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Novel cleaning fluid special for diode semiconductor

A diode semiconductor and cleaning liquid technology, applied in the direction of detergent compounding agent, detergent composition, organic cleaning composition, etc., can solve the problems that cannot effectively reduce the corrosion of wafers and substrates, affect product quality, etc., and achieve strong penetration , good water solubility, and the effect of improving quality

Inactive Publication Date: 2017-12-12
RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Alkyl glycol aryl ether 5-8%, surfactant 3-5%, alkyl benzyl dimethyl ammonium chloride 8-10%, synergist 8-10%, ethanol 8-10%, remove The remaining amount of ionized water; reasonable allocation of the effective components and the amount of solvent can quickly and thoroughly reduce the surface tension of the cleaning solution itself at room temperature, so that the cleaning solution has the characteristics of good water solubility, strong penetration, and no pollution environment; but it cannot effectively reduce the corrosion of wafers and substrates, which in turn will affect the quality of products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The new type of diode semiconductor cleaning solution in this embodiment includes the following components by weight: 3 parts of quaternary ammonium hydroxide, 6 parts of polyacrylic acid corrosion inhibitor, 6 parts of alkyl glycol aryl ether, and 4 parts of surfactant , 10 parts of alkyl benzyl dimethyl ammonium chloride, containing CU 2+ 10 parts of mixed solution, 3 parts of ferric nitrate, 9 parts of ethanol and 30 parts of deionized water; Wherein, surfactant is the mixture of alcohol ether and phenol ether surfactant, and the mass ratio of alcohol ether and phenol ether is 2.1: 1.

Embodiment 2

[0020] The new type of diode semiconductor cleaning solution in this embodiment includes the following components by weight: 3 parts of quaternary ammonium hydroxide, 6 parts of polyacrylic acid corrosion inhibitor, 6 parts of alkyl glycol aryl ether, and 4 parts of surfactant , 10 parts of alkyl benzyl dimethyl ammonium chloride, containing CU 2+ 10 parts of mixed solution, 3 parts of ferric nitrate, 9 parts of ethanol and 30 parts of deionized water; Wherein, surfactant is the mixture of alcohol ether and phenol ether surfactant, and the mass ratio of alcohol ether and phenol ether is 2.5: 1.

Embodiment 3

[0022] The new type of diode semiconductor cleaning solution in this embodiment includes the following components by weight: 3 parts of quaternary ammonium hydroxide, 6 parts of polyacrylic acid corrosion inhibitor, 6 parts of alkyl glycol aryl ether, and 4 parts of surfactant , 10 parts of alkyl benzyl dimethyl ammonium chloride, containing CU 2+ 10 parts of mixed solution, 3 parts of ferric nitrate, 9 parts of ethanol and 30 parts of deionized water; Wherein, surfactant is the mixture of alcohol ether and phenol ether surfactant, and the mass ratio of alcohol ether and phenol ether is 2.3: 1.

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PUM

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Abstract

The invention relates to a novel cleaning fluid special for a diode semiconductor. The novel cleaning fluid is prepared from the following components in parts by weight: 3-5 parts of quaternary ammonium hydroxide, 6-12 parts of polyacrylic acid corrosion inhibitor, 6-10 parts of alkyl glycol aryl ether, 4-8 parts of surfactant, 10-14 parts of alkyl benzyl dimethyl ammonium chloride, 10-14 parts of synergist, 3-5 parts of oxidizing agent, 9-11 parts of ethyl alcohol and 30-50 parts of deionized water, wherein a mixture of alcohol ether and phenolic ether surfactant is served as the surfactant and the mass ratio of alcohol ether to phenolic ether is (2.1-2.5) to 1. The invention has the advantages that the dosage of all the active components and solvents is reasonably arranged in the novel cleaning fluid special for the diode semiconductor provided by the invention, the cleaning fluid is capable of quickly and thoroughly reducing the surface tension of the cleaning fluid under room temperature and the cleaning fluid has the characteristics of high water solubility and high seepage force; the selected formula components are free from environmental pollution and risk and will not damage atmosphere; the cleaned effluent is conveniently treated and discharged, so that the environmental protection can be guaranteed.

Description

technical field [0001] The invention belongs to the technical field of semiconductor industry, in particular to a new type of diode semiconductor [0002] Body cleaning solution. Background technique [0003] Diodes are the basis for the development of the modern microelectronics industry. As early as the last century, the diode manufacturing process has been very mature and widely used in various fields of the electronics industry. In industries with low profit and low technical content, in order to ensure a certain profit, a large number of substances harmful to human body are used as cleaning liquids for cleaning the surface of diodes in the diode industry. How to develop low-cost, pollution-free products while ensuring the effect? A new type of cleaning fluid has become an urgent requirement. [0004] So far, among various cleaning methods, chemical cleaning is mostly used, that is, using chemical cleaning agents to clean electronic components, especially diodes, with ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/835C11D3/60C11D3/37C11D3/30C11D3/20C11D3/04
CPCC11D1/8305C11D1/62C11D1/721C11D3/048C11D3/201C11D3/2068C11D3/30C11D3/3765
Inventor 曹建民
Owner RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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