Thermosetting resin composition, prepreg, laminated board and printed circuit board

A resin composition and thermosetting technology, used in the field of dielectric layers for laminates and laminates, can solve the problems of poor interfacial bonding, increased water absorption of composite materials, and few applications, and achieve excellent dielectric constant and improve interfacial bonding. Effect

Active Publication Date: 2019-01-18
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many studies on hollow glass spheres in composite materials, but there are not many specific applications. One of the important reasons is that the interface bonding between hollow glass spheres and

Method used

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  • Thermosetting resin composition, prepreg, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0061] As a method for preparing the resin composition of the present disclosure, it can be prepared by known methods such as compounding, stirring, mixing fillers, thermosetting resins, curing agents and curing accelerators, and various additives.

[0062] The present disclosure may also provide a prepreg comprising a reinforcing material and the thermosetting resin composition as described in any one of the above adhering thereon after being impregnated and dried.

[0063] Examples of reinforcing materials may include fiberglass cloth. In the following description, glass fiber cloth reinforcing material and glass fiber cloth can be used interchangeably.

[0064] Specifically, the thermosetting resin composition is formulated into a glue solution by mechanical stirring, emulsification or ball mill dispersion, and then the glue solution is used to impregnate the glass fiber cloth and dried to obtain a prepreg. A laminate can be produced by hot pressing the prepreg and metal f...

Embodiment

[0083] The technical solutions of the present disclosure will be further described below through specific embodiments. In the following examples and comparative examples, percentages, ratios and the like are by weight unless otherwise specified.

[0084] Each code used in embodiment and comparative example and composition thereof are as follows:

[0085] Thermosetting resin A (polyphenylene ether resin): SABIC (USA), product name MX9000.

[0086] Thermosetting resin B (brominated epoxy resin): Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530.

[0087] o-cresol novolak resin: Kolon (Korea), product name KPH-2004, hydroxyl equivalent 105

[0088] Hollow glass sphere powder: 3M (USA), product name S60 (30 microns), IM16K (20 microns), IM16K (10 microns)

[0089] Reinforcement material (glass fiber cloth): Japan Huber, 7628

[0090] Copper foil: Suzhou Futian, loz

[0091] Median particle size: When the cumulative degree distribution curve based on...

preparation Embodiment 1

[0093] Preparation of hollow glass spheres coated with silica (i.e. hollow glass spheres with a silica coating)

[0094]Add 100 g of hollow glass sphere powder into 400 ml of ethylene glycol, and ultrasonically disperse for 30 min to obtain a suspension. The suspension was added into a three-necked flask, heated to 80°C with a water bath and kept at 80°C. After that, slowly dropwise add 0.1mol / L of Na 2 SiO 3 aqueous solution, and with 1 wt% H 2 SO 4 The pH of the aqueous solution was adjusted to 10.5, and then kept at this temperature for 3 hours. Filter, wash, and dry to obtain hollow glass spheres coated with silica.

[0095] By adjusting 0.1mol / L Na 2 SiO 3 The dripping amount of the aqueous solution is used to control the coating amount.

[0096] Preparation of aluminum oxide-coated hollow glass spheres (i.e., hollow glass spheres with an aluminum oxide coating)

[0097] The method of coating the aluminum oxide of the hollow glass sphere:

[0098] Add 100 g of h...

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Abstract

The disclosure provides a thermosetting resin composition, a prepreg, a laminated board and a printed circuit board. The thermosetting resin composition comprises thermosetting resin, a curing agent and a hollow glass sphere with an inorganic coating layer, wherein the inorganic coating layer is selected from at least one type of silicon dioxide coating layer and aluminium oxide coating layer; andthe weight of the inorganic coating layer occupies for 0.1 to 20% of the total weight of the hollow glass sphere with the inorganic coating layer. According to the disclosure, the thermosetting resincomposition and a dielectric layer for the laminated board, which is prepared from the thermosetting resin composition, can be provided, wherein interface bonding between the hollow glass sphere andthe resin can be improved, and the entire laminated board has an excellent dielectric constant.

Description

technical field [0001] The present disclosure relates to the technical field of laminated boards, in particular to a dielectric layer for laminated boards applied to printed circuit boards, laminated boards and applications thereof. Background technique [0002] The development of modern high-frequency communication places higher and higher requirements on the electrical properties of materials, especially low-dielectric-constant laminates for high-frequency applications such as copper-clad laminates containing composite materials made of thermosetting resin compositions. Generally speaking, the effective dielectric constant of the composite material can be approximated as the weighted sum of the dielectric constant of each component and its volume fraction occupied in the composite material. Since most of the volume of the hollow glass sphere is air (the dielectric constant of the hollow glass sphere is between 1.2 and 2.0), the hollow glass sphere has a relatively low diel...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L63/00C08L61/06C08K9/10C08K7/28C08J5/24B32B15/08B32B27/18B32B27/20
CPCB32B15/08B32B27/18B32B27/20B32B2250/40B32B2270/00B32B2307/204B32B2457/08C08J5/24C08J2363/00C08J2371/12C08J2461/06C08J2463/00C08J2471/12C08K7/28C08K9/10
Inventor 柴颂刚刘潜发郝良鹏杜翠鸣
Owner GUANGDONG SHENGYI SCI TECH
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