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Highly dielectric film, usages thereof, and manufacturing method therefor

A dielectric and thin-film technology, applied in the field of high-dielectric thin films, can solve problems such as no relevant records, no research on dielectric properties, no relevant suggestions, etc., and achieve the effect of easy operation

Active Publication Date: 2019-01-11
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, among these pressure-sensitive adhesive compositions, only peroxide curing systems are disclosed, and there is no addition-type curing system that has a fast curing speed, substantially no shrinkage during molding processing, and is easy to set desired curing conditions. research
In addition, no research has been conducted on the dielectric properties, and there are neither relevant records nor relevant suggestions.
Therefore, with respect to the addition-curable fluoroalkyl-containing organopolysiloxane with excellent transparency and high relative dielectric constant, the pressure-sensitive adhesive laminate film containing it, and the pressure-sensitive adhesive laminate film composed of of display devices, so far no reports
[0007] On the other hand, an optically transparent silicone-based pressure-sensitive adhesive film is disclosed in Japanese Patent Application Publication No. 2014-522436 (Patent Document 9) or Japanese Patent Application Publication No. 2013-512326 (Patent Document 10). and the production of display devices such as touch panels using them, but there is still room for improvement in the performance of these silicone-based pressure-sensitive adhesive films

Method used

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  • Highly dielectric film, usages thereof, and manufacturing method therefor
  • Highly dielectric film, usages thereof, and manufacturing method therefor
  • Highly dielectric film, usages thereof, and manufacturing method therefor

Examples

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Embodiment

[0184] Hereinafter, although an Example is given and this invention is demonstrated, this invention is not limited to these Examples. In the examples shown below, the following compounds and base films were used. In addition, in Table 1 and Table 2, the value of each component shows each mass %.

[0185] Component (a1): Both ends vinyl dimethylsiloxy end-capped, 3,3,3-trifluoropropylmethylsiloxane-dimethylsiloxane copolymer (siloxane polymerization degree: 228, the number of 3,3,3-trifluoropropylmethylsiloxane units: 182, the number of dimethylsiloxane units: 46, the content of the fluoroalkyl group: 39 mol %). The viscosity measured by an E-type viscometer at 25 degrees is about 10,000 mPa·s.

[0186] ■Component (a2): Vinyldimethylsiloxy terminated at both ends, 3,3,3-trifluoropropylmethylsiloxane polymer (siloxane polymerization degree: 182, fluoroalkyl content : 49 mol%). The viscosity measured by an E-type viscometer at 25 degrees is about 8,500 mPa·s.

[0187] Compon...

Embodiment 3

[0228] A curable organopolysiloxane composition containing 99.43 parts by mass of the component (a3), 0.49 parts by mass of the component (B1), and 0.080 parts by mass of the component (C1) was used. In addition, the amount of silicon-bonded hydrogen atom (Si-H) in this composition is about 0.5 mol per 1 mol of vinyl groups. Production was carried out under the same conditions as in Examples 2 and 4 above, and the measured compressibility and compressive residual strain of the film were 20% and 0.6%, respectively. In addition, the shear storage elastic modulus measured under the same conditions as above was 8.0×10 3 Pa. In addition, the relative permittivity value of this cured product was 6 at room temperature and a frequency of 1 kHz.

[0229] The above-mentioned liquid curable organopolysiloxane composition was coated and sandwiched between polyethersulfone resin films with a thickness of 50 μm, and rolled by two stainless steel rollers with a gap of 175 μm. It was cured...

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Abstract

The purpose of the present invention is to provide a highly dielectric film that is formed of a fluoroalkyl-group-containing organopolysiloxane cured product and that is characterized in that the dielectric constant thereof is high, and that the film is substantially flat and uniform in the width direction of the film, as well as to provide usages thereof and a manufacturing method therefor. Withthe highly dielectric film formed of the fluoroalkyl-group-containing organopolysiloxane cured product, in the width direction of the film, the difference between the thickness at an end and the thickness at the center is 5.0% or less, and the thickness at the film center falls within a range of 50-1000 [mu]m. Such a film may be provided with a primer layer and a planarization layer, and the filmmay be obtained by means of rolling and may also be obtained by means of curing performed between separators provided with separation layers.

Description

technical field [0001] The present invention relates to a high dielectric film of cured organopolysiloxane containing a fluoroalkyl group, its use and production method. The high dielectric film is characterized in that it has a high dielectric constant, and the width of the film is The direction is substantially flat and uniform. Background technique [0002] Compared with acrylic or rubber-based pressure-sensitive adhesive compositions, polysiloxane-based pressure-sensitive adhesive compositions are superior in electrical insulation, heat resistance, cold resistance, and adhesion to various adherends. Excellent, so it is used for heat-resistant adhesive tape, electrical insulation adhesive tape, heat-sealing adhesive tape, plating masking tape, etc. These polysiloxane-based pressure-sensitive adhesive compositions are classified into addition reaction-curable types, condensation reaction-curable types, and peroxide-curable types according to their curing mechanism. The a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B32B27/00H01B3/46C08J7/043
CPCB32B27/00C08J5/18H01B3/46H01B19/04H05B33/22C08J7/043C08J7/042C08G77/08C08G77/12C08G77/20C08G77/24B32B27/08B32B27/283B32B27/286B32B2250/03B32B2250/40B32B2307/204B32B2457/208C08G77/70C08J2383/08C08J2483/08G06F3/041H01B19/00
Inventor 福井弘正富亨津田武明
Owner DOW TORAY CO LTD