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A high-strength room-temperature fast-curing two-component epoxy structural adhesive

A structural adhesive and rapid curing technology, which is applied in the direction of epoxy resin adhesive, adhesive, adhesive additive, etc., can solve the problems of voids and bulges, insufficient reaction between curing agent and resin, and delamination of composite sandwich panels, etc. Problems, to achieve the effect of reducing the probability of voids and delamination, good wetting effect and bonding ability, and ensuring the strength requirements

Active Publication Date: 2020-11-06
SYST EQUIP CO LTD OF THE 28TH RES INST LI YANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. Poor heat resistance: The glass transition temperature Tg of the polyurethane adhesive is low. After a long period of sunlight exposure, the adhesive will have side reactions, and voids are prone to appear at the interface of the adhesive layer of the composite sandwich panel. and bulges, which seriously affect the overall mechanical properties of the composite sandwich panel
[0006] 2. Low structural strength: The shear strength of polyurethane adhesives generally does not exceed 12MPa. For sandwich panels with special core materials, such as honeycomb sandwich panels, when the external load is large, it is easy to cause cohesive failure at the adhesive layer. Leading to failure and delamination of composite sandwich panels
[0010] 3. Insufficient curing: In practical applications, the use of many epoxy adhesives has not reached the ideal curing parameters; at the same time, the curing agent and the resin do not fully react, and the smell is strong
[0011] 4. Sagging problem: For sandwich panels with special core materials, such as honeycomb sandwich panels, when the viscosity of the adhesive is low, when the glue is applied to the upper and lower skins, the glue will flow into the honeycomb gap, resulting in gaps in the joint. Glue, which affects the strength; when the viscosity of the adhesive is too high, it takes a lot of effort to apply the glue, and the binding force to the core material such as foam is poor

Method used

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  • A high-strength room-temperature fast-curing two-component epoxy structural adhesive
  • A high-strength room-temperature fast-curing two-component epoxy structural adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Preparation of component A: 100 parts by weight of bisphenol A epoxy resin NPEL-128, 2 parts by weight of epoxy coupling agent KH561, 10 parts by weight of 120 mesh barium sulfate whiskers, and stir evenly at room temperature;

[0041] Preparation of component B: 60 parts by weight of modified polyamide curing agent V140, 10 parts by weight of modified fatty amine curing agent JH5473, 20 parts by weight of modified fatty amine curing agent B-X, 15 parts by weight of liquid nitrile rubber, bisamino 3 parts by weight of joint agent KH791, 10 parts by weight of 120 mesh barium sulfate whiskers, stirred evenly at room temperature;

[0042] Stir components A and B evenly according to the weight ratio of 100:50 to obtain a light brown adhesive.

Embodiment 2

[0044] Preparation of component A: 110 parts by weight of bisphenol A epoxy resin E-331, 2.5 parts by weight of epoxy coupling agent KH562, 20 parts by weight of 1000 mesh silicon powder, and stir evenly at room temperature;

[0045] Preparation of component B: 50 parts by weight of modified polyamide curing agent Aek3140a, 15 parts by weight of modified fatty amine curing agent JH547315 parts by weight, 10 parts by weight of modified fatty amine curing agent V-I70, 11 parts by weight of liquid nitrile rubber, diamino 2 parts by weight of coupling agent KH602, 20 parts by weight of 1200 mesh silica powder, stirred evenly at room temperature;

[0046] Stir components A and B evenly according to the weight ratio of 100:45 to obtain a light brown adhesive.

Embodiment 3

[0048] Preparation of component A: 120 parts by weight of bisphenol A epoxy resin NPEL-128, 4 parts by weight of epoxy coupling agent KBM403, 30 parts by weight of 5000 mesh silicon powder, and stir evenly at room temperature;

[0049] Preparation of component B: 80 parts by weight of modified polyamide curing agent V140, 25 parts by weight of modified fatty amine curing agent JH5432s, 15 parts by weight of modified fatty amine curing agent B-X, 15 parts by weight of modified fatty amine curing agent V-I70 Part, 25 parts by weight of liquid nitrile rubber, 4 parts by weight of double amino coupling agent KBM603, 30 parts by weight of 5000 mesh silicon micropowder, stir at room temperature;

[0050] Stir components A and B evenly according to the weight ratio of 100:40 to obtain a light brown adhesive.

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Abstract

The invention discloses a high-strength room-temperature-fast-curing bicomponent epoxy-structured adhesive. A component A comprises epoxy resin, a couplant A and fillers, and a component B comprises amodified polyamide curing agent with high imidazoline content, two kinds of different types of modified aliphatic amine curing agents B and C, a toughener, a couplant B and fillers. According to theadhesive, problems in heat resistance, speed increasing and toughening of room-temperature curing of adhesives are solved; the adhesive has better wetting effect and binding power on a substrate, andthe probability of cavity and delaminating is lowered; through adding appropriate fillers, controlling the operating time, mechanical strength and sagging resistance of the adhesive and optimally combining all ingredients of the adhesive, the strength requirements of the adhesive are guaranteed. The adhesive disclosed by the invention can be applied to bonding of composite materials such as metallic materials and non-metallic materials, such as polyurethane foam plates, aluminum honeycomb panels and aluminum plates and production of laminated sandwich plates of military and civilian compartments.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a high-strength room-temperature rapid-curing two-component epoxy structural adhesive for composite sandwich panels. Background technique [0002] In the field of military and civilian boxes, especially in the field of military shelters, the composite sandwich panels used need to have excellent mechanical properties (sandwich panel impact resistance test, sandwich panel roller peeling test) and environmental adaptability (sandwich panel high and low temperature test), and the composite sandwich panel can be industrially produced in large quantities. Therefore, the requirements for room temperature curing structural adhesives used in composite sandwich panels are relatively strict, and the adhesives need to have the characteristics of easy construction, short curing cycle, high strength, and good toughness. [0003] There are two types of room temperature curing str...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04C09J11/06C08G59/60
CPCC08G59/60C08K2201/014C08L2205/06C09J11/04C09J11/06C09J11/08C09J163/00C08L9/02C08K3/36
Inventor 魏国升胡迪田阳周磊
Owner SYST EQUIP CO LTD OF THE 28TH RES INST LI YANG
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