A method for preparing tubular target material
A target and tubular technology, applied in the field of solar energy application materials, can solve the problems of blockage of powder feeding system, high production cost and low yield of alloy powder, etc.
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Embodiment 1
[0057] (1) Preparation of copper indium gallium alloy powder for transition layer
[0058] 1) Weigh 50kg of elemental indium, 30kg of elemental copper and 20kg of elemental gallium respectively, that is, the atomic ratio of copper / (indium+gallium) is 0.65, the atomic ratio of indium / (indium+gallium) is 0.60, and the atomic ratio of gallium / (indium+gallium) The atomic ratio is 0.40 to make the alloy powder for the transition layer.
[0059] 2) Smelting and atomization powder making are carried out in the gas atomization powder making machine. Wherein the gas atomization powder making machine includes a main body, in which a vacuum melting chamber and an atomizing chamber are sequentially arranged from top to bottom, and the two chambers are connected by a tundish with a metal liquid guide pipe. The vacuum melting chamber is equipped with a melting device and a heating device, the heating device heats the melting device, the melting device has a liquid outlet, and the liquid ou...
Embodiment 2
[0074] The difference between this embodiment and embodiment 1 is only:
[0075] Pass demineralized water with a temperature of 15-25°C into the hollow backing pipe, and the temperature of the demineralized water when it leaves the backing pipe is 30-40°C. At the same time, nitrogen is blown to the surface of the backing pipe to cool, and the flow rate of nitrogen is 100m 3 / h;
[0076] The process of plasma spraying the transition layer is as follows: the plasma gas is argon, the flow rate is 60L / min, the voltage is 40V, the current is 450A, the powder feeding rate is 60 g / min, the thickness of the copper indium gallium transition layer is 250 μm; the plasma spraying target layer The parameters are voltage 55V, current 600A, spraying distance 150mm, flow rate of plasma gas argon 140L / min, powder feeding rate of copper indium gallium alloy powder 200g / min, thickness of copper indium gallium alloy target layer is 3mm.
[0077] The prepared copper indium gallium tubular target...
Embodiment 3
[0079] The difference between this embodiment and embodiment 1 is only:
[0080] Only use cooling water for cooling, without nitrogen cooling and protection, specifically: pass softened water with a temperature of 15-25°C into the hollow backing pipe, and the temperature of the softened water when it leaves the backing pipe is 35-40°C;
[0081] The plasma gas for plasma spraying the transition layer is argon, the flow rate is 120L / min, the powder feeding rate is 100 g / min, and the thickness of the copper indium gallium transition layer is 200 μm;
[0082] The voltage of the transition layer plasma spraying target layer is 50V, the current is 550A, the spraying distance is 130mm, the powder feeding rate is 90g / min, the flow rate of plasma gas argon is 100L / min, and the thickness of the copper indium gallium target layer is 5mm.
[0083] The prepared copper indium gallium tubular target has an oxygen content of 2600ppm.
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