Method for plating BaTiO3 ceramic surface with copper

A ceramic surface, copper plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problem that chemical copper plating is difficult to achieve, the quality of the coating is difficult to meet the technical requirements of the application, and the quality of the coating is unstable, etc. problems, to achieve the effect of reliable quality and quality stability, easy automatic operation, and good plating reliability

Inactive Publication Date: 2018-11-02
XIAN TECH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Already Already 2 o 3 and ZrO 2 In the copper plating process of ceramics such as HF, fluoride salt and hydrochloric acid, etc. are used for roughening treatment, but HF and fluoride salt and BaTiO 3 The reaction is more violent, and it is easy to make the surface rough, while hydrochloric acid and BaTiO 3 The reaction is slow, and the surface roughening effect is not good, so the existing Al 2 o 3 and ZrO 2 Other ceramic surface roughening processes are not suitable for BaTiO 3 ceramics
Usually copper plating solutions use sodium hypophosphite and formaldehyde as reducing agents, but hypophosphite has little catalytic activity on copper, and the rate of copper plating with sodium hypophosphite as reducing agent is slow, and the coating is thin and uniform Poor performance, this shortcoming is more prominent if the surface area of ​​the workpiece to be plated is large
Formaldehyde is used as a reducing agent for copper plating. Although the deposition rate is fast, the melt stability is poor, the main salt is quickly exhausted, the surface of the coating is rough, there are many bubbles, and even copper slag falls off. In practical applications, the plating solution is easy to Causes waste, and the quality of the coating is also very unstable
Visible BaTiO 3 Copper plating on ceramic surfaces mainly has the following problems: (1) BaTiO 3 The ceramic surface has no catalytic activity for various electroless plating reactions, and is a typical difficult-to-plating substrate material. Therefore, in BaTiO 3 Electroless copper plating on the ceramic surface is difficult to achieve; (2) the pretreatment process is not 3 The quality and bonding force of the copper plating layer on the ceramic surface are greatly affected. The surface bonding force between the coating layer and the substrate is poor, and the quality of the coating layer is difficult to meet the technical requirements of the application; (3) Usually, the plating solution for copper plating on the ceramic substrate has poor stability and plating Low copper deposition rate and other problems, on the one hand, the utilization rate of the plating solution is not high, on the other hand, the quality of the copper plating layer is unstable

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  • Method for plating BaTiO3 ceramic surface with copper
  • Method for plating BaTiO3 ceramic surface with copper
  • Method for plating BaTiO3 ceramic surface with copper

Examples

Experimental program
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Effect test

Embodiment 1

[0067] For Φ35mm×50mm cylinder BaTiO 3 Copper plating on ceramic surface for 30min

[0068] Solution formula: ①Alkaline washing solution: NaOH 30g / L, Na 3 PO 4 45g / L, Na 2 CO 3 25g / L, mixed with distilled water; ②Coarse solution: CrO 3 140g / L, H 2 SO 4 (98%) 95mL / L, distilled water for liquid preparation; ③sensitizing solution: SnCl 2 10g / L, HCl (36-38%) 50mL / L, mixed with distilled water; ④Activating solution: PdCl 2 0.6g / L, HCl (36-38%) 10mL / L, distilled water for solution; ⑤Reducing solution: HCHO (37-40%) 100mL / L, distilled water for solution; ⑥Copper plating solution: CuSO 4 • 5H 2 O 20 g / L, C 10 H 16 N 2 O 8 22g / L, C 4 O 6 H 4 KNa 16g / L, HCHO (37-40%) 12mL / L, NaH 2 PO 2 25 g / L, C 4 H 4 N 2 OS 20 g / L, K 4 Fe(CN) 6 0.4g / L, NaOH 14g / L, mixed with distilled water; ⑦passivation melt: CrO 3 80 g / L, NaCl 1.0 g / L, H 2 SO 4 25 ml / L, mixed with distilled water.

[0069] Implementation operation: ①Alkaline washing: soak the workpiece in an alkaline washing solution at a temperat...

Embodiment 2

[0072] For Φ35mm×50mm cylinder BaTiO 3 Copper plating on ceramic surface for 60min

[0073] Solution formula: ①Alkaline washing melt: NaOH 30g / L, Na 3 PO 4 45g / L, Na 2 CO 3 25g / L, mixed with distilled water; ②Coarse solution: CrO 3 150g / L, H 2 SO 4 (98%) 100mL / L, distilled water for liquid preparation; ③sensitizing solution: SnCl 2 10g / L, HCl (36-38%) 50mL / L, mixed with distilled water; ④Activating solution: PdCl 2 0.6g / L, HCl (36-38%) 10mL / L, distilled water for solution; ⑤Reducing solution: HCHO (37-40%) 100mL / L, distilled water for solution; ⑥Copper plating solution: CuSO 4 • 5H 2 O 15 g / L, C 10 H 16 N 2 O 8 20g / L, C 4 O 6 H 4 KNa 15g / L, HCHO (37-40%) 12mL / L, NaH 2 PO 2 20 g / L, C 4 H 4 N 2 OS 15 g / L, K 4 Fe(CN) 6 0.2g / L, NaOH 14g / L, mixed with distilled water; ⑦passivation melt: CrO 3 80 g / L, NaCl 1.0 g / L, H 2 SO 4 25 ml / L, mixed with distilled water.

[0074] Implementation operation: ①Alkaline washing: soak the workpiece in an alkaline washing solution at a temperature...

Embodiment 3

[0077] For Φ35mm×50mm cylinder BaTiO 3 Copper plating on ceramic surface for 90min

[0078] Solution formula: ①Alkaline washing melt: NaOH 30g / L, Na 3 PO 4 45g / L, Na 2 CO 3 25g / L, mixed with distilled water; ②Coarse solution: CrO 3 160g / L, H 2 SO 4 (98%) 105mL / L, distilled water for liquid; ③sensitizing solution: SnCl 2 10g / L, HCl (36-38%) 50mL / L, mixed with distilled water; ④Activating solution: PdCl 2 0.6g / L, HCl (36-38%) 10mL / L, distilled water for solution; ⑤Reducing solution: HCHO (37-40%) 100mL / L, distilled water for solution; ⑥Copper plating solution: CuSO 4 • 5H 2 O 15 g / L, C 10 H 16 N 2 O 8 18g / L, C 4 O 6 H 4 KNa 14g / L, HCHO (37-40%) 10mL / L, NaH 2 PO 2 18 g / L, C 4 H 4 N 2 OS 14 g / L, K 4 Fe(CN) 6 0.3g / L, NaOH 14g / L, mixed with distilled water; ⑦passivation melt: CrO 3 80 g / L, NaCl 1.0 g / L, H 2 SO 4 25 ml / L, mixed with distilled water.

[0079] Implementation operation: ①Alkaline washing: soak the workpiece in an alkaline washing solution at a temperature of 50℃ for ...

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Abstract

The invention relates to the technical field of ceramic material surface modification, in particular to a method for plating the BaTiO3 ceramic surface with copper. The method sequentially comprises the following main steps of alkali washing, coarsening, sensitization, activation, reduction, copper plating, passivation and drying. Coarsening liquid is obtained by sequentially adding CrO3 and H2SO4into distilled water, copper plating liquid is obtained by sequentially adding CuSO4-5H2O, C10H16N2O8, C4O6H4KNa, C4H4N2OS, K4Fe(CN)6 and NaOH into distilled water, adjusting the pH value to be 12-13, heating the temperature to 50 DEG C, and adding HCHO and NaH2PO2, wherein per liter of the copper plating liquid is prepared from 15-20g of CuSO4-5H2O, 18-22g of C10H16N2O8, 14-16g of C4O6H4KNa, 14-20g of C4H4N2OS, 0.2-0.4g of K4Fe(CN)6 and 13.5-14.5g of NaOH, 10-12mL of HCHO and 18-25g of NaH2PO2. The method is stable and reliable, operation is easy, the cost is low, production is easy, and a copper plating layer prepared on the BaTiO3 ceramic surface through the method is compact, uniform and smooth, and is quite good in binding force with a matrix; the utilization rate of the plating liquid is also improved, and the economic cost caused by plating liquid waste is reduced; the surface coarsening effect is good, and the follow-up sensitization and activation effects are quite good.

Description

Technical field [0001] The invention relates to the technical field of ceramic surface modification, in particular to a BaTiO 3 The method of copper plating on ceramic surface. Background technique [0002] With the rapid development of the electronic information and automation fields, the application of dielectric ceramics has become more and more extensive, but in the state of polarization and conductivity, due to the electrical characteristics of dielectric materials and conductive materials such as electrical resistivity and conductivity, there are great Due to the uneven distribution of current on the surface, the conduction at the contact interface between the dielectric material and the conductor material is unstable, and even non-conduction is formed. At the same time, the dielectric ceramic and other electronic components cannot be welded. Therefore, this is a technical problem in the use of dielectric materials. [0003] BaTiO 3 Ceramics are often used as dielectric mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/18C23C22/24
CPCC23C18/1689C23C18/1893C23C18/405C23C22/24
Inventor 姚小飞田伟吕煜坤陈建杨巍
Owner XIAN TECH UNIV
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