Cr-doped heterojunction spin field effect transistor and preparation method thereof
A field effect transistor and heterojunction technology, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problem that the efficiency of spin injection is only a few percent, so as to improve the efficiency of spin injection and reception, and simplify the manufacture. , the effect of optimizing the spin polarizability
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Embodiment 1
[0040] See figure 1 , figure 1 A flow chart of a method for preparing a Cr-doped heterojunction spin field effect transistor provided in an embodiment of the present invention, wherein the preparation method includes:
[0041] (a) select a sapphire substrate;
[0042] (b) Growth of Ga on the surface of sapphire substrate by MBE process 2 o 3 epitaxial layer;
[0043](c) in Ga 2 o 3 The epitaxial layer is implanted with Cr ions to form source and drain regions;
[0044] (d) making ohmic contact source and drain on the surface of source region and drain region;
[0045] (e) Ga 2 o 3 An isolation layer is grown on the surface of the epitaxial layer;
[0046] (f) in Ga 2 o 3 A schottky contact gate electrode is made on the surface of the epitaxial layer to complete the preparation of the spin field effect transistor.
[0047] Among them, Ga 2 o 3 As a wide bandgap semiconductor, its bandgap can reach 4.9ev, while the existing SiC material has a bandgap of only 3ev; ...
Embodiment 2
[0059] Please refer to Figure 2a-Figure 2g , Figure 2a-Figure 2g A schematic diagram of the preparation process of a Cr-doped heterojunction spin field effect transistor provided by the embodiment of the present invention, the preparation method includes the following steps:
[0060] Step 1, such as Figure 2a As shown, the sapphire substrate 001 was selected, and the sapphire substrate was ultrasonically cleaned using acetone, absolute ethanol and deionized water in sequence.
[0061] Step 2, such as Figure 2b As shown, lightly doped Ga with a thickness of 0.4-0.6 μm was grown on the surface of sapphire substrate by MBE 2 o 3 Epitaxial layer 002, N-type doping concentration is 1×10 14 -1×10 16 cm -3 ; The evaporation source material is high-purity elemental metal Ga, the mass fraction is 99.99999%, the growth temperature is 940°C, the power of the radio frequency source is 300W, and the pressure is 1.5×10 -5 Torr;
[0062] Step 3, such as Figure 2c As shown, in ...
Embodiment 3
[0074] Please refer to image 3 , image 3 A schematic structural diagram of a Cr-doped heterojunction spin field effect transistor provided by an embodiment of the present invention. The spin field effect transistor adopts the above-mentioned as Figure 2a-Figure 2g prepared as indicated.
[0075] Specifically, the spin field effect transistor includes: a sapphire substrate 301, a Ga 2 o 3 Epitaxial layer 302, Ga 2 o 3 Source region 303, Ga 2 o 3 Drain region 304 , source 305 , drain 306 , isolation layer 307 , Schottky contact gate electrode 308 .
[0076] Among them, Ga 2 o 3 source region 303 and Ga 2 o 3 The drain region 304 is made of Ga 2 o 3 The epitaxial layer 302 is formed by selectively implanting Cr ions six times.
[0077] Preferably, Ga 2 o 3 The epitaxial layer 302 has an N-type doping concentration of 1×10 14 -1×10 16 cm -3 , Ga with a point-defect structure with a thickness of 0.4–0.6 μm 2 o 3 Material.
[0078] Preferably, the isolation...
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