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Low-polarity resin and preparation method and application thereof

A low-polarity, resin-based technology, applied in ether preparation, carboxylate preparation, and ester reaction preparation of ether, etc., can solve problems such as gap and limited degree

Active Publication Date: 2019-02-05
ZHENGZHOU UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this method has a certain effect on improving the dielectric properties of the resin, the degree is limited, and there is still a certain distance from the application.

Method used

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  • Low-polarity resin and preparation method and application thereof
  • Low-polarity resin and preparation method and application thereof
  • Low-polarity resin and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0073] In this embodiment, the low polarity resin is prepared by the following method, comprising the following steps:

[0074] (1) Add 188g of acetone into the three-necked reaction flask, add 228g of bisphenol A into the reaction flask, stir and dissolve, then add 106g of sodium carbonate. 153g of allyl chloride solution was slowly added dropwise, then the temperature was raised and the reaction was stopped for 4 hours. Filter to remove most of the solvent, wash, and then remove the residual solvent and water to obtain bisphenol A diallyl ether.

[0075] (2) Put 134g of bisphenol A diallyl ether prepared in step (1) into a reaction bottle, heat for rearrangement reaction, cool down and discharge to obtain a brown viscous liquid that is diallyl bisphenol A.

[0076](3) Add 402g of n-butanol in the reaction flask, put 154g of diallyl bisphenol A prepared in step (2) into the reaction flask, stir and dissolve, then add 138g of potassium carbonate. Slowly add 152.5 g of m-viny...

Embodiment 2

[0080] In this embodiment, the low polarity resin is prepared by the following method, comprising the following steps:

[0081] (1) Add 300g of n-butanol into the three-necked reaction flask, add 114g of novolac resin into the reaction flask, stir and dissolve, then add 56g of potassium hydroxide. Slowly add 153g bromopropene solution dropwise, then stop the reaction after heating up for 4 hours. Filter, wash, and remove residual solvent and water to obtain allyl etherified phenolic resin.

[0082] (2) Put 141 g of allyl etherified phenolic resin prepared in step (1) into a reaction bottle, heat for rearrangement reaction, cool down and discharge to obtain brown viscous liquid, namely allylphenolic resin.

[0083] (3) Add 402g n-butanol in the reaction flask, put the 141g allyl phenolic resin prepared by step (2) into the reaction flask, stir and dissolve, then add 102g triethylamine. Slowly add 80g of methacrylic anhydride solution dropwise, then heat up and react for 6 hou...

Embodiment 3

[0086] In this embodiment, the low polarity resin is prepared by the following method, comprising the following steps:

[0087] (1) Add 250g toluene in the three-necked reaction flask, add 118g o-cresol phenolic resin in the reaction flask, after stirring and dissolving, add 100g sodium hydroxide aqueous solution (concentration 40%), then add 1g tetrabutylammonium bromide. Slowly add 153g of allyl chloride solution dropwise, then heat up and react for 4 hours, then stop the reaction, wash, and then remove the solvent to obtain allyl etherified o-cresol novolak resin.

[0088] (2) 159g of allyl etherified o-cresol phenolic resin prepared in step (1) was put into a reaction flask, heated for rearrangement reaction for 4 hours, cooled and discharged to obtain dark brown semi-solid as allyl o-cresol Phenolic phenolic resin.

[0089] (3) 300g of toluene was added in the reaction flask, and 159g of allyl o-cresol phenolic resin prepared in step (2) was put into the reaction flask, ...

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Abstract

The invention provides a low-polarity resin and a preparation method and application thereof. The low-polarity resin is of a structure shown by a formula I, and is prepared through three steps of reactions, namely, allyl etherification, rearrangement and end blocking on phenolic hydroxyl through a hydroxyl end-blocking reagent containing a unsaturated double-bond group on the basis of phenolic compounds or resin. The molecular formula of the resin does not contain a polar hydroxide radical, the molecular structure is stable, the polarity is low, and reaction activity is high; in the application and processing processes, no polar hydroxide radical is generated, thus the influence of a secondary hydroxide radical on the property of a product of the resin is avoided, and the dielectric property is improved; the resin comprises the high-activity unsaturated group, the high-temperature resistance property is significantly improved through a crosslinked curing reaction with other resin, andthus the dielectric constant and the dielectric loss of the resin are significantly decreased; and the resin is applied into preparation of laminated boards coated with metal foil, the dielectric constant and the dielectric loss of the laminated boards coated with the metal foil are decreased advantageously, the high high-temperature resistance property is achieved, and thus the laminated boards coated with the metal foil have the good comprehensive property.

Description

technical field [0001] The invention belongs to the technical field of thermosetting resins, and relates to a low-polarity resin and its preparation method and application. Background technique [0002] High-performance thermosetting resins are widely used in aerospace, rail transit, electrical insulation, and microelectronic packaging due to their excellent heat resistance, flame retardancy, weather resistance, electrical insulation, good mechanical properties, and dimensional stability. Resin matrix of composite materials, high temperature resistant insulating materials and adhesives in other fields. Commonly used high-performance thermosetting resins include epoxy resin, phenolic resin, bismaleimide resin, etc., but the brittleness of the above-mentioned resins leads to insufficient impact resistance of the material, and the high polarity of the resin molecular structure leads to high dielectric constant and loss, etc. Weaknesses, which limit its popularization and appli...

Claims

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Application Information

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IPC IPC(8): C07C43/215C07C41/16C07C67/08C07C69/533C08L25/18C09J125/18
CPCC09J125/18C07C43/215C07C69/533C08L25/18C07C41/16C07C67/08
Inventor 刘锋苏民社
Owner ZHENGZHOU UNIV
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