Flexible pressure sensor and its preparation method

A pressure sensor and flexible technology, applied in the sensor field, can solve the problems of low sensitivity and high manufacturing cost of flexible pressure sensors, and achieve the effects of fast response time, low cost and high sensitivity

Active Publication Date: 2020-05-08
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, provide a flexible pressure sensor and its preparation method, aiming to solve the technical problems of low sensitivity and very high production cost of the existing flexible pressure sensor

Method used

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  • Flexible pressure sensor and its preparation method

Examples

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preparation example Construction

[0038] On the other hand, the embodiment of the present invention also provides a method for preparing a flexible pressure sensor, including the following steps:

[0039] S01: a base plate is provided, and after the surface of the base plate is subjected to hydrophilic treatment, a tightly arranged single-layer colloidal microsphere array is prepared on a surface of the base plate;

[0040] S02: The single-layer colloidal microsphere array is carried out plasma etching, the diameter of the colloidal microsphere in the described single-layer colloidal microsphere array is reduced, and then one layer of gold film is sprayed, will be sprayed with described gold film The bottom plate is etched with etching solution to form a bottom plate with periodic protrusions;

[0041] S03: Deposit PDMS material on the base plate with periodic protrusions to form a flexible PDMS template with depressions;

[0042] S04: Deposit the conductive composite material in the flexible pressure sensor ...

Embodiment 1

[0051] A method for preparing a flexible PDMS template, comprising the steps of:

[0052] Such as figure 1 Shown, at first, utilize the method for air-liquid interface self-assembly to prepare the colloidal microsphere array of monolayer close periodic arrangement on the silicon chip, at first will be to the silicon chip (the conductivity of the silicon chip that adopts here adopts in 10 -3 to 10 2 Ω / m) for cleaning treatment, the specific process is: respectively soak the silicon wafer with appropriate amount of acetone, ethanol, deionized water and ultrasonic for 20min to remove impurities on the silicon wafer, and then carry out hydrophilic treatment on the silicon wafer , the specific steps of hydrophilic treatment: first soak and clean with piranha solution (prepared with concentrated sulfuric acid and hydrogen peroxide in a volume ratio of 7:3) for 30 minutes, then clean with a large amount of deionized water, and then put in deionized water, Soak in a mixed solution o...

Embodiment 2

[0056] A method for preparing a flexible pressure sensor, comprising the steps of:

[0057] First, a carbon nanotube / PDMS composite flexible conductive film with a closely arranged truncated conical array is prepared. The specific steps are: firstly, the multi-walled carbon nanotubes with a diameter of 10-200nm and a length of 2-20μm are ultrasonicated in chloroform for 5h, To make it evenly disperse, then use a vortex mixer to mix the multi-walled carbon nanotubes and PDMS prepolymer evenly, heat at 90°C for 6h to remove chloroform, and then mix ethyl acetate and PDMS curing agent (volume mass ratio is 5: 1) Add multi-walled carbon nanotubes and PDMS prepolymer and mix them evenly with a vortex mixer. Then pour the mixed material into the flexible PDMS template obtained in the above-mentioned Example 1, put it into a vacuum oven and heat at 80° C. for 3 hours to cure. After cooling down to room temperature, the two layers of films were slowly separated to obtain a composite ...

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Abstract

The invention belongs to the sensor technology field and especially relates to a flexible pressure sensor and a manufacturing method. The flexible pressure sensor comprises a first flexible substrate,a first flexible conducting layer, a second flexible conducting layer and a second flexible substrate which are successively stacked. The first flexible conducting layer comprises first embossment arrays which are arranged periodically. The second flexible conducting layer comprises second embossment arrays which are arranged periodically. The first embossment arrays and the second embossment arrays are arranged adjacently. The first flexible conducting layer and the second flexible conducting layer contain a conductive composite material. The flexible pressure sensor possesses characteristics of high sensitivity, rapid response time and good stability.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a flexible pressure sensor and a preparation method thereof. Background technique [0002] The flexible pressure sensor is a flexible electronic device used to sense the force on the surface of some objects. It can be attached to various irregular surfaces. It has broad application prospects in the fields of medical health, robotics, biomechanics, etc. attention. With the development of science and technology, people are paying more and more attention to whether the flexible pressure sensor can combine the functions of flexibility and accurate measurement of pressure distribution information. Because the micro-nano structure of the sensor can not only improve the response speed of the sensor but also make the sensor recover faster, the micro-structured pressure sensor has become the focus of academia and industry. [0003] It is difficult for existing flexible press...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/16
CPCG01L1/16
Inventor 孙蓉熊耀旭胡友根朱朋莉赵涛张馨予
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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