Heat-resisting and flame-retardant epoxy resin adhesive

Abstract

The invention discloses a heat-resisting and flame-retardant epoxy resin adhesive. The heat-resisting and flame-retardant epoxy resin adhesive is prepared from the following raw materials in parts by weight: 65 to 85 parts of epoxy resin with a fluorene-containing structure, 3 to 15 parts of phenolic epoxy resin, 10 to 25 parts of 2-ethyl-hexyl glycidyl ether, 20 to 35 parts of 9,9-bis(4-aminophenyl) fluorene, 5 to 12 parts of 2,6,10-trimethyl-2,6,10-triazaundecane, 2 to 4.5 parts of curing accelerator, 20 to 35 parts of flexibilizer, 2 to 8 parts of pentaerythritol, 1 to 5 parts of ammonium polyphosphate, 2 to 15 parts of phosphorus and nitrogen flame retardant, 0.2 to 1.3 parts of defoaming agent, 0.2 to 1.5 parts of stabilizer, 1 to 5 parts of polyetheretherketone, 2 to 5 parts of calcium silicate, 1 to 5 parts of chlorite, 1 to 4 parts of aluminum silicate, 1 to 2 parts of magnesium oxide and 2 to 5 parts of expandable graphite. The heat-resisting and flame-retardant epoxy resin adhesive disclosed by the invention has the advantages of high heat resistance, excellent flame retardant property and high bonding strength with a matrix.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a heat-resistant and flame-retardant epoxy resin adhesive. Background technique [0002] Epoxy resin refers to an organic compound containing two or more epoxy groups in its molecule. Its molecular chain contains active epoxy groups, which can cross-link with various types of curing agents to form insoluble resins. A polymer with a three-way network structure. The cured epoxy resin has good physical and chemical properties, and it has excellent bonding strength to the surface of metal and non-metal materials, and has become an important matrix material for adhesives. However, the fracture energy and fracture toughness of epoxy resin are far lower than those of other plastics, and they are not heat-resistant, and the defect of bond strength will decrease during use. At the same time, as an organic material, its flame retardancy is not good. The prepared adhesive has the defect...

AI Technical Summary

Problems solved by technology

However, the fracture energy and fracture toughness of epoxy resin are far lower than those of other plastics, and they are not heat-resistant, and the defect of bond strength will decrease during use. At the same time, as an organic material, its flame retardancy is not good. The prepared adhesive has the defects of poor heat resistance and flame retardancy, which limits the application of epoxy resin adhesives