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Compound process of extruded composite film and without adhesive

An adhesive-free, composite process technology, applied in applications, household appliances, and other household appliances, can solve the problems of reduced bonding effect, solvent residue, and easy wrinkles on film rolls, etc., to reduce coating adhesives steps, increase viscosity and affinity, and avoid chemical residue effects

Inactive Publication Date: 2018-12-25
ZHEJIANG CHENGDE PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the composite film containing adhesive often has solvent residues, which is harmful to human health, and the film roll is prone to wrinkles and unevenness. If the composite film process with adhesive is compounded, the solvent ratio is improper, which will make the bond The effect is reduced, the strength is reduced, and the quality of the composite film is destroyed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: Preparation of PET / PE composite film by non-adhesive composite process

[0029] The preparation steps of the present embodiment PET / PE composite film are as follows:

[0030] Weigh raw materials according to the following mass fractions: 20% polyethylene, 21% polyethylene terephthalate, 2% plasticizer, 0.5% plastic additives, 16% polyol, 10% tackifying resin, 3% honey , 4% carbon black, 6% glycerin, 1.5% sodium chloride, 10% tin oxide powder, wherein the polyol is selected from xylitol, the tackifying resin is selected from rosin, the particle size of carbon black is 10nm, and the particle size of tin oxide is 30nm , wherein the bottom film material is polyethylene (PE), and the upper film material is polyethylene terephthalate (PET).

[0031] After weighing the raw materials, firstly dry the carbon black at 50°C completely, then blend it with tin oxide powder and ball mill it for 20 minutes at a ball milling speed of 300r / min. Carry out ultrasonic emuls...

Embodiment 2

[0032] Embodiment 2: Preparation of PP / PE composite film by non-adhesive composite process

[0033] The preparation steps of the PP / PE composite film of this embodiment are as follows:

[0034] Weigh raw materials according to the following mass fractions: 26% polyethylene, 21% polypropylene, 2% plasticizer, 0.5% plastic additives, 16% polyol, 10% tackifying resin, 3% honey, 4% carbon black, 6% glycerin, 1.5% sodium chloride, 10% tin oxide powder, wherein the polyol is selected from sorbitol, the tackifying resin is selected from rosin, the particle size of carbon black is 20nm, the particle size of tin oxide is 40nm, and the bottom film material is selected from poly Ethylene (PE), and polypropylene (PP) is selected as the upper film material.

[0035]After weighing the raw materials, firstly dry the carbon black at 50°C completely, then blend it with tin oxide powder and ball mill it for 20 minutes at a ball milling speed of 280r / min. Carry out ultrasonic emulsification, a...

Embodiment 3

[0036] Embodiment 3: Preparation of PE / PA composite film by non-adhesive composite process

[0037] The preparation steps of the present embodiment PE / PA composite film are as follows:

[0038] Weigh raw materials according to the following mass fraction: 25% polyamide resin, 20% polyethylene, 1% plasticizer, 1% plastic additive, 10% polyol, 15% tackifying resin, 5% honey, 5% carbon black , 10% glycerin, 2% sodium chloride, and 6% tin oxide powder, wherein the polyol is selected from butanediol, the tackifying resin is selected from terpene resin, the particle size of carbon black is 20nm, and the particle size of tin oxide is 50nm. Polyamide resin (PA) is selected as the membrane material, and polyethylene (PE) is selected as the upper membrane material.

[0039] After weighing the raw materials, firstly dry the carbon black at 50°C completely, then blend with tin oxide powder and ball mill for 30 minutes, the ball milling speed is 300r / min, after the ball milling is complet...

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PUM

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Abstract

The invention discloses a compound process of an extruded composite film and without an adhesive. The compound process without the adhesive comprises the following steps of feeding, plastifying, homogenizing, extruding, blowing and expanding, heating, extrusion compounding, and cooling winding. The surface tension of a film in the heating step is 50 dynes / cm. The adhesive is not used in the extrusion compounding step. According to the compound process of the extruded composite film and without the adhesive, film wrinkles and bumps caused by the use of the adhesive can be avoided. Due to the fact that no adhesive is used in the compound preparation process, adhesive residue does not occur in the composite film. Intensity is high, rigidity is high, and hygienic standard can be met. Added tinoxide has certain infrared shielding effect. The bottom film material and the upper film material are pasted tightly, and are not liable to delaminate.

Description

technical field [0001] The invention relates to the technical field of composite film preparation, in particular to an adhesive-free composite process for extruding a composite film. Background technique [0002] The composite film can be used in various packaging bags. The preparation methods include dry compounding, wet compounding, extrusion compounding, hot-melt compounding, and co-extrusion compounding. Extrusion compounding is the use of hot-melt resins such as PE, EVA, EAA, PET, PA, PP, etc., are melted and plasticized by a plastic extruder, extruded on a substrate through a T-shaped die, and laminated with another substrate at the same time, and then cooled to form a composite film. way. In practice, extrusion coating is often classified as extrusion compounding. Extrusion coating is a process in which hot-melt resin is continuously and uniformly extruded, and directly cooled and wound into a composite film on a substrate. [0003] In actual production, the process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29D7/01C08L67/02C08L23/06C08L23/12C08L93/04C08L77/00C08K13/02C08K3/04C08K5/053C08K3/22C08J5/18
CPCB29D7/01C08J5/18C08J2323/06C08J2323/12C08J2367/02C08J2377/00C08J2423/06C08J2423/12C08J2467/02C08J2493/04C08K3/04C08K5/053C08K13/02C08K2003/2231
Inventor 王道宝冯志伟方贵兵
Owner ZHEJIANG CHENGDE PACKAGING
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