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Raw material pretreatment method for high-quality aluminum nitride crystal growth

A technology of crystal growth and aluminum nitride, applied in the directions of crystal growth, single crystal growth, single crystal growth, etc., can solve the problem of low purity of AlN powder raw materials, and achieve the effect of improving gas phase transport capacity and reducing impurity content

Inactive Publication Date: 2019-04-05
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the problems that commercialized AlN powder raw materials have low purity, small particle size and the gap between raw material particles is not suitable for growing high-quality AlN crystals by PVT method, and provides a simple and efficient method for growing high-quality AlN crystals by PVT method Raw material pretreatment method

Method used

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  • Raw material pretreatment method for high-quality aluminum nitride crystal growth
  • Raw material pretreatment method for high-quality aluminum nitride crystal growth
  • Raw material pretreatment method for high-quality aluminum nitride crystal growth

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) First clean the firing crucible (boron nitride crucible, tungsten crucible or tantalum carbide crucible) and growth crucible (tungsten crucible or tantalum carbide crucible) to remove surface pollutants. It can be cleaned first with a heated acetone solution, followed by an ethanol solution.

[0033] (2) Put AlN powder raw materials with an average particle size of 2 μm in a sintered crucible, place the sintered crucible in an AlN crystal growth device, and seal the device. AlN crystal growth equipment is existing conventional equipment, such as figure 1 As shown, it includes intermediate frequency induction coil 4 , graphite insulation material 2 and infrared thermometer 1 , AlN powder raw material 6 is placed in sintering crucible 5 , and AlN crystal 3 is grown by intermediate frequency induction coil 4 heating.

[0034] (3) Use a vacuum system to evacuate the growth equipment, and the vacuum degree is not greater than 10 -3 Pa, then pass high-purity nitrogen (p...

Embodiment 2

[0041] The difference between this embodiment and embodiment 1 lies in steps (3), (4) and (6):

[0042] (3) In a nitrogen atmosphere of 0.6mbar, first raise the temperature to 1200°C at 8°C / min, hold for 2 hours, then raise the temperature to 1700°C at 5°C / min, hold for 6 hours, then slowly cool down to room temperature, and the cooling rate is about 100°C / h to obtain a white sintered body of AlN raw material;

[0043] (4) Place the sintered AlN raw material sintered body in a pulverizer to pulverize to obtain AlN powder particles with a particle size of about 0.5 mm;

[0044] (6) In a nitrogen atmosphere of 1.5mbar, firstly raise the temperature to 1800°C at 9°C / min, then raise the temperature to 2100°C at 5°C / min, keep it warm for 15h, and then slowly cool down to room temperature, and the cooling rate is 40°C / h The temperature was lowered to 1600°C, and then cooled to room temperature at 50°C / h to obtain a light yellow AlN high-purity polycrystalline raw material sintered ...

Embodiment 3

[0046] The difference between this embodiment and embodiment 1 lies in steps (2), (3), (4) and (6):

[0047] (2) placing the AlN powder raw material with an average particle size of 5 μm in a boron nitride crucible;

[0048] (3) In a nitrogen atmosphere of 0.7 mbar, first raise the temperature to 1200°C at 9°C / min, keep it for 1.5h, then raise the temperature to 1600°C at 3°C / min, keep it for 7h, then slowly cool down to room temperature, and the cooling rate is about at 50°C / h to obtain a white sintered body of AlN raw material;

[0049] (4) Put the sintered AlN raw material sintered body in a pulverizer to pulverize to obtain AlN powder particles with a particle size of about 0.8 mm;

[0050] (6) Under a nitrogen atmosphere of 1.2mbar, firstly raise the temperature to 1800°C at 8°C / min, then raise the temperature to 2050°C at 3.5°C / min, keep it warm for 20h, and then slowly cool down to room temperature, and the cooling rate is 50°C / h The temperature was lowered to 1800°C,...

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Abstract

The invention discloses a raw material pretreatment method for high-quality aluminum nitride crystal growth. The method includes the steps: (1) placing AlN powder raw materials into a burning crucible, placing the burning crucible into an AlN crystal growth device, and sealing the growth device; (2) leading high-purity nitrogen in the growth device after the growth device is vacuumized, sinteringmixture in the nitrogen atmosphere, and cooling the mixture to reach indoor temperature to obtain an AlN raw material sintering body; (3) crushing the sintering body into AlN powder particles; (4) placing the AlN powder particles into a growth crucible, placing the growth crucible into the AlN crystal growth device, and sealing the growth device; (5) leading high-purity nitrogen in the growth device after the growth device is vacuumized, sintering mixture in the nitrogen atmosphere, and cooling the mixture to reach indoor temperature to obtain a high-purity AlN polycrystalline material sintering body. According to the method, impurities in the AlN raw materials are effectively reduced, large gaps are present between AlN particles when the particle diameters of AlN raw materials are increased, gas-phase transfer capability of AlN is improved, an AlN sintering body with a uniform condensation polymerization function is acquired, and material requirements of high-quality AlN growth are met.

Description

technical field [0001] The invention relates to a raw material pretreatment method suitable for growing aluminum nitride (AlN) crystals by physical vapor transport (PVT). The method can obtain high-purity polycrystalline raw materials suitable for growing high-quality AlN crystals, and belongs to artificial crystal growth technology field. Background technique [0002] AlN crystal is a very important third-generation semiconductor material, with direct bandgap and ultra-wide bandgap (6.2eV), high thermal conductivity, high critical breakdown electric field, high carrier mobility, strong Therefore, AlN, as an important ultraviolet luminescent material, is widely used in the fields of ultraviolet / deep ultraviolet light-emitting diodes, ultraviolet laser diodes and ultraviolet detectors. Therefore, the research and application of AlN crystal materials has become the frontier and hotspot of global semiconductor research. [0003] At present, the physical vapor transport method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B23/00C30B29/40
CPCC30B23/00C30B29/403
Inventor 郝霄鹏王国栋张雷吴拥中邵永亮
Owner SHANDONG UNIV