Air-cooled notebook computer with difficultly-weakened heat dispersion property

Abstract

The invention discloses an air-cooled notebook computer with difficultly-weakened heat dispersion property and particularly relates to a heat dispersion module for the air-cooled notebook computer. Bychanging the structure of the heat dispersion module, situations that an air inlet of a heat dispersion channel of a heat dispersion device is severely blocked due to the accumulation of (powdery, silky and flocculent) dust, and then the waste heat cannot be effectively discharged does not easily occur, so that the heat dispersion property of a product can be well preserved for a long time, the operation performance of the product is relatively durably and efficiently exerted, and the probability that the product is damaged due to high temperature is reduced. The product can be used for a long time, the heat dispersion module does not need to be cleaned, or the cleaning frequency can be remarkably reduced. The energy source consumed by a fan can be further saved in the long run, so that the duration time of the product is prolonged, and the battery loss is reduced.

Description

technical field [0001] The invention mainly relates to an air-cooled notebook computer, in particular to a cooling module for an air-cooled notebook computer. Background technique [0002] As we all know, the heat dissipation scheme of commercially available notebook computers has generally adopted an air-cooled heat dissipation system, that is, the heat generated by the chip (CPU or GPU) is transferred to the heat pipe, and the condensation section of the heat pipe is provided with a number of cooling fins as a heat sink. The gaps between the individual fins carry heat away. Due to the relatively strict design requirements on the thickness of notebook computers, radial fans such as turbo fans and centrifugal fans are generally used, together with finned heat sinks that can easily form a large specific surface area as a heat dissipation solution. [0003] However, as the product usage time increases, the heat dissipation performance of the product will gradually decrease. ...

AI Technical Summary

Problems solved by technology

When the dust accumulation is serious, even if the fan runs at a high speed, the heat dissipation effect is not obvious, but more power will be wasted, more noise will be generated, and the dust will accumulate thicker and thicker between the fan and the radiator

When the heat dissipation performance is not enough to meet the working needs of the chip, the chip will reduce the operating frequency and reduce heat generation, but the computing performance will be greatly reduced, seriously affecting the user experience

And if the chip works at high temperature for a long time, it may cause many hazards

Generally speaking, the average working time of the product is more than 10 hours a day, and this situation will occur in about half a year to a year. If consumers need to eliminate this state of the product, they can only disassemble and clean it, and replace the thermal grease. It will consume time, energy and money, and there are certain risks

[0004] The air inlet of some products is equipped with a dust-proof net. Although it has a certain dust-proof effect, its actual function is mainly to prevent large foreign objects from entering, and at the same time play a decorative effect. The side effect is to reduce the air intake, which is not conducive to heat dissipation. Dust can also enter the fuselage through the mesh, causing the heat dissipation channel to be blocked

For products without dust-proof nets, the air inlet is designed to be smaller

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