Nonaqueous dispersion containing fluorine-based resin, polyimide precursor solution composition containing fluorine-based resin, polyimide, polyimide film and adhesive composition for circuit boards, each using said polyimide precursor solution composition containing fluorine-based resin; and production methods thereof

A technology of polyimide precursors and fluorine-based resins, which is applied in the direction of circuit substrate materials, chemical instruments and methods, polymer adhesive additives, etc., and can solve problems that are difficult to hint and have no proven effect

Active Publication Date: 2017-12-01
MITSUBISHI PENCIL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, in Patent Document 12, it is not assumed that particles of 1 μm or less are used in the case of using polytetrafluoroethylene fine powder, or it is difficult to suggest that the powder is dispersed.
[0028] In addition, in paragraph [0057] of this patent document 12, it is described that "additives such as quartz sand, carbon black, diamond, tourmaline, germanium, alumina, silicon nitride, and extender pigments may be contained alone", but these components are optional. Components, there are no descriptions, hints, etc. about the effects of these components in the fluoropolymer non-aqueous dispersion liquid, and in Patent Document 12, the effects, etc., are not confirmed in the examples, etc.

Method used

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  • Nonaqueous dispersion containing fluorine-based resin, polyimide precursor solution composition containing fluorine-based resin, polyimide, polyimide film and adhesive composition for circuit boards, each using said polyimide precursor solution composition containing fluorine-based resin; and production methods thereof
  • Nonaqueous dispersion containing fluorine-based resin, polyimide precursor solution composition containing fluorine-based resin, polyimide, polyimide film and adhesive composition for circuit boards, each using said polyimide precursor solution composition containing fluorine-based resin; and production methods thereof
  • Nonaqueous dispersion containing fluorine-based resin, polyimide precursor solution composition containing fluorine-based resin, polyimide, polyimide film and adhesive composition for circuit boards, each using said polyimide precursor solution composition containing fluorine-based resin; and production methods thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0154] Well-known methods, predetermined conditions, etc. can be suitably used for preparation of this polyimide precursor solution.

[0155] Usable tetracarboxylic dianhydrides include, for example, 1,2,5,6-naphthalene tetracarboxylic dianhydride, 1,4,5,8-naphthalene tetracarboxylic dianhydride, 2,2'-bis (3,4-dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, perylene-3,4,9,10-tetracarboxylic dianhydride, pyromellitic acid di anhydride (PMDA), 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA), 2, 3,3',4'-Biphenyltetracarboxylic dianhydride (a-BPDA), 2,3,6,7-naphthalene tetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride , Ethylene tetracarboxylic dianhydride, Ethylene glycol dianhydro trimellitate, 1,3,3a,4,5,9b-hexahydro-5 (tetrahydro-2,5-dioxa-3-furan base) naphtho[1,2-c]furan-1,3-dione, 1,2,3,4-butanetetracarboxylic dianhydride, etc., and these may be used alone or ...

Embodiment 1～3 and comparative example 1～3

[0255] [Examples 1-3 and Comparative Examples 1-3: Preparation of Polyimide Precursor Solution Composition of Fluorine-Containing Resin]

[0256]

[0257] (1-a) Preparation of polyimide precursor solution

[0258] Add 400 parts by mass of N,N-dimethylacetamide, 27 parts by mass of p-phenylenediamine, 3,3',4,4'-biphenyltetracarboxylic acid di 73 mass parts of hydrates were mixed, and it stirred at 50 degreeC for 10 hours, and obtained the polyimide precursor solution of 18 mass % of solid content concentration.

[0259] (1-b) Non-aqueous dispersion of fluororesin Dispersion 1 in Table 1 above was used.

[0260] (1-c) Method for producing polyimide precursor solution composition of fluorine-containing resin

[0261] 18 parts by mass of Dispersion 1 (PTFE content: 30% by mass) was added to the polyimide precursor solution prepared in 1-a, stirred and mixed for 10 minutes, and PTFE containing 30% by mass relative to the resin component was obtained. The polyimide precursor so...

Embodiment 2

[0265] By the method similar to Example 1, the polyimide precursor solution composition (2-b) of a fluorine-containing resin was obtained by the formulation shown in following Table 2 using the dispersion 2. Moreover, the polyimide film (2-d) was formed by the method similar to Example 1.

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Abstract

In order to provide a dispersion wherein the dispersed state of a fluorine-based resin is uniformly controlled, a polyimide precursor solution composition using this dispersion, an adhesive composition, a polyimide and polyimide film obtained from this polyimide precursor solution composition and having excellent heat resistance, excellent mechanical characteristics, excellent electrical characteristics such as lower dielectric constant and lower dielectric loss tangent, and excellent processability, a method for producing the polyimide, a method for producing the polyimide film, and a circuit board and coverlay film using the polyimide film, the present invention provides: a polyimide precursor solution composition containing a fluorine-based resin, which is characterized by containing a polyimide precursor solution and a nonaqueous dispersion of a fluorine-based resin containing a micropowder of a fluorine-based resin and a butyral resin or a fluorine-based additive containing at least a fluorine-containing group and a lipophilic group; and an adhesive composition.

Description

technical field [0001] The present invention relates to non-aqueous dispersions of fluorine-containing resins, polyimide precursor solution compositions of fluorine-containing resins, polyimides using them, polyimide films, and methods for their production. In other words, it relates to a polyimide precursor solution composition in which the dispersion state of a fluorine-based resin is uniformly controlled, heat resistance, mechanical properties, and electrical properties (low dielectric constant, low dielectric loss) obtained from the composition. Angle tangent), polyimide excellent in processability; polyimide film; and their production method; adhesive composition for circuit board used in the manufacture of circuit board; and laminated board for circuit board using the same ; Cover film; Prepreg, etc. Background technique [0002] In recent years, along with the advancement of high-speed electronic equipment, high-function, etc., high-speed communication speed and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18B32B15/08C08J5/18C08J5/24C08K3/00C08L79/08C09J11/08C09J163/00C09J179/04H05K1/03
CPCB32B15/08C08J5/18C08K3/00C09J11/08C09J163/00C09J179/04C08L27/18C08L79/08H05K1/03C08J5/244C08J5/249C08J3/11C08K9/00C08J5/24
Inventor 佐藤厚志阿部宽史铃木孝典新村友佳子
Owner MITSUBISHI PENCIL CO LTD
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