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Thermoplastic polyether imide insulating heat conduction composite material and preparation method thereof

A technology of polyetherimide and polyetherimide resin, which is applied in the field of polymer functional composite materials, can solve the problems of not considering the matching of filler shape and particle size, loss of insulation properties, etc., to achieve excellent comprehensive performance and improve thermal conductivity Performance, the effect of broad application prospects

Active Publication Date: 2018-07-06
BEIJING TECHNOLOGY AND BUSINESS UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention uses graphite powder as an important thermal conductive filler, because graphite powder has both good thermal conductivity and electrical conductivity, which will cause the system to lose its insulating properties, and the shape and particle size of the filler are not considered.

Method used

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  • Thermoplastic polyether imide insulating heat conduction composite material and preparation method thereof
  • Thermoplastic polyether imide insulating heat conduction composite material and preparation method thereof
  • Thermoplastic polyether imide insulating heat conduction composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]40 parts of polyetherimide and 50 parts of boron nitride (surface-treated with silane coupling agent γ-(2,3-epoxypropoxy)propyltrimethoxysilane accounting for 2.5 wt% of boron nitride mass) , 5 parts of zinc oxide whiskers (surface-treated with γ-(methacryloyloxy)propyltrimethoxysilane accounting for 1 wt% of the quality of zinc oxide whiskers) and 5 parts of polyethylene wax after mixing uniformly in a high-speed mixer , added to a twin-screw extruder for uniform plasticization, extrusion, and granulation. The twin-screw extrusion temperature is 345° C., and the screw speed is 200 rpm. The obtained pellets were made into insulating and heat-conducting composite materials by injection molding. The injection molding temperature was 360° C. and the injection molding pressure was 40 MPa. The properties are shown in Table 1.

Embodiment 2

[0038] 48 parts of polyetherimide, 40 parts of aluminum nitride (surface treated with silane coupling agent 3-aminopropyltriethoxysilane accounting for 1 wt% of aluminum nitride quality), 10 parts of potassium titanate whiskers ( After being treated with silane coupling agent γ-(2,3-epoxypropoxy)propyltrimethoxysilane (2,3-epoxypropoxy)propyltrimethoxysilane surface treatment) and 2 parts of liquid paraffin in a high-speed mixer, Carry out extrusion and injection molding, processing condition is the same as embodiment 1, and its performance is as shown in table 1.

Embodiment 3

[0040] 46 parts of polyetherimide, 30 parts of silicon carbide (surface treated with γ-(methacryloyloxy)propyl trimethoxysilane accounting for 3wt% of the mass of silicon carbide), 20 parts of boron nitride (treated with nitrogen γ-(2,3-epoxypropoxy)propyltrimethoxysilane surface treatment with 3wt% of the mass of boron oxide), 1 part of potassium titanate whiskers (through n-propanol which accounts for 3wt% of the mass of potassium titanate whiskers Zirconium (IV) surface treatment) and 3 parts of polyethylene wax were mixed uniformly in a high-speed mixer, then added to an internal mixer for plasticization and mixing, the mixing temperature was set at 340 ° C, and the rotor speed was 50 rpm; The insulating and heat-conducting composite material was made by hot-pressing on the press. The hot-pressing temperature was 360°C and the hot-pressing pressure was 30 MPa. The properties are shown in Table 1.

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Abstract

The invention discloses a thermoplastic polyether imide insulating heat conduction composite material and a preparation method thereof. The thermoplastic polyether imide insulating heat conduction composite material comprises the following components in parts by mass: 20-84 parts of a thermoplastic polyether imide resin, 15-70 parts of a heat conduction filler, 1-20 parts of an auxiliary filler and 0-9 parts of processing aids. The thermoplastic polyether imide insulating heat conduction composite material disclosed by the invention is good in heat conductivity, insulation property, high temperature resistance and good in flame retardancy, and has wide application prospects in the fields of high-end electronic devices with requirements of electric insulation, heat conduction, high temperature resistance and flame retardancy, and good use properties can be maintained within a wide range of minus 150 DEG C to 200 DEG C.

Description

technical field [0001] The invention belongs to the technical field of polymer functional composite materials, and in particular relates to a thermoplastic polyetherimide insulation, heat conduction and high temperature resistant composite material and a preparation method thereof. Background technique [0002] With the advancement of industrial technology, the electronic and electrical product industry has gradually developed by leaps and bounds, and the application of polymer materials in electronic and electrical appliances has become more and more widespread. However, due to insufficient heat dissipation, the phenomenon of accelerated aging or even burning of materials occurs from time to time. The demand for thermal conductivity and heat resistance of materials is increasingly urgent. At the same time, electronic appliances also have requirements for insulation and mechanical properties of materials, which undoubtedly pose new challenges for the construction of materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K9/06C08K3/38C08K7/08C08K3/28C08K3/34C08K5/09C08K3/22
CPCC08K3/34C08K5/09C08K7/08C08K9/06C08K2003/2227C08K2003/282C08K2003/385C08L79/08C08L2201/02C08L2201/08C08L2203/20C08L23/06C08K3/38C08L91/06C08K3/28C08K3/22
Inventor 温变英赫达
Owner BEIJING TECHNOLOGY AND BUSINESS UNIVERSITY
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