High-frequency high-speed flexible copper-clad plate and preparation method thereof

A flexible copper-clad laminate, high-speed technology, applied in the field of high-frequency high-speed flexible copper-clad laminate and its preparation, can solve the problems of poor heat resistance, poor dielectric constant stability, large loss, etc., achieve energy saving and environmental protection of the process, and improve product performance , the effect of improving efficiency

Inactive Publication Date: 2018-11-27
广州市东泓氟塑料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the dielectric constant of this kind of flexible copper clad laminate is low, it can be widely used in the fields of smart phones and aerospace equipment, but this kind of flexible copper clad laminate prepared by hot pressing of polymer insulating base film, adhesive and copper foil , the loss is too large, the heat resistance is poor, and the stability of the dielectric constant is poor

Method used

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  • High-frequency high-speed flexible copper-clad plate and preparation method thereof
  • High-frequency high-speed flexible copper-clad plate and preparation method thereof
  • High-frequency high-speed flexible copper-clad plate and preparation method thereof

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Effect test

Embodiment 1

[0025] (1) Preparation of surface-treated ceramic powder:

[0026] ① Mix 80 parts by mass of silicon dioxide, 15 parts by mass of aluminum oxide and 5 parts by mass of titanium dioxide to obtain ceramic powder, then add it into distilled water and stir evenly;

[0027] ② Add the silane coupling agent to the ceramic powder distilled water mixture and stir evenly; wherein the mass ratio of the silane coupling agent to the ceramic powder is 5:95;

[0028] ③ drying, crushing and sieving the above mixed solution to obtain surface-treated ceramic powder;

[0029] The particle size D90 of the obtained surface-treated ceramic powder is 2 microns, and the temperature coefficient of dielectric constant is +50ppm / °C.

[0030] (2) Preparation of modified polytetrafluoroethylene powder:

[0031] Using a ball grinding sand mill, 30 parts by mass of surface-treated ceramic powder and 70 parts by mass of dispersed polytetrafluoroethylene powder are uniformly mixed to obtain modified polytet...

Embodiment 2

[0039] (1) Preparation of surface-treated ceramic powder:

[0040] ① Mix 80 parts by mass of silicon dioxide, 18 parts by mass of aluminum oxide and 2 parts by mass of titanium dioxide to obtain ceramic powder, then add it into distilled water and stir evenly;

[0041] ② Add the silane coupling agent to the ceramic powder distilled water mixture and stir evenly; wherein the mass ratio of the silane coupling agent to the ceramic powder is 5:95;

[0042] ③ drying, crushing and sieving the above mixed solution to obtain surface-treated ceramic powder;

[0043] The particle size D90 of the obtained surface-treated ceramic powder is 2 microns, and the temperature coefficient of dielectric constant is +80ppm / °C.

[0044] (2) Preparation of modified polytetrafluoroethylene powder:

[0045] Using a ball grinding sand mill, 10 parts by mass of surface-treated ceramic powder and 90 parts by mass of dispersed polytetrafluoroethylene powder are uniformly mixed to obtain modified polytet...

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Abstract

The invention discloses a high-frequency high-speed flexible copper-clad plate and a preparation method thereof. The high-frequency high-speed flexible copper-clad plate comprises a polymer insulatingbase material and a copper foil; wherein the polymer insulating base material comprises modified dispersed polytetrafluoroethylene, and the thickness ranges from 0.01mm to 0.075mm; the thickness of the copper foil is 2-9 microns; the modified dispersed polytetrafluoroethylene comprises a ceramic material and dispersed polytetrafluoroethylene, wherein the mass ratio of the ceramic material to thedispersed polytetrafluoroethylene is (10-30):(90-70). The preparation method of the high-frequency high-speed flexible copper-clad plate comprises the steps of surface treatment of the ceramic powder,modification of the polytetrafluoroethylene powder, and preparation the high-frequency high-speed flexible copper-clad plate. The method is simple in process, energy-saving and environment-friendly,low in dielectric loss and capable of greatly reducing the thickness and roughness of the copper foil.

Description

technical field [0001] The invention belongs to the field of electronic circuits, and in particular relates to a high-frequency and high-speed flexible copper clad laminate and a preparation method thereof. Background technique [0002] In the prior art, there is a high-frequency and high-speed flexible copper-clad laminate as follows, which includes a polymer insulating base film, a polymer adhesive layer and a metal foil. The preparation method is to first irradiate the polymer insulating base film, and then use The cured resin adhesive is covered on the polymer insulating base film, then pressed with the metal foil, and cured at high temperature to obtain a high-frequency and high-speed flexible copper clad laminate. Although the dielectric constant of this kind of flexible copper clad laminate is low, it can be widely used in the fields of smart phones and aerospace equipment, but this kind of flexible copper clad laminate prepared by hot pressing of polymer insulating b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/02C08K3/36C08K3/22C08K9/06C23C14/34C23C14/20
CPCC08K3/22C08K3/36C08K9/06C08K2003/2227C08K2003/2241C23C14/205C23C14/34H05K1/0353H05K3/022H05K2201/015C08L27/18
Inventor 吴东建高绍兵
Owner 广州市东泓氟塑料股份有限公司
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