Method for preparing heat-dissipating and antistatic polyaniline epoxy organosilicone graphene coating
A polyaniline epoxy and graphene technology, applied in conductive coatings, epoxy resin coatings, coatings, etc., can solve the problems affecting the performance and life of electronic products, the temperature rise of components and circuits, and the lack of heat dissipation capacity. The effect of electrical conductivity, improving thermal conductivity and thermal emissivity, and improving anti-corrosion performance
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[0025] Example 1
[0026] Polyaniline epoxy silicone graphene heat dissipation and electrostatic conductive coating, including main agent A and curing agent B, the weight ratio of the main agent A and curing agent B is 3:1; the main agent A includes the following weight percentages Components: Epoxy silicone resin 43.0%, dispersant 1.4%, conductive titanium dioxide 24.4%, graphene 0.02%, carbon nanotube 0.2%, defoamer 0.34%, leveling agent 0.44%, polyaniline 0.2%, Surface modifier 2.0%, diluent 28.0%.
[0027] The curing agent is an alicyclic amine.
[0028] The epoxy silicone resin is Degussa's silicone modified epoxy resin.
[0029] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300, which is produced by Ishihara.
[0030] The defoamer is BYK-051 from BYK in Germany; the leveling agent is BYK-354 from BYK in Germany.
[0031] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences.
[0032] The ...
Example Embodiment
[0044] Example 2
[0045] Polyaniline epoxy silicone graphene heat-dissipating electrostatic conductive coating, including main agent A and curing agent B, the weight ratio of the main agent A and curing agent B is 5:1; the main agent A includes the following weight percentages Components: epoxy silicone resin 45.5%, dispersant 1.7%, conductive titanium dioxide 29.8%, graphene 0.03%, carbon nanotube 0.3%, defoamer 0.25%, leveling agent 0.25%, polyaniline 0.6%, Surface modifier 2.5%, diluent 19.07%.
[0046] The curing agent is phenalkamine.
[0047] The epoxy silicone resin is Degussa's silicone modified epoxy resin.
[0048] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300, which is produced by Ishihara.
[0049] The defoamer is BYK-051 from BYK in Germany; the leveling agent is BYK-354 from BYK in Germany.
[0050] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences.
[0051] The surface m...
Example Embodiment
[0063] Example 3
[0064] Polyaniline epoxy silicone graphene heat dissipation and electrostatic conductive coating, including main agent A and curing agent B, the weight ratio of the main agent A and curing agent B is 7:1; the main agent A includes the following weight percentages Components: Epoxy silicone resin 48%, dispersant 2.0%, conductive titanium dioxide 30.0%, graphene 0.04%, carbon nanotube 0.4%, defoamer 0.3%, leveling agent 0.3%, polyaniline 0.6%, The surface modifier is 3.0%, and the diluent is 15.36%.
[0065] The curing agent is phenalkamine.
[0066] The epoxy silicone resin is Degussa's silicone modified epoxy resin.
[0067] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300, which is produced by Ishihara.
[0068] The defoamer is BYK-051 from BYK in Germany; the leveling agent is BYK-354 from BYK in Germany.
[0069] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences.
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