of the solder ball almost has no change; besides, the bonding process is short in time consumption, the bonding pad is not needed to be coated with a solder mask and an Au layer, the shape of the solder ball does not change obviously after the interconnection is completed, and the high temperature resistance and electro migration resistance are improved.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a copper-based amorphous solder ball for area array packaging, a preparation method and a packaging method thereof. Background technique [0002] The spherical materials currently used for area array packaging include: 1) SnPb balls, but Sn tin-lead solder balls are harmful to the human body. At present, many countries have explicitly banned the use of tin-lead solder. Based on this, the tin-copper lead-free solder in the electronic packaging industry came into being. 2) For lead-free solder balls with high Sn content, during the soldering process, the solder balls will fuse with the solder paste to connect the package body and the pad. The composition of common solder balls is generally Sn / Ag / Cu or Sn-Ag-Cu composite solder with graphene added. There are brittle SnBi and Sn-Ag-Bi-In, but In has weak radioactivity and also has SnZn solder balls, etc. M...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/32B23K35/40B23K37/00C22C1/03C22C30/02
CPCB23K35/32B23K35/40B23K37/00C22C1/03C22C30/02
Inventor 计红军梁孟李明雨马鑫黄嘉一
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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