Solvent-free adhesive, printing platform and manufacturing method thereof for preventing FDM printing device from warping

Abstract

The invention belongs to the technical field of fused deposition printing and discloses a solvent-free adhesive preventing warping of an FDM (fused deposition modeling) printing device, a printing platform and a preparation method of the adhesive. The adhesive comprises the following ingredients: ethylene diglycidyl ether, ethylhexyl acrylate, 1,2-epoxy-4-vinyl-cyclohexane, octadecyl acrylate, acrylic acid, hydroxyethyl acrylate, hexadecyl acrylate, lauryl acrylate, glycidyl methacrylate, a radical initiator and an acrylate cross-linking agent. The printing platform comprises the adhesive anda substrate, wherein the substrate is coated with the adhesive. The initial adhesion and stripping strength of the adhesive are very low at a temperature less than 40 DEG C; the printing device is easily taken down from the platform; the adhesive has better adhesion ability at the high temperature; and the printing device is tightly bonded with the platform and is free from warping.

Description

technical field [0001] The invention belongs to the field of fused deposition printing technology (FDM), and relates to a solvent-free adhesive for preventing warping of FDM printing devices, a printing platform and a manufacturing method thereof. Background technique [0002] Fused deposition printing technology is one of the most widely used technologies in the field of 3D printing at present. It uses thermoplastic filament as raw material. The filament is heated and melted by the printer to form a melt with certain fluidity. After the melt flows out of the nozzle, it cools and solidifies, layer by layer. Overlay printing molding. However, thermoplastic filaments will undergo large thermal shrinkage during the process of heating, melting, cooling and solidification, resulting in warping of FDM printed devices. Generally, the warping of 3D printed parts is reduced by heating the printing platform to reduce the temperature difference between the fuse and the platform. Howe...

AI Technical Summary

Problems solved by technology

However, a layer of masking tape is coated on the surface of the printing platform. The specific surface area of ​​the masking tape is relatively large, and the bonding strength between the device and the masking tape is still relatively high. It is not easy to remove the printed device after cooling.

If a large pull is used to pick up the parts, the masking tape will be broken, and some tapes will be attached to the surface of the device base and it is difficult to remove

Coat a layer of polytetrafluoroethylene coating on the surface of the printing platform. When the filament shrinks greatly, it is difficult for the device to be firmly bonded to the platform during the printing process, and there is a risk of device warping.

[0004] The bonding strength of the currently reported adhesives under high temperature conditions is generally relatively low. After cooling, the adhesive shrinks, eliminating the free volume between the interfaces, increasing the contact area between the adhesive and the substrate, and being able to bond firmly. attached to the surface

The patent application with the application number 201410719676.6 discloses a method of using isooctyl acrylate, vinyl acetate, acrylic acid, hydroxyethyl acrylate, methyl methacrylate, N-methylol acrylamide, azobisisobutyronitrile Acrylic pressure-sensitive adhesives polymerized with ethyl acetate and other components, the pressure-sensitive adhesive tape can be fully foamed at 130°C to achieve bonding with the substrate, and in order to reduce the thermal deformation of 3D printed devices, generally 3D printing When using conventional filaments such as polylactic acid, ABS, HIPS and PETG, the temperature of the platform does not exceed 120°C, so this pressure-sensitive tape is not suitable for 3D printing of such conventional filaments

Chinese patent 201410037153.3 discloses a solvent-based pressure-sensitive adhesive prepared from butyl acrylate, isooctyl acrylate, chloroprene, methyl methacrylate, acrylic acid, hydroxyethyl acrylate, and glycidyl acrylate. , the pressure-sensitive adhesive does not stick when two pressure-sensitive adhesive products are put together at room temperature, that is, the bonding strength is relatively low at room temperature, but the bonding strength is also relatively low after high-temperature activation, which cannot meet the requirements of 3D printing devices and printing. Platform bonding, and solvent-based adhesives are difficult to apply a high thickness in the process of making the printing platform

Therefore, none of these adhesives can meet the application requirements of high temperature bonding strength during FDM printing and easy peeling after cooling

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