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Anaerobic adhesive for photovoltaic resin board cutting and preparation method and application thereof

A technology of anaerobic adhesive and resin board, applied in the field of anaerobic adhesive, can solve the problem of easily increasing the loss rate of crystalline silicon wafers, and achieve the effects of good curing strength, fast degumming speed and stable storage performance.

Inactive Publication Date: 2019-01-18
江苏乐美新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] A kind of epoxy resin adhesive for photovoltaic cutting and its preparation method disclosed in the Chinese patent whose application publication number is "CN107090263A", the epoxy resin adhesive for cutting disclosed in the above-mentioned patent has the advantages of fast curing speed at room temperature; but when cutting The final crystalline silicon wafer is relatively thin, and it is easy to increase the loss rate of the crystalline silicon wafer during the degumming process with the adhesive

Method used

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  • Anaerobic adhesive for photovoltaic resin board cutting and preparation method and application thereof
  • Anaerobic adhesive for photovoltaic resin board cutting and preparation method and application thereof
  • Anaerobic adhesive for photovoltaic resin board cutting and preparation method and application thereof

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Embodiment

[0032] An anaerobic adhesive for cutting photovoltaic resin panels, including anaerobic adhesive and a surface accelerator, wherein the anaerobic adhesive includes vinyl resin, silicone polyether acrylate, epoxy resin, hydroxypropyl methacrylate, polyester Ester resin, methacrylic acid, bornyl methacrylate, tert-butyl peroxybenzoate, o-benzoylsulfonimide, acetylphenylhydrazine, silane coupling agent and polymerization inhibitor.

[0033] Surface accelerators include copper acetate and ethanol.

[0034] Each material composition is the same among embodiment 1-embodiment 5, but material content is different, see shown in table 1 below for details, and following material components are by weight.

[0035] Table 1:

[0036]

[0037]

[0038]

Embodiment 6

[0040] A preparation method of anaerobic adhesive for photovoltaic resin board cutting, comprising the following steps:

[0041] Step 1: Preparation of anaerobic glue;

[0042] Step 1.1: Mix 30-40 parts of vinyl resin, 5-10 parts of silicone polyether acrylate, 10-20 parts of epoxy resin, 15-20 parts of hydroxyethyl methacrylate, 10-15 parts of polyester resin, 1-5 parts of methacrylic acid and 10-15 parts of bornyl methacrylate are mixed to form mixture A;

[0043] Step 1.2: Heat the mixture A prepared in step 1.1 to 50-100°C, and gradually add 0.001-1 part of polymerization inhibitor to it during the heating process, and stir at high speed for 2-4 hours;

[0044] Step 1.3: Add 2-5 parts of tert-butyl peroxybenzoate, 0.1-2 parts of o-benzoylsulfonimide, 0.1-2 parts of acetylphenylhydrazine, and 0.01-2 parts of silane to the mixture prepared in step 1.2 The coupling agent forms mixture B;

[0045] Step 1.4: Stir the mixture B prepared in step 1.3 evenly and then evacuate to...

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Abstract

The invention relates to an anaerobic adhesive for photovoltaic resin board cutting and a preparation method and application thereof. The anaerobic adhesive comprises anaerobic adhesive liquid and a surface accelerant. According to the invention, vinyl resin in the anaerobic adhesive is used for improving the strength of the anaerobic adhesive after curing; epoxy resin and polyester resin are usedfor improving the adhesive strength of the adhesive; after active components are uniformly mixed, the viscosity of an anaerobic agent is improved so as to reduce the fluidity; then, tert-butyl peroxybenzoate, N,N-dimethylaniline and o-benzoylsulfonimide, which are taken as an initiator and an accelerant, are added in the anaerobic adhesive, and a polymerization inhibitor and a coupling agent areused as optimizers; the anaerobic adhesive for photovoltaic resin board cutting, prepared by the preparation method provided by the invention, has the advantages of high curing strength, high adhesive-removing speed and the like; next, the anaerobic adhesive is stable in storage performance, and after coating and curing, a gap is not formed between the anaerobic adhesive and a photovoltaic resin board or the anaerobic adhesive does not break away from the photovoltaic resin board; and in addition, after removing the adhesive by soaking in acidic liquid, the anaerobic adhesive is not adhered tothe photovoltaic resin board.

Description

technical field [0001] The invention relates to an anaerobic adhesive, in particular to an anaerobic adhesive for cutting photovoltaic resin panels and its preparation method and application. Background technique [0002] With the development of science and technology, the photovoltaic industry has gradually replaced some of the functions of petrochemical energy; the raw materials used most in the photovoltaic industry are polycrystalline silicon wafers and monocrystalline silicon wafers; and the cutting and production of monocrystalline silicon wafers and polycrystalline The most important link. During the cutting process of crystal silicon wafers, adhesives are needed to fix the crystal holder, glass and ingot, so adhesives are indispensable auxiliary materials in the cutting process of vigilant silicon wafers. [0003] A kind of epoxy resin adhesive for photovoltaic cutting and its preparation method disclosed in the Chinese patent whose application publication number is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/10C09J171/00C09J163/00C09J167/00C09J11/04
CPCC09J163/10C08L2205/035C09J11/04C08L71/00C08L63/00C08L67/00C08K5/5419C08K5/54
Inventor 刘欢欢韦祖睦袁光明
Owner 江苏乐美新材料科技有限公司
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