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Method for preparing heat-dissipating and antistatic polyaniline epoxy organosilicone graphene coating

A polyaniline epoxy and graphene technology, applied in conductive coatings, epoxy resin coatings, coatings, etc., can solve the problems affecting the performance and life of electronic products, the temperature rise of components and circuits, and the lack of heat dissipation capacity. The effect of electrical conductivity, improving thermal conductivity and thermal emissivity, and improving anti-corrosion performance

Inactive Publication Date: 2018-03-02
TIANJIN MEISHIBANG PAINT CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the heat dissipation capacity of the product is insufficient, the temperature of components and circuits will rise, which will cause thermal deformation and thermal failure of the equipment, affecting the performance and life of electronic products

Method used

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  • Method for preparing heat-dissipating and antistatic polyaniline epoxy organosilicone graphene coating
  • Method for preparing heat-dissipating and antistatic polyaniline epoxy organosilicone graphene coating
  • Method for preparing heat-dissipating and antistatic polyaniline epoxy organosilicone graphene coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Polyaniline epoxy organosilicon graphene heat-dissipating and conductive electrostatic coating, comprises main agent A and curing agent B, and the weight ratio of described main agent A and curing agent B is 3:1; Described main agent A comprises each of the following weight percentages: Components: epoxy silicone resin 43.0%, dispersant 1.4%, conductive titanium dioxide 24.4%, graphene 0.02%, carbon nanotube 0.2%, defoamer 0.34%, leveling agent 0.44%, polyaniline 0.2%, Surface modifier 2.0%, diluent 28.0%.

[0027] The curing agent is alicyclic amine.

[0028] The epoxy silicone resin is Degussa's silicone modified epoxy resin.

[0029] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300 produced by Ishihara.

[0030] The defoamer is BYK-051 of BYK Company of Germany; the leveling agent is BYK-354 of BYK Company of Germany.

[0031] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of...

Embodiment 2

[0045]Polyaniline epoxy organosilicon graphene heat-dissipating and conductive static coating, comprises main agent A and curing agent B, and the weight ratio of described main agent A and curing agent B is 5:1; Described main agent A comprises each of the following weight percentages: Components: epoxy silicone resin 45.5%, dispersant 1.7%, conductive titanium dioxide 29.8%, graphene 0.03%, carbon nanotube 0.3%, defoamer 0.25%, leveling agent 0.25%, polyaniline 0.6%, Surface modifier 2.5%, diluent 19.07%.

[0046] The curing agent is phenalkamine.

[0047] The epoxy silicone resin is Degussa's silicone modified epoxy resin.

[0048] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300 produced by Ishihara.

[0049] The defoamer is BYK-051 of BYK Company of Germany; the leveling agent is BYK-354 of BYK Company of Germany.

[0050] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences....

Embodiment 3

[0064] Polyaniline epoxy organosilicon graphene heat-dissipating and conductive electrostatic coating, comprises main agent A and curing agent B, and the weight ratio of described main agent A and curing agent B is 7:1; Described main agent A comprises each of following weight percent Components: epoxy silicone resin 48%, dispersant 2.0%, conductive titanium dioxide 30.0%, graphene 0.04%, carbon nanotube 0.4%, defoamer 0.3%, leveling agent 0.3%, polyaniline 0.6%, Surface modifier 3.0%, diluent 15.36%.

[0065] The curing agent is phenalkamine.

[0066] The epoxy silicone resin is Degussa's silicone modified epoxy resin.

[0067] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300 produced by Ishihara.

[0068] The defoamer is BYK-051 of BYK Company of Germany; the leveling agent is BYK-354 of BYK Company of Germany.

[0069] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences.

[...

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Abstract

The invention provides a method for preparing a heat-dissipating and antistatic polyaniline epoxy organosilicone graphene coating. The method comprises the following steps of: (1) preparation of a main agent A: the preparation of the main agent A comprises the steps of adding organosilicone-modified epoxy resin and a dispersing agent into a solvent according to the amount of a formula, performingeven stirring, adding conductive titanium dioxide, carbon nanotubes, graphene and polyaniline into the stirred mixture sequentially, after the added materials are dispersed evenly, putting the obtained mixture into a grinding machine for grinding until the grinding fineness is less than or equal to 20 microns, putting the ground color paste into a clean stirring kettle, adding a defoaming agent, aleveling agent, a matting agent and a surface modifier sequentially with stirring, performing even mixing, and performing filtration and package to obtain the main agent A; and (2) preparation of a curing agent B: the preparation of the curing agent B comprises the steps of weighing an amine curing agent according to the amount of the formula, and performing filtration and package to obtain the curing agent B. The heat-dissipating and antistatic polyaniline epoxy organosilicone graphene coating has high heat emissivity, high thermal conductivity and low thermal resistance, and has propertiesof both polyaniline and epoxy organosilicone at the same time and a high practical value.

Description

technical field [0001] The invention belongs to the fields of chemical industry and energy, and in particular relates to a preparation method of polyaniline epoxy organosilicon graphene heat-dissipating and static-conductive coating. Background technique [0002] Modern electronic equipment is increasingly becoming a highly integrated system with high-density assembly, which makes the heat flux density of the product increasingly large. If the heat dissipation capacity of the product is insufficient, the temperature of components and circuits will rise, which will cause thermal deformation and thermal failure of the equipment, affecting the performance and life of electronic products. In the fields of metallurgy, petrochemical, ceramics, medicine and other industries, various industrial boilers, power plant boilers, flame furnaces and other furnaces are often involved. The heat dissipation performance is very important to the safety of personnel and the reliable operation of...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D179/02C09D7/61C09D7/65C09D5/24
CPCC08K2003/2241C09D5/24C09D163/00C08L79/02C08K13/04C08K3/22C08K7/24C08K3/04
Inventor 马翔宇王新征
Owner TIANJIN MEISHIBANG PAINT CHEM IND
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