Low-temperature halogen-free lead-free soldering paste and preparation method thereof
A halogen-free lead-free solder paste and low-temperature technology, applied in the field of low-temperature halogen-free lead-free solder paste and its preparation, can solve the problems of lowering insulation resistance, lowering reliability, corroding substrates, etc., improving wettability and prolonging storage life. and service life, environmentally friendly effect
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[0024] Example 1
[0025] Flux preparation raw materials include: polymerized rosin 24g, hydrogenated rosin 20g, modified hydrogenated castor oil 6g, adipic acid 4g, salicylic acid amide 1g, triisoethanolamine 1.3g, polyethylene glycol 22g, ethylene glycol hexyl ether 20g , 1-Aminopropyl-3-methylimidazole nitrate 1.7g.
[0026] Preparation method: mix 24g of polymerized rosin, 20g of hydrogenated rosin, 42g of polyethylene glycol and 20g of ethylene glycol hexyl ether and dissolve them at a temperature of 150°C, then add 6g of modified hydrogenated castor oil, and add hexamethylene after it is completely dissolved 4g acid to prepare mixture A;
[0027] Cool mixture A. When it is cooled to 80°C, add salicylic acid amide 1g, triisoethanolamine 1.3g and 1-aminopropyl-3-methylimidazole nitrate 1.7g, and then continue to cool to room temperature to get help Flux
[0028] Mix 12 g of flux and 88 g of Sn42Bi58 solder alloy powder under vacuum and stir uniformly to obtain the solder paste o...
Example Embodiment
[0029] Example 2
[0030] The raw materials for flux preparation include: polymerized rosin 40g, hydrogenated rosin 15g, modified hydrogenated castor oil 5g, salicylic acid 2g, triisoethanolamine 2.5g, diethylene glycol monobutyl ether 20g, ethylene glycol hexyl ether 13g, 1- Aminopropyl-3-methylimidazole nitrate 2.5g.
[0031] The preparation method of the flux in this embodiment is the same as that in embodiment 1, and will not be described in detail here.
[0032] Mix 11 g of flux and 89 g of Sn42Bi58 solder alloy powder under vacuum and stir uniformly to obtain the solder paste of this embodiment.
Example Embodiment
[0033] Example 3
[0034] Flux preparation raw materials include: polymerized rosin 20g, hydrogenated rosin 25g, modified hydrogenated castor oil 4g, salicylic acid amide 2g, is suberic acid 4g, diethylene glycol dibutyl ether 10g, polyethylene glycol 20g, ethylene dichloride Alcohol hexyl ether 11g, 1-aminoethyl-3-methylimidazole nitrate 4g.
[0035] The preparation method of the solder paste in this embodiment is the same as that in Embodiment 1, and will not be described in detail here.
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