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Organosilicon polymerization curing agent, and applications and application method thereof

A polymerization curing, silicone technology, applied in the direction of radioactive purification, nuclear engineering, etc., can solve the problems of long curing time, low modulus, limited types, etc., achieve good aging resistance and biodegradation resistance, good radiation stability, The effect of low construction cost

Inactive Publication Date: 2019-01-01
HENAN ACADEMY OF SCI CHEM RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In thermosetting polymerization curing, the epoxy resin curing method has relatively high facility construction costs and operating costs (raw materials), equipment and raw materials mainly rely on imports, strict formula requirements, poor radiation stability, and some curing agents are toxic (such as fatty amines) ), more brittle, often need to add plasticizers and other problems
The polyester (unsaturated polyester) curing method also has defects such as low modulus, insufficient rigidity, poor aging resistance, easy deformation of the product, long curing time, and peculiar smell.
It can be seen that the types of polymer materials used for polymer curing treatment in the prior art are relatively limited, and there is no polymer curing agent that meets the technical requirements in all aspects.

Method used

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  • Organosilicon polymerization curing agent, and applications and application method thereof
  • Organosilicon polymerization curing agent, and applications and application method thereof
  • Organosilicon polymerization curing agent, and applications and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Radioactive waste resin (particle size: 0.3-1.5mm) 40wt%, viscosity 1000cp epoxy-containing dimethyl silicone oil 57wt%, polyetheramine MA340 (Wuxi Akeli Technology Co., Ltd.) 1.5wt%, DPM-300.05wt %, aluminum hydroxide 1.45wt%, the above materials were mixed and stirred evenly at room temperature, and left to stand for 3 days, and the performance of the solidified body was tested according to the standards or methods in Table 1, and all of them could meet or exceed the index requirements.

Embodiment 2

[0042]Radioactive waste resin (0.3 ~ 1.5mm in particle size) 50wt%, viscosity 1500cp methyl trifluoropropyl silicone oil containing epoxy group 43.9%, modified fatty amine 1522B (Wuxi Huilong Electronic Materials Co., Ltd.) 3wt%, liquid imidazole 0.1wt%, magnesium hydroxide 3wt%, the above materials were mixed and stirred evenly at room temperature, and left to stand for 3 days, and the performance of the solidified body was tested according to the standards or methods in Table 1, all of which could meet or exceed the index requirements.

Embodiment 3

[0044] Radioactive salt block (0.3-1.5mm particle size) 60wt%, viscosity 1000cp methyl phenyl silicone oil containing epoxy group 37wt%, polyetheramine MA240 (Wuxi Akeli Technology Co., Ltd.) 1.99wt%, DMP- 300.01wt%, magnesium hydroxide 1wt%, the above materials were mixed and stirred evenly at room temperature, left to stand for 3 days, and the performance of the solidified body was tested according to the standards or methods in Table 1, all of which could meet or exceed the index requirements.

[0045] Table 1 Solid detection standards and requirements

[0046]

[0047]

[0048]

[0049] It can be seen from the above examples that the present invention provides a silicone polymerization curing agent, which contains 37-57 parts of epoxy silicone oil, 1-5 parts of organic amine curing agent, and 0.01-0.1 part of curing accelerator. When the organosilicon polymerization curing agent provided by the present invention is in use, the epoxy group in the epoxy silicone oil...

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Abstract

The invention provides an organosilicon polymerization curing agent. The organosilicon polymerization curing agent comprises 37 to 57 parts of epoxy silicone oil, 1 to 5 parts of an organic amine curing agent, and 0.01 to 0.1 part of a curing accelerator. In applications of the organosilicon polymerization curing agent, epoxy groups in epoxy silicone oil are reacted with the organic amine curing agent in the presence of the curing accelerator, and ring opening crosslinking curing is carried out so as to obtain a polymer cured body, and coating of radioactive solid waste is realized. Accordingto the applications, after curing of the radioactive solid waste with the organosilicon polymerization curing agent, an obtained cured product is excellent in radiation stability, toughness, aging resistance, and biodegradation resistance, possesses certain rigidity, and is relatively high in modulus; and product deformation is not easily caused.

Description

technical field [0001] The invention relates to the technical field of polymer curing agents, in particular to a silicone polymer curing agent and its application and usage method. Background technique [0002] Ion exchange resins are required to be used in the operation of reactor primary loop cooling system, secondary loop condensate purification system, spent fuel pool water purification system, and wastewater purification system. It is called radioactive waste resin, or "waste resin" for short. Although waste resin accounts for a small share of the total volume of radioactive waste, its radioactive activity accounts for the vast majority of the total activity of nuclear power plant waste. Moreover, after pyrolysis, radiolysis, and biodegradation, waste resin will produce flammable and explosive gases such as hydrogen, ammonia, and methane, and the degradation products of waste resin are corrosive to equipment and storage containers. In order to avoid harm to the health...

Claims

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Application Information

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IPC IPC(8): C08L83/06C08K3/22C08G59/50G21F9/30
CPCC08K3/22C08G59/5006C08K2003/2224C08K2003/2227C08L2201/06G21F9/307C08L83/06
Inventor 郭利兵杨霞李国防赵燕
Owner HENAN ACADEMY OF SCI CHEM RES INST CO LTD
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