Nonaqueous dispersion containing fluorine-based resin, polyimide precursor solution composition containing fluorine-based resin, polyimide, polyimide film and adhesive composition for circuit boards, each using said polyimide precursor solution composition containing fluorine-based resin; and production methods thereof

A technology of polyimide precursors and fluorine-based resins, which is applied in the direction of circuit substrate materials, chemical instruments and methods, polymer adhesive additives, etc., and can solve problems that are difficult to hint and have no proven effect
CN107429028AActive Publication Date: 2017-12-01MITSUBISHI PENCIL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MITSUBISHI PENCIL CO LTD
Publication Date
2017-12-01

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Abstract

In order to provide a dispersion wherein the dispersed state of a fluorine-based resin is uniformly controlled, a polyimide precursor solution composition using this dispersion, an adhesive composition, a polyimide and polyimide film obtained from this polyimide precursor solution composition and having excellent heat resistance, excellent mechanical characteristics, excellent electrical characteristics such as lower dielectric constant and lower dielectric loss tangent, and excellent processability, a method for producing the polyimide, a method for producing the polyimide film, and a circuit board and coverlay film using the polyimide film, the present invention provides: a polyimide precursor solution composition containing a fluorine-based resin, which is characterized by containing a polyimide precursor solution and a nonaqueous dispersion of a fluorine-based resin containing a micropowder of a fluorine-based resin and a butyral resin or a fluorine-based additive containing at least a fluorine-containing group and a lipophilic group; and an adhesive composition.
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Description

technical field

[0001] The present invention relates to non-aqueous dispersions of fluorine-containing resins, polyimide precursor solution compositions of fluorine-containing resins, polyimides using them, polyimide films, and methods for their production. In other words, it relates to a polyimide precursor solution composition in which the dispersion state of a fluorine-based resin is uniformly controlled, heat resistance, mechanical properties, and electrical properties (low dielectric constant, low dielectric loss) obtained from the composition. Angle tangent), polyimide excellent in processability; polyimide film; and their production method; adhesive composition for circuit board used in the manufacture of circuit board; and laminated board for circuit board using the same ; Cover film; Prepreg, etc. Background technique

[0002] In recent years, along with the advancement of high-speed electronic equipment, high-function, etc., high-speed communication speed and the ...

Claims

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