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A metamaterial based on liquid metal microfluidics and its preparation method

A liquid metal and metamaterial technology, applied in antennas, electrical components, etc., to solve problems such as structural form and material properties that cannot be dynamically adjusted

Active Publication Date: 2021-08-03
BEIJING MECHANICAL EQUIP INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above analysis, the embodiment of the present invention aims to provide a liquid metal microfluidic-based metamaterial and its preparation method to solve the problem that the structural shape and material properties of the existing metamaterial cannot be dynamically adjusted after the design and processing are completed.

Method used

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  • A metamaterial based on liquid metal microfluidics and its preparation method
  • A metamaterial based on liquid metal microfluidics and its preparation method
  • A metamaterial based on liquid metal microfluidics and its preparation method

Examples

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Effect test

Embodiment 1

[0051] like figure 1 As shown, a specific embodiment of the present invention discloses a metamaterial based on liquid metal microfluidics, including an underlying metal layer, an intermediate dielectric layer, and a microchannel array disposed on the surface of the intermediate dielectric layer.

[0052] The underlying metal layer and the intermediate dielectric layer are fixed film layers. The intermediate dielectric layer includes a dielectric material for isolation.

[0053] Optionally, the underlying metal layer can be selected from metal film materials such as silver and copper, and the intermediate dielectric layer can be selected from at least one of silicon dioxide, silicon, aluminum oxide, silicon rubber, and polydimethylsiloxane (PDMS). species, or other suitable materials for the metamaterial intermediary layer.

[0054] Liquid metal is arranged in the microchannel, and the liquid metal flows in the microchannel to form a metal microstructure on the surface of th...

Embodiment 2

[0059] like figure 2 As shown, optimization is carried out on the basis of the above-mentioned embodiments. The liquid metal adopts gallium or gallium alloys, such as gallium indium alloy and gallium indium tin alloy, which can flow in the microstructure under the action of external force and form the metal on the surface of the metamaterial. microstructure. Through the arbitrary fluidity of liquid gallium or gallium alloy, liquid gallium or gallium alloy is microfluidized, and microfluidic control of metamaterials can be realized. This technology is applied to the reconstruction of structural parameters and structural morphology of metamaterials, which have the ability to regulate their physical properties.

[0060] In the air environment, the liquid metal is easy to interact with the air to form an oxide layer on the surface of the liquid metal. The thickness of the oxide layer is 3-5nm, which should be removed during processing. Before liquid metal is injected into the m...

preparation Embodiment 2

[0069] A method for preparing the metamaterial described in Example 2, specifically comprising the steps of:

[0070] 1. The bottom metal layer and intermediate dielectric layer are prepared by magnetron sputtering process or chemical vapor deposition. The bottom metal layer is made of metal thin film materials such as silver or copper, and the middle dielectric layer is made of silicon dioxide, silicon, and aluminum oxide silicon At least one of rubber, PDMS and other materials;

[0071] 2. Micro-nano processing technology to prepare micro-channel arrays, micro-nano processing technology includes photolithography, nano-imprinting, etc., and use any one of screen printing, coating, magnetron sputtering, PECVD, etc. to prepare each micro-channel base;

[0072] 3. Use a vacuum oven to cure PDMS at a temperature of 70-100°C to prepare the packaging cover, and then use high temperature and plasma technology to realize the sealing of the packaging cover and the intermediate dielec...

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Abstract

The invention relates to a metamaterial based on liquid metal microfluidics, belongs to the technical field of electromagnetic communication, and solves the problem that the structural form and material properties of the existing metamaterial cannot be dynamically adjusted after the design and processing are completed. The metamaterial disclosed in the invention comprises a bottom metal layer, an intermediate medium layer and a microchannel array arranged on the surface of the intermediate medium layer. The underlying metal layer and the intermediate medium layer are fixed film layers; liquid metal is arranged in the microchannel, and the liquid metal flows in the microchannel to form a metal microstructure on the surface of the metamaterial. The liquid metal is driven to flow in the microchannel by an external force, and the length or width of the metal microstructure is adjusted to change the physical properties of the metamaterial. The invention further expands the application range of the metamaterial and greatly improves the practical application performance of the metamaterial.

Description

technical field [0001] The invention relates to the technical field of electromagnetic communication, in particular to a liquid metal microfluidic-based metamaterial and a preparation method thereof. Background technique [0002] As a new type of artificial composite microstructure, metamaterials have extraordinary physical properties that natural materials do not possess. Because its structure can be artificially designed, metamaterials can realize the manipulation of material properties, making rapid development and application in stealth technology, communication technology, sensing technology and other fields. [0003] In recent years, with the rapid development of micro-nano fabrication technology, metamaterials with micro-nano scale structures can be processed precisely, so the application fields and scope of metamaterials are becoming more and more extensive. Although metamaterials have very excellent performance, their parameters such as equivalent permittivity, mag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00H01Q17/00
CPCH01Q15/0086H01Q17/00
Inventor 李平许诺臧金良刘立滨
Owner BEIJING MECHANICAL EQUIP INST
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