Micro-nano structure array heat dissipation surface and preparation method thereof

A technology of heat dissipation surface and micro-nano structure, applied in the fields of nanotechnology, nanotechnology, nanotechnology, etc. for materials and surface science, can solve the problems of deterioration, phase transformation heat can not strengthen, poor wettability, etc. , to achieve the effect of delaying drying, easy large-scale preparation and low cost

Pending Publication Date: 2018-07-31
CHINA EPRI ELECTRIC POWER ENG CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the surface of the hydrophilic micro-nano structure has poor wettability with the fluorine-

Method used

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  • Micro-nano structure array heat dissipation surface and preparation method thereof
  • Micro-nano structure array heat dissipation surface and preparation method thereof

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preparation example Construction

[0027] At the same time, the present invention also proposes a preparation method for preparing a micro-nano structure array heat dissipation surface, which is characterized in that it comprises the following steps: 1) adding 20-80 parts by weight of fluorine-containing polymer emulsion, 20-80 parts by weight of Heat conductive particles, 5-20 parts by weight of solvent, 0.5-5 parts by weight of additives, etc. are stirred and mixed evenly to obtain a slurry; 2) The slurry prepared in step 1) is printed on the surface of the heat dissipation substrate by screen printing technology, Drying to remove the solvent, and then heat treatment in a protective atmosphere, so that the fluorine-containing polymer resin is cured on the surface of the heat dissipation matrix, thereby obtaining a heat dissipation surface with a micro-nano structure array.

[0028]The fluorine-containing polymer emulsion is one of polytetrafluoroethylene emulsion and polyvinylidene fluoride emulsion; the heat-...

Embodiment 1

[0033] Stir and mix 20g polytetrafluoroethylene emulsion, 30g aluminum powder with a particle size of 1-10 microns, 50g alumina powder with a particle size of 0.1-2 microns, 5g distilled water, 4.5g dispersant, 0.4g wetting agent, 0.1 defoamer, etc. Obtain the printing paste evenly; use a 20-mesh printing screen with a screen size of 250 microns, print the prepared paste on the surface of a clean heat-dissipating aluminum material, dry it in an oven for 2 hours to remove the solvent; then transfer to a nitrogen atmosphere to protect the heating furnace , heat treatment at 250°C for 0.5-1h, to solidify polytetrafluoroethylene and heat-conducting particles on the surface of the heat-dissipating aluminum material, thereby obtaining a heat-dissipating surface with a micro-nano structure array.

[0034] In the obtained micro-nano structure array, the height of the polytetrafluoroethylene / heat-conducting particle composite cone is 200-250 microns, the central moment between the cones...

Embodiment 2

[0036] Stir and mix 80g of polyvinylidene fluoride emulsion, 5g of silver powder with a particle size of 0.5 to 3 microns, 15g of aluminum nitride powder with a particle size of 0.1 to 1 micron, 20g of ethylene glycol, 0.3g of a dispersant, and 0.2g of a thickener to obtain a printed product. Slurry; 400 mesh printing screens with 25 microns of mesh are used to print the prepared slurry on the surface of a clean heat-dissipating copper material, and dry in an oven for 1h to remove the solvent; then transfer to an argon atmosphere to protect the heating furnace, Heat treatment at 150°C for 1 hour to solidify the polyvinylidene fluoride and heat-conducting particles on the surface of the heat-dissipating copper material, thereby obtaining a heat-dissipating surface with a micro-nano structure array.

[0037] In the obtained micro-nano structure array, the height of the polyvinylidene fluoride / heat-conducting particle composite cone is 5-25 microns, the central moment between the ...

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Abstract

The invention discloses a micro-nano structure array heat dissipation surface and a preparation method thereof. The heat dissipation surface comprises a heat dissipation substrate and an array structure which is constructed on the surface of the heat dissipation substrate and formed by cones composed of a fluorine-containing polymer and heat conducting particles. The heat dissipation surface can greatly increase the effective heat exchange area, the surface roughness and the heat conducting coefficient, facilitates the transfer of heat to a fluorine-containing working medium, facilitates nucleate boiling of the fluorine-containing working medium, can strengthens a wetting ability of the fluorine-containing working medium for the heat dissipation surface, improves the critical heat flux density and plays a role of strengthening phase change heat transfer. The preparation method comprises the steps of uniformly stirring and mixing a fluorine-containing polymer emulsion, the heat conducting particles, a solvent, an auxiliary and the like to obtain slurry, printing the slurry on the surface of the heat dissipation substrate through a silk-screen printing process, drying to remove the solvent, then performing thermal treatment in the protective atmosphere, enabling the fluorine-containing polymer resin to be solidified on the surface of the heat dissipation substrate, and obtaininga heat dissipation surface with a micro-nano structure array. The preparation steps are easy and easy to implement, and scale production is easy to be realized.

Description

technical field [0001] The invention relates to a micro-nano structure array with improved heat transfer surface and a preparation method thereof, in particular to phase change heat dissipation of high-power electronic integrated devices. Background technique [0002] In recent years, with the rapid development of aerospace technology, laser devices, and high-power electronic equipment, the miniaturization, integration, and high-power of electronic components have become the development direction. The ensuing heat dissipation of these electronic components has also become a key issue restricting their safety and service life. Therefore, it is imperative to develop a more efficient heat dissipation technology to solve the problem of heat dissipation and cooling of these high-power heat-generating devices. [0003] Phase-change heat has been widely used in heat exchange of high-power electronic integrated devices. However, most of the current phase-change heat sinks use ordi...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/373H01L23/367B82Y40/00B82Y30/00
CPCH01L23/367H01L23/3733H01L23/427B82Y30/00B82Y40/00
Inventor 栾洪州朱海涛查鲲鹏孙宝奎闻福岳雷清泉
Owner CHINA EPRI ELECTRIC POWER ENG CO LTD
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