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A kind of preparation method of low thermal expansion coefficient, low moisture permeability uv-heat dual curing adhesive

A low thermal expansion coefficient, low moisture permeability technology, applied in the direction of adhesives, adhesive types, non-polymer adhesive additives, etc., can solve the problems of unclean removal of organic matter, gray-black appearance of spherical particles, etc., to achieve excellent waterproof Effects of vapor properties, low thermal expansion coefficient, and low moisture permeability

Active Publication Date: 2020-11-03
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Vieth uses pre-synthesized eucryptite powder as raw material, and after introducing additives and surfactants, it prepares spherical β-LiAlSiO4 particles with an average particle size of 40-60 μm and a purity of >90%. Clean, coated on the outside of spherical β-LiAlSiO4 particles after calcination, resulting in gray-black appearance of the spherical particles

Method used

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  • A kind of preparation method of low thermal expansion coefficient, low moisture permeability uv-heat dual curing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 12 parts of dicyclopentadiene phenol type epoxy resin, 12.4 parts of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate, 3 parts of triaryl hexafluorosulfonium phosphate, Vicbase Add 0.55 parts of TC3632, 0.05 parts of 9,10-dibutoxyanthracene and 5 parts of 1,2,8,9-diepoxy-4-vinylcyclohexene into the stirring tank, under the condition of -0.1 MPa Stir for 0.5h, add 40 parts of spherical β-eucryptite particles, 25 parts of spherical silica and 1 part of additives, control the temperature not higher than 35°C, revolution 20 r / min, and autorotation 1000 r / min , disperse for 1 hour, add 1 part of fumed silica, stir evenly, control the temperature not higher than 35°C, under the conditions of revolution 20 r / min, rotation 1000 r / min, stir for 1 hour and then discharge, that is, low thermal expansion coefficient, Low moisture permeability UV-heat dual cure adhesive.

[0047] The spherical β-eucryptite particles are prepared according to the following method:

[0048]...

Embodiment 2

[0061] 7 parts of o-cresol novolac epoxy resin, 10.3 parts of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate, 2.4 parts of triaryl hexafluorosulfonium phosphate, Vicbase TC3630 Add 0.6 parts, 0.04 parts of isopropylthioxanthone and 8 parts of 3-ethyl-3-oxetanemethanol into the stirring tank, stir for 0.5h under the pressure of -0.1 MPa, add spherical β- 30 parts of eucryptite particles, 40 parts of spherical silica and 1.2 parts of additives, controlled temperature not higher than 35°C, revolution 20 r / min, rotation 1000 r / min, disperse for 0.5-1h, add gas phase dioxide 0.46 parts of silicon, stir evenly, control the temperature not higher than 35°C, under the conditions of revolution 20 r / min, rotation 1000 r / min, stir for 1 hour and then discharge the material, that is, low thermal expansion coefficient and low moisture permeability UV-thermal dual curing adhesive.

[0062] The spherical β-eucryptite particles are prepared according to the following method:

[0...

Embodiment 3

[0076] 4 parts of anthracene-type epoxy resin, 6.25 parts of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 2.7 parts of diaryl hexafluoroantimonate iodonium salt, 0.3 parts of Vicbase TC3633, Add 0.05 parts of isopropylthioxanthone and 5 parts of 1,2,3,4-diepoxybutane into the stirred tank, stir for 0.5h under the pressure of -0.1 MPa, and add spherical β-euphane 40 parts of stone particles, 40 parts of spherical silica and 1.5 parts of additives, control the temperature not higher than 35 ° C, revolution 20 r / min, rotation 1000 r / min, disperse for 0.5-1h, add fumed silica 0.2 Stir evenly, control the temperature not higher than 35°C, under the conditions of revolution 20r / min, rotation 1000 r / min, stir for 1h and then discharge, then obtain low thermal expansion coefficient, low moisture permeability UV-heat dual-curing adhesive.

[0077] The spherical β-eucryptite particles are prepared according to the following method:

[0078] 1) Pre-synthesis of β-eucryptit...

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Abstract

The invention relates to a preparation method for a low thermal expansion coefficient and low moisture-penetrability UV-thermal dual curing adhesive. The adhesive is prepared from the following raw materials in parts by weight: 10-20 parts of epoxy resin, 65-80 parts of a filler composition, 5-10 parts of a reactive diluent, 1-3 parts of a cationic photoinitiator, 0.5-2 parts of a cationic thermalinitiator, 0.05-0.5 part of a photosensitizer, 0.5-2 parts of a thixotropic agent and 1-3 parts of an additive. The filler composition contains spherical particles with a negative expansion coefficient. In the preparation method, by adding the spherical particles with the negative expansion coefficient in colloid, a cured material based on the adhesive of the invention has the thermal expansion coefficient of less than 18 ppm / K, high glass transition temperature, low moisture penetrability, excellent adhesion force and high peel strength, can be widely applied to adhesion and sealing of optical devices, optical elements and microelectronic devices in the optical communication industry and has a promising application prospect.

Description

technical field [0001] The invention relates to a preparation method of a low thermal expansion coefficient and low moisture permeability UV-heat dual curing adhesive. In particular, it relates to an adhesive used for bonding and sealing optical devices, optical components and microelectronic devices in the optical communication industry. Background technique [0002] Optical fiber communication is one of the important ways of modern information transmission. It has the advantages of large capacity, long relay distance, good confidentiality, no electromagnetic interference and copper saving. Optical fiber adhesive is an adhesive used for bonding and fixing between optical fiber cables and connectors. It generally needs to meet the following points: (1) Excellent adhesion and durability; (2) Less than 20ppm / The thermal expansion coefficient of K can expand and shrink little in a wide temperature range, and the joints will not be degummed or peeled off due to temperature cha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C01B33/26
CPCC01B33/26C01P2004/61C01P2006/32C01P2006/60C09J11/04C09J163/00C08K3/36C08K3/346C08K7/18
Inventor 魏芳芳李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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