Air-sensitive sensing film for detecting low-concentration nitric oxide and preparation method
A nitrogen oxide and gas sensing technology, applied in measurement devices, instruments, material analysis by electromagnetic means, etc., can solve the problems of high working temperature, low applicable value, low selectivity of SAW devices, etc. Good performance, improved sensitivity and detection quality, and improved electron transfer efficiency
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Embodiment 1
[0032] (1) Cleaning and drying the porous alumina substrate: the porous alumina substrate with a thickness of 300 μm, a pore diameter of 0.5 μm, and a porosity of 25% was ultrasonically cleaned in absolute ethanol for 15 minutes, deionized water for 15 minutes, and then sent to vacuum Drying in the furnace, the drying temperature is 100°C, and the drying time is 30 minutes;
[0033] (2) Preparation of porous tungsten oxide film: rub the porous alumina substrate obtained in step (1) in calcium sulfate hemihydrate whiskers to make the whiskers adhere to the porous alumina, blow off excess adhered whiskers, and place In the vacuum chamber of the ultra-vacuum target magnetron sputtering equipment, the vacuum degree is 5.3×10 -4 Pa, using metal tungsten with a mass purity of 99.96% as the target material, argon with a mass purity of 99.999% as the working gas, the flow rate of argon gas at 24ml / min, and oxygen with a mass purity of 99.99% as the reaction gas, sputtering The workin...
Embodiment 2
[0036] (1) Cleaning and drying the porous alumina substrate: the porous alumina substrate with a thickness of 300 μm, a pore diameter of 0.5 μm, and a porosity of 25% was ultrasonically cleaned in absolute ethanol for 15 minutes, deionized water for 15 minutes, and then sent to vacuum Drying in the furnace, the drying temperature is 100°C, and the drying time is 30 minutes;
[0037] (2) Preparation of porous tungsten oxide film: rub the porous alumina substrate obtained in step (1) on calcium sulfate hemihydrate whiskers to make the whiskers adhere to the porous alumina, blow off excess adhered whiskers, and place The vacuum chamber of the ultra-vacuum target magnetron sputtering equipment, the vacuum degree is 1.0×10 -4 Pa, using metal tungsten with a mass purity of 99.97% as the target material, argon with a mass purity of 99.9995% as the working gas, argon flow rate of 24ml / min, and oxygen with a mass purity of 99.99% as the reaction gas, sputtering The working pressure is...
Embodiment 3
[0040] (1) Cleaning and drying the porous alumina substrate: the porous alumina substrate with a thickness of 200 μm, a pore diameter of 0.9 μm, and a porosity of 27% was ultrasonically cleaned in anhydrous ethanol for 20 minutes, deionized water for 15 minutes, and then sent to vacuum Drying in the furnace, the drying temperature is 100°C, and the drying time is 30 minutes;
[0041] (2) Preparation of porous tungsten oxide film: rub the porous alumina substrate obtained in step (1) in calcium sulfate hemihydrate whiskers to make the whiskers adhere to the porous alumina, blow off excess adhered whiskers, and place In the vacuum chamber of the ultra-vacuum target magnetron sputtering equipment, the vacuum degree is 1.5×10 -4 Pa, using metal tungsten with a mass purity of 99.97% as the target material, argon with a mass purity of 99.999% as the working gas, the flow rate of the argon gas at 24ml / min, and oxygen with a mass purity of 99.999% as the reaction gas, sputtering The ...
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