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A kind of preparation method of aluminum nitride ceramics with high thermal conductivity

A technology of aluminum nitride ceramics and high thermal conductivity, which is applied in the field of preparation of aluminum nitride ceramics with high thermal conductivity, can solve the problems of limited size and size of the forming block, low production efficiency, slow processing speed, etc., and achieve sintering time Shortening, production cost reduction, and the effect of low production cost

Active Publication Date: 2020-11-10
福建赛瑞特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Aluminum nitride ceramic blocks with good performance can be obtained in a short period of time, but due to the limitation of the hot pressing head and hot pressing mold, the size and size of the formed block are limited, and the hot pressing can only sinter a single block
The aluminum nitride ceramic block has high hardness. Even if the aluminum nitride substrate is obtained by multi-wire cutting in the later stage, it still faces slow processing speed and low production efficiency.

Method used

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  • A kind of preparation method of aluminum nitride ceramics with high thermal conductivity
  • A kind of preparation method of aluminum nitride ceramics with high thermal conductivity
  • A kind of preparation method of aluminum nitride ceramics with high thermal conductivity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh aluminum nitride powder and yttrium oxide powder according to the mass ratio of 97:3, the mass of aluminum nitride powder is 1940g, the mass of yttrium oxide powder is 60g, and the ball, material, solvent ratio is 1:1:0.7. Ball mill, alcohol is 1400ml, zirconia ball is 2000g, mixing for 12 hours, taking and drying, drying time is 12 hours. The agglomerated sample after drying was crushed and sieved to make it pass through a 20-mesh sieve. Weigh 1650g of the prepared material and perform isostatic pressing. Cut the formed powder into 4 triangles, brush a layer of boron nitride powder on the three sides of the triangle and join them together (such as figure 1 (Shown) installed in the mold. Then the mold is moved into the vacuum hot-pressing sintering atmosphere furnace for vacuuming, and the vacuum degree is maintained at about 3KPa. The heating rate is 10°C / min, and the temperature reaches 1820°C for heat preservation and pressure preservation. During the heating...

Embodiment 2

[0025] Weigh aluminum nitride powder and yttrium oxide powder according to the mass ratio of 98.5:1.5, the mass of aluminum nitride powder is 1970g, and the mass of yttrium oxide powder is 30g, and the ball, material, and solvent ratio is 1:1:0.7. Ball mill, alcohol is 1400ml, zirconia ball is 2000g, mixing for 12 hours, taking and drying, drying time is 12 hours. The agglomerated sample after drying was crushed and sieved to make it pass through a 20-mesh sieve. Weigh 1650g of the prepared material and perform isostatic pressing. Cut the formed powder into 4 quadrilaterals, apply a layer of boron nitride powder on the four sides of the quadrilaterals and join them together (such as figure 2 (Shown) installed in the mold. Then the mold is moved into the vacuum hot pressing sintering atmosphere furnace, the vacuum degree is kept at about 3KPa, the heating rate is 10°C / min, and the temperature reaches 1830°C for heat preservation and pressure preservation. During the heating p...

Embodiment 3

[0027] Weigh aluminum nitride powder and yttrium oxide powder according to the mass ratio of 95:5, the mass of aluminum nitride powder is 1900g, and the mass of yttrium oxide powder is 100g, and the ball, material, solvent ratio is 1:1:0.7. Ball mill, alcohol is 1400ml, zirconia ball is 2000g, mixing for 12 hours, taking and drying, drying time is 12 hours. The agglomerated sample after drying was crushed and sieved to make it pass through a 20-mesh sieve. Weigh 1650g of the prepared material and perform isostatic pressing. Cut the formed powder into equilateral hexagons, and brush the 6 sides of the hexagon with boron nitride powder. image 3 Shown are spliced ​​together and installed in the mold. Then the mold is moved into a vacuum hot pressing sintering atmosphere furnace, the vacuum degree is kept at about 3KPa, the heating rate is 10°C / min, and the temperature reaches 1840°C for heat preservation and pressure preservation. During the heating process, the pressure starts...

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Abstract

The invention discloses a preparation method of aluminum nitride ceramic formed through hot pressing sintering, and particularly relates to a method capable of rapidly preparing aluminum nitride ceramic with high heat conductivity. The preparation method comprises the steps that aluminum nitride powder block bodies with different shapes are subjected to splicing forming, the aluminum nitride powder block bodies can be separated without cutting after being subjected to hot pressing sintering, and then ceramic block bodies are subjected to annealing treatment, so that aluminum nitride ceramic with the heat conductivity being 100 to 160 W / (m.k) can be obtained. The aluminum nitride ceramic prepared through the method is more complete in grain growth, higher in heat conductivity and lower in production cost.

Description

Technical field [0001] The invention is a method for preparing aluminum nitride ceramics with high thermal conductivity, and specifically relates to a method for preparing aluminum nitride ceramics by hot-pressing and sintering aluminum nitride through splicing molding process and annealing treatment. Background technique [0002] Aluminum nitride has high thermal conductivity, low dielectric constant, high resistivity, and a thermal expansion coefficient matching silicon, which has broad application prospects in circuit substrates and thermal packaging materials. At present, the existing technology has disclosed a method for preparing aluminum nitride ceramic substrate by the block slicing method (CN 101985396 B). The method for preparing aluminum nitride ceramic substrate in this technology mainly includes the following steps: 1) Nitriding Add the sintering aid to the aluminum powder and mix it evenly; 2) Put the powder into the mold for pre-compression; 3) Put the pre-compress...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/581C04B35/622
CPCC04B35/581C04B35/622C04B2235/3225C04B2235/5436C04B2235/5445C04B2235/6562C04B2235/658C04B2235/6581C04B2235/662C04B2235/77C04B2235/9607
Inventor 黄向东刘海华
Owner 福建赛瑞特科技有限公司