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Micro-patterned wetted surface, preparation method of micro-patterned wetted surface, and micro-patterned wetted surface applicable to spray cooling device

A technology of micro-patterning and spray cooling, which is applied in micro-structure devices, manufacturing micro-structure devices, processes for producing decorative surface effects, etc. Achieve the effect of reducing working fluid retention, increasing heat transfer rate, and preventing film boiling

Pending Publication Date: 2017-11-07
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing micropatterned wettability surface preparation technology has few reports or complex preparation process, expensive equipment, and is not suitable for large-scale application

Method used

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  • Micro-patterned wetted surface, preparation method of micro-patterned wetted surface, and micro-patterned wetted surface applicable to spray cooling device
  • Micro-patterned wetted surface, preparation method of micro-patterned wetted surface, and micro-patterned wetted surface applicable to spray cooling device
  • Micro-patterned wetted surface, preparation method of micro-patterned wetted surface, and micro-patterned wetted surface applicable to spray cooling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] (1) Metal substrate cleaning: The polished pure titanium sheet (99.9%) was ultrasonically cleaned with acetone for 15 minutes, ethanol for 15 minutes, hydrochloric acid with a mass fraction of 15% for 15 minutes, and distilled water for 15 minutes. .

[0041] (2) Anodizing: Put the cleaned titanium sheet as the anode and the platinum sheet as the cathode into glycerol, H2 O (20vol%) and NH 4 F (1.0 wt%) in the electrolyte. In a constant temperature water bath at 30°C, under a voltage of 20V, anodize for 2 hours, and the boost rate is 0.1 V s -1 . After taking it out, rinse it repeatedly with deionized water, and place it in an oven at 80°C for 20 minutes.

[0042] (3) Annealing: Take the titanium sheet out of the oven and place it in a box-type resistance furnace for annealing at a heating rate of 5 °C min -1 , annealed at 300°C for 2h, and cooled naturally to room temperature.

[0043] (4) Hydrophobic treatment: Soak the annealed titanium sheet in n-hexane solutio...

Embodiment 2

[0047] (1) Metal substrate cleaning: The polished pure titanium sheet (99.9%) was ultrasonically cleaned with acetone for 15 minutes, ethanol for 15 minutes, hydrochloric acid with a mass fraction of 15% for 15 minutes, and distilled water for 15 minutes. .

[0048] (2) Anodizing: Put the cleaned titanium sheet as the anode and the platinum sheet as the cathode into glycerol, H 2 O (20vol%) and NH 4 F (1.0 wt%) in the electrolyte. In a constant temperature water bath at 20°C, under the voltage of 20V, anodize for 4h, and the boost rate is 0.1 V s -1 . After taking it out, rinse it repeatedly with deionized water, and place it in an oven at 80°C for 40 minutes.

[0049] (3) Annealing: Take the titanium sheet out of the oven and place it in a box-type resistance furnace for annealing at a heating rate of 5 °C min -1 , annealed at 300°C for 2h, and cooled naturally.

[0050] (4) Hydrophobic treatment: Soak the annealed titanium sheet in a n-hexane solution containing 4% tri...

Embodiment 3

[0054] (1) Metal substrate cleaning: The polished pure titanium sheet (99.9%) was ultrasonically cleaned with acetone for 15 minutes, ethanol for 15 minutes, hydrochloric acid with a mass fraction of 15% for 15 minutes, and distilled water for 15 minutes. .

[0055] (2) Anodizing: Put the cleaned titanium sheet as the anode and the platinum sheet as the cathode into glycerol, H 2 O (30vol%) and NH 4 F (2.0 wt%) in the electrolyte. In a constant temperature water bath at 30°C, under the voltage of 40V, anodize for 2 h, and the boost rate is 0.1 V s -1 . After taking it out, rinse it repeatedly with deionized water, and place it in an oven at 120°C for 30 minutes.

[0056] (3) Annealing: Take the titanium sheet out of the oven and place it in a box-type resistance furnace for annealing at a heating rate of 5 °C min -1 , annealed at 400 ° C for 1 h, and cooled naturally.

[0057] (4) Hydrophobic treatment: Soak the annealed titanium sheet in n-heptane solution containing oc...

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Abstract

The invention discloses a micro-patterned wetted surface, a preparation method of the micro-patterned wetted surface, and the micro-patterned wetted surface applicable to a spray cooling device. The surface has metal as the substrate, and has the patterned non-uniform wettability; the patterned non-uniformity is that: hydrophilic areas are uniformly distributed in a hydrophobic area; the thickness is 50-500 nm; the contact angle of pure water on the surface of the hydrophilic part is 0-45 DEG; and the contact angle of a hydrophobic part is 135-175 DEG. The spray cooling device is characterized in that a heat exchange surface is directly contacted with the micro-patterned wetted surface; due to the surface, saturated boiling evaporation of a working medium under the high heat flux density is easy; the thickness of a liquid film is reduced; formation of steam bubbles is easy; the critical heat flux density is increased; and simultaneously, retention and scaling of the working medium are reduced. The micro-patterned wetted surface disclosed by the invention is simple in preparation process, free from pollution, easy to operate, good in surface quality and low in cost, and has wide application prospect and huge market benefits in the aspects, such as heat exchangers and sea water desalination.

Description

technical field [0001] The invention relates to the technical field of heat transfer enhancement and energy saving, in particular to a micropatterned wettability surface, a preparation method thereof and application to a spray cooling device. Background technique [0002] In recent years, with the miniaturization and high integration of electronic devices, the heat dissipation of electronic devices has shown a rapid increase. Any electronic device has its operating temperature limit. If effective cooling measures are not taken to ensure that the device works at a temperature lower than the upper limit, the work efficiency will be greatly reduced, and the device will burn out in severe cases. Developed cooling technology can improve the stability and efficiency of electronic device operation, which will surely benefit many industries. The spray cooling technology uses high-pressure gas or its own pressure to atomize the liquid into small particles through the nozzle, and for...

Claims

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Application Information

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IPC IPC(8): B81C1/00H01L23/367H01L23/427B82Y40/00
CPCH01L23/3672H01L23/4275B81C1/00214B81C1/00349B82Y40/00
Inventor 蒋翔朱琦黄鹏余永龙
Owner SOUTH CHINA UNIV OF TECH
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