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Copper coated grid-type graphene and preparation method thereof

A technology of graphene and graphene nanosheets, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem that the coating is not dense enough and uniform, it is difficult to disperse and mix evenly, and it is difficult to disperse and mix evenly. problems, to achieve the effect of convenient preparation method, non-porous mechanical bonding strength and good electrical conductivity

Active Publication Date: 2019-01-25
黑龙江省墨砾新型材料有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a copper-plated grid-type graphene, which solves the problem that the existing graphene has poor solubility and is difficult to achieve uniform dispersion and mixing during the copper-plating process on the surface.
[0005] Another object of the present invention is to provide a copper-plated grid-type graphene preparation method, which solves the problem that the existing graphene has poor solubility in metal copper, and the mixing of copper powder and graphene materials is very easy to produce agglomeration, which is difficult To achieve uniform dispersion and mixing, the coating metal has many pores, the coating dispersion is not dense and uniform, and the mechanical bonding effect is poor

Method used

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  • Copper coated grid-type graphene and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Step 1: Prepare grid-like graphene nanosheets,

[0040] Take non-sensitization and non-activation treatment to graphene surface: first adopt NaOH solution (mass fraction is 10%) boiling alkali washing 20min to the graphene nanosheet of original material, the solution after alkali washing is cooled to room temperature and filtered, and pass Rinse with distilled water until neutral; then use HNO for graphene nanosheets 3 The solution (mass fraction is 1%) was boiled and pickled for 1min, the solution after the pickling was cooled to room temperature and filtered, and rinsed with distilled water to neutrality, and the graphene surface impurities and roughening treatment were removed by alkali washing and pickling.

[0041] Put the transferred graphene nanosheets into the transmission electron microscope rod and move into the vacuum punching chamber. After reaching high vacuum, under 200KV voltage, adjust the current density to 1×10 5 A / m 2 , finish punching holes on gra...

Embodiment 2

[0049] Step 1: Prepare grid-like graphene nanosheets,

[0050] Take non-sensitization and non-activation treatment to graphene surface: first adopt NaOH solution (mass fraction is 15%) boiling alkali washing 23min to the graphene nanosheet of original material, the solution after alkali washing is cooled to room temperature and filtered, and pass Rinse with distilled water until neutral; then use HNO for graphene nanosheets 3 The solution (mass fraction is 3%) is boiled and pickled for 1.5min, the solution after the pickling is cooled to room temperature and filtered, and rinsed with distilled water to neutrality, and the surface impurities and roughening treatment of graphene are removed by alkali washing and pickling .

[0051] Put the transferred graphene nanosheets into the transmission electron microscope rod and move into the vacuum punching chamber. After reaching a high vacuum, under the voltage of 230KV, adjust the current density to 2×10 5 A / m 2 , finish punching...

Embodiment 3

[0059] Step 1: Prepare grid-like graphene nanosheets,

[0060] Take non-sensitization and non-activation treatment to graphene surface: first adopt NaOH solution (mass fraction is 20%) boiling alkali washing 25min to the graphene nanosheet of raw material, the solution after alkali washing is cooled to room temperature and filtered, and pass Rinse with distilled water until neutral; then use HNO for graphene nanosheets 3 The solution (mass fraction is 5%) was boiled and pickled for 2min, and the solution after the pickling was cooled to room temperature with cold water and filtered, and washed to neutrality by distilled water, and the surface impurities and roughening treatment of graphene were removed by alkali washing and pickling.

[0061] Put the transferred graphene nanosheets into the transmission electron microscope rod and move into the vacuum punching chamber. After reaching high vacuum, under 250KV voltage, adjust the current density to 3×10 5 A / m 2 , finish punch...

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Abstract

The invention discloses copper coated grid-type graphene, and further discloses a preparation method of the copper coated grid-type graphene. The preparation method comprises the steps that 1, the surfaces of graphene nanosheets are desensitized and inactivated, and the graphene nanosheets are punched in a vacuum punching bin of a transmission electron microscope, so that grids are formed; 2, trisodium citrate, sodium tetraborate and EDTA are added into a copper sulfate solution, and the pH value is adjusted to obtain a main salt mixed solution; 3, a catalyst, a reducing agent and a buffer agent are added into the main salt mixed solution, and the pH value is adjusted to obtain a mixed plating solution; 4, the grid-type graphene nanosheets are placed in the mixed plating solution, then, anadditive is added, the pH value is controlled to be 10-15, magnetic stirring, ultrasonic dispersion and filtration are conducted, and the grid-type graphene nanosheets are taken out; the grid-type graphene nanosheets are washed with deionized water to be neutral, drying is conducted, and the copper coated grid-type graphene is prepared. By means of the method, the plating effect and the electrical conductivity are obviously improved.

Description

technical field [0001] The invention belongs to the technical field of copper plating on the surface of graphene, relates to a copper-plated grid-type graphene, and also relates to a method for preparing the copper-plated grid-type graphene. Background technique [0002] Electroless copper plating is a commonly used process in circuit board manufacturing, usually also called copper sinking or porosity (PTH), which is an autocatalytic redox reaction. At the same time, the position of electroless copper plating technology in the surface treatment industry continues to rise, and it is more and more widely used in various industries such as electronics industry, machinery industry, and aerospace. So far, many methods have been used to metallize the surface of materials, such as hydrothermal method, ultrasonic assisted impregnation method, microwave method, chemical deposition and other methods, which can introduce Pd, Pt, Fe and Sn on graphene nanosheets. Nanoparticles, the lat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/18
CPCC23C18/1865C23C18/40
Inventor 屈银虎梅超刘晓妮左文婧周思君袁建才张学硕何炫
Owner 黑龙江省墨砾新型材料有限责任公司
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