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Low-temperature halogen-free lead-free soldering paste and preparation method thereof

A halogen-free lead-free solder paste and low-temperature technology, applied in the field of low-temperature halogen-free lead-free solder paste and its preparation, can solve the problems of lowering insulation resistance, lowering reliability, corroding substrates, etc., improving wettability and prolonging storage life. and service life, environmentally friendly effect

Active Publication Date: 2019-04-05
东莞市绿志岛金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the residual halide after soldering will undergo electron migration, which will reduce the insulation resistance, and even corrode the substrate, resulting in a decrease in product reliability. Therefore, halogen-free is another development trend following the lead-free process.

Method used

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  • Low-temperature halogen-free lead-free soldering paste and preparation method thereof
  • Low-temperature halogen-free lead-free soldering paste and preparation method thereof
  • Low-temperature halogen-free lead-free soldering paste and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Flux preparation raw materials include: polymerized rosin 24g, hydrogenated rosin 20g, modified hydrogenated castor oil 6g, adipic acid 4g, salicylic acid amide 1g, triisoethanolamine 1.3g, polyethylene glycol 22g, ethylene glycol hexyl ether 20g , 1-aminopropyl-3-methylimidazole nitrate 1.7g.

[0026] Preparation method: Mix 24g of polymerized rosin, 20g of hydrogenated rosin, 42g of polyethylene glycol and 20g of ethylene glycol hexyl ether to dissolve together at a temperature of 150°C, then add 6g of modified hydrogenated castor oil, and then add hexylene glycol after completely dissolving Acid 4g, prepared mixture A;

[0027] The mixture A was cooled, and when it was cooled to 80°C, 1g of salicylic acid amide, 1.3g of triisoethanolamine and 1.7g of 1-aminopropyl-3-methylimidazole nitrate were added, and then continued to cool to room temperature to obtain auxiliary flux;

[0028] Mix 12g of flux with 88g of Sn42Bi58 solder alloy powder and vacuum stir evenly to o...

Embodiment 2

[0030] Flux preparation raw materials include: polymerized rosin 40g, hydrogenated rosin 15g, modified hydrogenated castor oil 5g, salicylic acid 2g, triisoethanolamine 2.5g, diethylene glycol monobutyl ether 20g, ethylene glycol hexyl ether 13g, 1- Aminopropyl-3-methylimidazole nitrate 2.5g.

[0031] The preparation method of the flux in this embodiment is the same as that in Embodiment 1, and will not be described in detail here.

[0032] 11 g of flux and 89 g of Sn42Bi58 solder alloy powder were mixed and evenly stirred under vacuum to obtain the solder paste of this embodiment.

Embodiment 3

[0034] Flux preparation raw materials include: polymerized rosin 20g, hydrogenated rosin 25g, modified hydrogenated castor oil 4g, salicylic acid amide 2g, isosuberic acid 4g, diethylene glycol dibutyl ether 10g, polyethylene glycol 20g, ethylene glycol Alcohol hexyl ether 11g, 1-aminoethyl-3-methylimidazole nitrate 4g.

[0035] The preparation method of the solder paste in this embodiment is the same as that in Embodiment 1, and will not be described in detail here.

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Abstract

The invention provides low-temperature halogen-free lead-free soldering paste. The low-temperature halogen-free lead-free soldering paste includes a soldering flux and tin-based alloy powder, whereinthe soldering flux is prepared from the raw materials: 20%-40% of polymerized rosin, 15%-25% of hydrogenated rosin, 4%-6% of modified hydrogenated castor oil, 1%-5% of an active agent, 2%-4% of organic amine, 1%-4% of ionic liquid and an organic solvent. The ionic liquid is added into the low-temperature halogen-free lead-free soldering paste, the wettability of the soldering paste can be effectively improved, the wettability of the soldering paste is improved, the storage life and service life of the soldering paste are prolonged, and the soldering paste can be stored at room temperature for4 months and in refrigerator for 12 months; and in particular, production of black oxide in the soldering paste can be reduced, the paste is smooth and glossy, and solderability is good. The inventionfurther provides a preparation method of the low-temperature halogen-free lead-free soldering paste.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a low-temperature halogen-free lead-free solder paste and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT (Surface Mount Technology, referred to as SMT), mainly including solder powder and flux. Solder paste is mainly used for soldering electronic components such as PCB surface resistance, capacitors, and ICs in the SMT industry. At present, lead-free solder paste is a kind of solder paste that is widely used. Among various lead-free solder pastes, Sn / Ag / Cu alloy is the most widely accepted solder component in the industry, but its melting point is high and energy consumption Large, large thermal damage to heat-sensitive components, therefore, low-temperature lead-free solder is more and more widely used in the industry. At present, the low-temperature lead-free solder paste is easily oxidiz...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/363B23K35/40
CPCB23K35/3612B23K35/3613B23K35/362B23K35/40
Inventor 赖高平朱穗涛邓小成张建斌
Owner 东莞市绿志岛金属有限公司
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