Diamond wire saw and preparation method thereof

A diamond wire saw and diamond particle technology are applied in the field of diamond wire saw and its preparation, which can solve the problems of large diameter and low strength of diamond wire saw, and achieve the effects of eliminating friction process, improving strength and strong controllability.

Pending Publication Date: 2019-04-09
盛利维尔(常州)金属材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the defects of larger diameter and lower strength of the diamond wire saw in the prior art, the present invention provides a diamond wire saw and its preparation method, using tungsten

Method used

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  • Diamond wire saw and preparation method thereof
  • Diamond wire saw and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Such as figure 1 As shown, a diamond wire saw is composed of a wire saw core in the middle and a nickel metal layer on the surface. In this embodiment, the diamond wire saw core is a tungsten wire, and the content of tungsten is 99.95%; the surface is 3 μm in thickness. A nickel metal layer and diamond particles having an average particle diameter D50 of 7.5 μm.

[0037] Such as figure 2 As shown, a kind of diamond wire saw prepared by the present invention is processed by 28 times of continuous drawing, which specifically includes the following steps:

[0038] (1) The tungsten wire enters the sliding drawing processing mold through the traction tower pulley 1 for 22 passes of sliding drawing processing; the temperature of the heating box 2 and the mold box 5 are controlled separately, and the heating temperature of the heating box 2 is 350 ℃, the heating temperature of the mold box 5 is 250 ℃; the lubricant 6 is graphite emulsion S-0; the hardness of the traction to...

Embodiment 2

[0043] A diamond wire saw is composed of a wire saw core in the middle and a nickel metal layer on the surface. In this embodiment, the diamond wire saw core is a tungsten wire, and the content of tungsten is 99.9%; the surface is a nickel metal layer with a thickness of 1 μm. and diamond particles with an average particle diameter D50 of 4 μm.

[0044] A diamond wire saw prepared by the present invention is processed through 28 passes of continuous drawing, specifically comprising the following steps:

[0045] (1) The tungsten wire enters the sliding drawing processing mold through the traction tower pulley 1 for 22 passes of sliding drawing processing; the temperature of the heating box 2 and the mold box 5 are controlled separately, and the heating temperature of the heating box 2 is 200 ℃, the heating temperature of the mold box 5 is 170 ℃; the lubricant 6 is graphite emulsion S-0; the hardness of the traction tower pulley 1 is HRC72; the drawing speed is 30m / min;

[0046] ...

Embodiment 3

[0050] A diamond wire saw, which is composed of a wire saw core in the middle and a copper metal layer on the surface. In this embodiment, the diamond wire saw core is a tungsten wire, and the content of tungsten is 99.9%; the surface is a copper metal layer with a thickness of 10 μm and diamond particles with an average particle diameter D50 of 10 μm.

[0051] A diamond wire saw prepared by the present invention is processed through 28 passes of continuous drawing, specifically comprising the following steps:

[0052] (1) The tungsten wire enters the sliding drawing processing mold through the traction tower pulley 1 for 22 passes of sliding drawing processing; the temperature of the heating box 2 and the mold box 5 are controlled separately, and the heating temperature of the heating box 2 is 600 °C, the heating temperature of the mold box 5 is 500 °C; the lubricant 6 is graphite milk S-0; the hardness of the traction tower pulley 1 is HRC72; the drawing speed is 200m / min; ...

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Abstract

The invention belongs to the technical field of a cutting wire saw, specifically relates to a diamond wire saw and a preparation method thereof. In the diamond wire saw provided by the invention, theintermediate core is tungsten, the surface layer is covered with a metal plating layer or a resin layer, the surface of the metal plating layer or the resin layer is fused with diamond particles. Thepreparation method is as follows: a tungsten wire is combined and pulled by multi-pass sliding drawing and non-sliding drawing to obtain a tungsten wire with a diameter of 0.008-0.065mm; and then, thedrawn tungsten wire passes through an electrolyte containing diamond particles to obtain an electroplated diamond wire saw; or the above drawn core wire passes through a resin solution containing diamond particles to obtain a resin diamond wire saw after being cured. The diamond wire saw with the core body prepared by the invention has a diameter of 0.01-0.085mm and a strength greater than or equal to 4000 MPa, so the diamond wire saw can effectively improve the cutting quality and cutting efficiency in the application aspect of the cutting line.

Description

technical field [0001] The invention belongs to the technical field of cutting wire saws, and in particular relates to a diamond wire saw and a preparation method thereof. Background technique [0002] Due to the fixed abrasive grains on the surface of the diamond wire saw, long wire life and high cutting efficiency, the diamond wire saw is widely used in the cutting of semiconductor materials such as silicon crystals. [0003] With the development of competition in the photovoltaic industry, diamond wire saws are required to have a thinner diameter, higher strength, and higher toughness. However, the core body of the current diamond wire saw is made of carbon steel, and the strength and plasticity indicators can no longer meet the higher requirements. Therefore, it will be of great significance to find other materials as diamond wire core wires. [0004] Due to its excellent heat resistance and mechanical strength, tungsten wire is expected to be used as the inner core ma...

Claims

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Application Information

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IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/042B28D7/00
Inventor 蔡磊盛荣生朱建国李坤堂张建刚陈志嵩
Owner 盛利维尔(常州)金属材料有限公司
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