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A kind of polymer resin and its application in high frequency circuit board

A polymer, polyphenylene ether resin technology, applied in synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems of low glass transition temperature, high brittleness, high thermal expansion coefficient, and achieve vitrification. The effect of high transition temperature, meeting the requirements of toughness and low thermal expansion coefficient

Active Publication Date: 2020-04-14
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the vinyl structure selected by the resin has the following problems: 1. For the allyl group, due to the conjugation of its free radical intermediate, it does not have the activity of free radical curing; 2. For the acryloyl and methacryloyl groups, due to this The two vinyl active groups contain a certain polar carbonyl chemical structure, which will cause the dielectric constant and dielectric loss of the prepared substrate to increase; 3. For isobutenyl and vinyl, although they do not contain polar chemical structures, isobutylene Radical and vinyl groups need to initiate polymerization under the condition of an initiator, the cured product has low crosslinking density, low glass transition temperature, and high thermal expansion coefficient, and the polymerization is initiated by a peroxide radical initiator, which will cause the dielectric constant of the substrate and Increased dielectric loss
However, the substrate prepared by vinylbenzyl ether modified poly(p-hydroxystyrene-styrene) polymer resin has high crosslinking density and high brittleness, which cannot meet the toughness requirements of copper clad laminates. Improvement of brittleness of cured poly(p-hydroxystyrene-styrene) polymer resin modified by benzyl ether

Method used

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  • A kind of polymer resin and its application in high frequency circuit board
  • A kind of polymer resin and its application in high frequency circuit board
  • A kind of polymer resin and its application in high frequency circuit board

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0092] Synthesis of Vinylbenzyl Ether Modified Poly(p-Hydroxystyryl-styrene) Polymer SY-1:

[0093] Dissolve S-1 containing 1 mol of phenolic hydroxyl group in ethanol solvent, stir until it is completely dissolved, heat up to 50°C, and blow nitrogen gas for 30 minutes; add 1.2 mol of sodium methoxide and react for 1 hour; add 1.2 mol of vinylbenzyl chloride , reacted for 8 hours; after the reaction, the product was precipitated from ethanol, added toluene for dissolution, and washed 1 or 2 times; then dropped into ethanol to precipitate, and the precipitated product was dissolved in toluene to obtain vinyl benzyl ether modified poly(p- Hydroxystyryl-styrene) polymer SY-1, ready for use.

preparation example 2

[0095] Synthesis of vinylbenzyl ether modified poly(p-hydroxystyrene-styrene) polymer SY-2:

[0096] Dissolve CST15 containing 1 mol of phenolic hydroxyl group in ethanol solvent, stir until it is completely dissolved, heat up to 50°C, and blow nitrogen gas for 30 minutes; add 1.2 mol of sodium methoxide, and react for 1 hour; add 1.2 mol of vinylbenzyl chloride, and react 8 hours; after the reaction, the product was precipitated from ethanol, dissolved in toluene, washed once or twice with water; then dropped into ethanol to precipitate, and the precipitated product was dissolved in toluene to obtain vinyl benzyl ether modified poly(p-hydroxyphenyl Vinyl-styrene) polymer SY-2, ready for use.

preparation example 3

[0098] Synthesis of Vinylbenzyl Ether Modified Poly(p-Hydroxystyryl-styrene) Polymer SY-3:

[0099] Dissolve CST50 containing 1 mol of phenolic hydroxyl group in ethanol solvent, mechanically stir until it is completely dissolved, heat up to 50°C, and pass nitrogen gas for 30 minutes; add 1.2 mol of sodium methoxide, and react for 1 hour; add 1.2 mol of vinylbenzyl chloride, and react 8 hours; after the reaction, the product was precipitated from ethanol, dissolved in toluene, washed once or twice with water; then dropped into ethanol to precipitate, and the precipitated product was dissolved in toluene to obtain vinyl benzyl ether modified poly(p-hydroxyphenyl Vinyl-styrene) polymer SY-3, ready for use.

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Abstract

The present invention relates to a vinyl benzyl ether-modified poly(p-hydroxystyryl-styrene) polymer resin composition, comprising: (1) a vinyl benzyl ether-modified poly(p-hydroxystyryl-styrene) polymer resin; and (2) a vinyl-modified polyphenyl ether resin. The present invention further relates to a prepreg comprising the resin composition and the use thereof in a high-frequency circuit board. A substrate prepared by using the resin composition not only has comprehensive properties such as a high glass transition temperature, a low dielectric constant, a low dielectric loss and a low thermal expansion coefficient, but also has a small "十"-shaped falling trace area produced under the action of a drop-hammer impact load, and good toughness, and can thus meet the toughness requirements for copper-clad plates.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a resin composition and its application in high-frequency circuit boards, in particular to a vinyl benzyl ether modified poly(p-hydroxystyrene-styrene) polymer Resins and their applications in high frequency circuit boards. Background technique [0002] In recent years, with the rapid development of wireless communication technology and electronic products, electronic circuits have entered the stage of high-speed information processing and high-frequency signal transmission; however, when the frequency is greater than 300MHz, or even above GHz, the electrical properties of the substrate will be seriously affected. The characteristics of electronic circuits put forward higher requirements on the performance of substrates. [0003] In terms of dielectric constant performance, in high-frequency circuits, the transmission rate of the signal is related to the dielectric...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L25/18C08L71/12C08K7/14C08K3/36C08F8/00C08F212/04C08F212/08B32B17/04B32B17/12B32B15/20B32B15/14
CPCB32B5/26B32B7/08B32B15/14B32B15/20B32B33/00B32B37/06B32B37/10B32B38/08B32B2260/023B32B2260/046B32B2262/101C08F8/00C08L25/18C08L71/126C08L2203/20C08K7/14C08K3/36C08F212/04B32B17/02B32B17/06B32B27/04B32B27/18B32B27/30C08F212/08C08L71/12
Inventor 曾宪平陈广兵徐浩晟关迟记
Owner GUANGDONG SHENGYI SCI TECH
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