Novel cleaning fluid special for diode semiconductor
A diode semiconductor and cleaning liquid technology, applied in the direction of detergent compounding agent, detergent composition, organic cleaning composition, etc., can solve the problems that cannot effectively reduce the corrosion of wafers and substrates, affect product quality, etc., and achieve strong penetration , good water solubility, and the effect of improving quality
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Embodiment 1
[0018] The new type of diode semiconductor cleaning solution in this embodiment includes the following components by weight: 3 parts of quaternary ammonium hydroxide, 6 parts of polyacrylic acid corrosion inhibitor, 6 parts of alkyl glycol aryl ether, and 4 parts of surfactant , 10 parts of alkyl benzyl dimethyl ammonium chloride, containing CU 2+ 10 parts of mixed solution, 3 parts of ferric nitrate, 9 parts of ethanol and 30 parts of deionized water; Wherein, surfactant is the mixture of alcohol ether and phenol ether surfactant, and the mass ratio of alcohol ether and phenol ether is 2.1: 1.
Embodiment 2
[0020] The new type of diode semiconductor cleaning solution in this embodiment includes the following components by weight: 3 parts of quaternary ammonium hydroxide, 6 parts of polyacrylic acid corrosion inhibitor, 6 parts of alkyl glycol aryl ether, and 4 parts of surfactant , 10 parts of alkyl benzyl dimethyl ammonium chloride, containing CU 2+ 10 parts of mixed solution, 3 parts of ferric nitrate, 9 parts of ethanol and 30 parts of deionized water; Wherein, surfactant is the mixture of alcohol ether and phenol ether surfactant, and the mass ratio of alcohol ether and phenol ether is 2.5: 1.
Embodiment 3
[0022] The new type of diode semiconductor cleaning solution in this embodiment includes the following components by weight: 3 parts of quaternary ammonium hydroxide, 6 parts of polyacrylic acid corrosion inhibitor, 6 parts of alkyl glycol aryl ether, and 4 parts of surfactant , 10 parts of alkyl benzyl dimethyl ammonium chloride, containing CU 2+ 10 parts of mixed solution, 3 parts of ferric nitrate, 9 parts of ethanol and 30 parts of deionized water; Wherein, surfactant is the mixture of alcohol ether and phenol ether surfactant, and the mass ratio of alcohol ether and phenol ether is 2.3: 1.
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