Preparation method of copper-tungsten alloy

A copper-tungsten alloy and copper-clad tungsten technology, applied in the field of copper-tungsten alloy preparation, can solve problems such as contact surface failure, and achieve the effects of easy operation, large size and high tungsten content

Inactive Publication Date: 2018-12-28
靖江市海源新材料科技有限公司
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Problems solved by technology

[0002] The tungsten copper electrical contact material is a false alloy composed of high melting point, high hardness tungsten and high electrical conductivity and high thermal conductivity copper; It is developing towards higher voltage and larger capacity; the traditional high-voltage tungsten-copper electrical contact material, under th

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[0011] In order to make the purpose of the invention, technical solutions and beneficial technical effects of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments;

[0012] A method for preparing a copper-tungsten alloy, characterized in that: comprising the following steps;

[0013] Step 1. Prepare tungsten powder with cobalt deposited on the surface: the content of cobalt is 0.55%-1.11%, and the balance is tungsten; the average particle size of the tungsten is 2-6um; and the maximum particle size is ≤20 μm, and the minimum particle size is ≥0.1 μm; 49.5kg of tungsten powder, add cobalt acetate solution containing 0.5kg of cobalt to it, mix well, dry, the drying temperature is <150°C, the drying time is 14-16 hours, the obtained powder is passed through a 250-mesh standard sieve, and then 900-1050°C, 1-3 hours for reduction in hydrogen flow, after reduction, pass through a 250-mesh sieve, and t...

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Abstract

The invention discloses a preparation method of a copper-tungsten alloy. The preparation method comprises the following steps that step 1, tungsten powder with the surface deposited with cobalt is prepared, specifically, the content of cobalt is 0.55%-1.11%, and the balance is tungsten; step 2, a copper ammonia complex is prepared; step 3, tungsten copper powder with the surface deposited with copper is prepared; step 4, forming is performed; and step 5, infiltration and cleaning are performed. The preparation method of the copper-tungsten alloy sets the weight ratio of tungsten to copper to nickel to be 100:(5-6):(0.55-1.1), the average particle size of tungsten is 2-6[mu]m, the maximum particle size is less than or equal to 20[mu]m, and the minimum particle size is greater than or equalto 0.1[mu]m. Cobalt is taken from a cobalt acetate solution, and the copper ammonia complex is prepared by dissolving copper powder by pure nitric acid with the concentration of 60%-65%. The preparation method is simple, the process is simple, and the operation is easy. The tungsten-copper material obtained by the method has stable performance and high electric arc erosion resistance, and tungstenis high in content and large in size and has a thin wall.

Description

technical field [0001] The invention relates to the field of copper-tungsten alloys, in particular to a method for preparing copper-tungsten alloys with high tungsten content, good arc resistance, large size and thin-walled parts. Background technique [0002] The tungsten copper electrical contact material is a false alloy composed of high melting point, high hardness tungsten and high electrical conductivity and high thermal conductivity copper; It is developing towards higher voltage and larger capacity; the traditional high-voltage tungsten-copper electrical contact material, under the action of high voltage and high current, arc ablation will cause severe corrosion resistance on the contact surface and cause premature failure, which can no longer meet the requirements. demand; therefore, it is necessary to find a preparation method that can significantly improve the performance of tungsten-copper electrical contact materials. Contents of the invention [0003] The ob...

Claims

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Application Information

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IPC IPC(8): B22F1/02B22F9/22C22C27/04C22C1/04B22F3/02B22F3/10
CPCC22C1/045C22C27/04B22F3/02B22F3/10B22F9/22B22F1/17
Inventor 宋鋆胡登伟
Owner 靖江市海源新材料科技有限公司
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